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  • Products

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      Cadence.AI

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        AI-driven digital twin supercomputer

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        Multi-block, multi-user SoC design platform

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        AI-driven Multiphysics analysis

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        AI-driven PCB Design

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        On-device AI IP

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        Analog and custom IC design

      • Spectre Simulation

        Analog and mixed-signal SoC verification

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        Synthesis and implementation for advanced nodes

      • Xcelium Logic Simulation

        IP and SoC design verification

      • Silicon Solutions

        Design IP and Compute IP, including Tensilica IP

      • Palladium and Protium

        Emulation and prototyping platforms

    • Products

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      • Allegro X Design Platform

        System and PCB design platform

      • Allegro X Adv Package Designer Platform

        IC packaging design and analysis platform

      • Sigrity X Platform

        Signal and power integrity analysis platform

      • AWR Design Environment Platform

        RF and microwave development platform

      • Cadence Reality Digital Twin Platform

        Data center design and management platform

      • Fidelity CFD Platform

        Computational fluid dynamics platform

      • MSC Software

        Advanced physics-based simulation

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Free Trials

Innovus Implementation System

Meet PPA and TAT requirements at advanced nodes

Read Datasheet Read ML White Paper
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Key Benefits

  • Massively parallel architecture for handling large designs and supporting multi-threading on multi-core workstations, as well as distributed processing over networks of computers
  • New GigaPlace solver-based placement technology, which is timing, power, and congestion driven with topology-, pin-access-, and color-aware understanding to provide optimal placement, wire length, utilization, and PPA results
  • Unique mixed-macro and standard-cell placement capability enabling automated macro locations for ever-increasingly complex floorplans with hundreds of macro cells
  • Advanced GigaOpt multi-threaded, layer-aware optimization engine, which is timing and power driven to reduce dynamic and leakage power
  • Additional advanced-node technologies, such as via pillars, power integrity-aware placement and optimization, clock skewing for power, continuous congestion monitoring, and optimized routers for handling self-aligned double patterning for better PPA
  • Mature hierarchy automation features for large Hierarchical designs like advanced block abstraction, automated partitioning and hierarchical timing closure, along with new floorplan synthesis capabilities
  • Innovative machine learning-driven capabilities through the whole implementation flow leading to best PPA results on challenging, high-performance designs
  • Part of the Cadence Safety Solution providing automated safety mechanism insertion and optimization

The Cadence® Innovus™ Implementation System is optimized for the most challenging designs, as well as the latest FinFET 16nm, 14nm, 7nm, 5nm, and 3nm process nodes, helping you get an earlier design start with a faster ramp-up. With unique new capabilities in placement, optimization, routing, and clocking, the Innovus system features an architecture that accounts for upstream and downstream steps and effects in the design flow. This architecture minimizes design iterations and provides the runtime boost you’ll need to get to market faster. Using the Innovus system, you’ll be equipped to build integrated, differentiated systems with less risk.

The Innovus system features a variety of key capabilities. Its massively parallel architecture can handle large designs and take advantage of multi-threading on multi-core workstations, as well as distributed processing over networks of computers.

 

Based on the well-established NanoRoute™ engine, next-generation slack and power-driven routing with track-aware timing optimization addresses signal integrity early on and improves post-route correlation. The Innovus system includes full-flow multi-objective technology, which makes concurrent electrical and physical optimization possible. It also shares a customizable flow via a common UI and user commands with synthesis and signoff tools. As a result, you can take advantage of robust reporting and visualization, improving your design efficiency and productivity across the whole digital flow.

With block sizes growing in both cell count and complexity, the number of macros that need to be positioned in the floorplan is exploding. The Innovus system offers mixed-macro and standard-cell placement, which enables macro locations to be automatically generated, reducing the time to create an optimal floorplan from days to hours.

The latest advances in machine learning computer science are very relevant for digital implementation flows. The Innovus system incorporates machine learning technology to deliver the best PPA for the most challenging, high-performance blocks. The designer has complete control over the machine learning training, to ensure it is customized for their specific design requirements.

Cadence’s Genus™ Synthesis Solution is tightly integrated with the Innovus system, which enables a seamless move from RTL synthesis to implementation. With shared placement and optimization technology from the GigaPlace™ and GigaOpt™ engines for Genus physical synthesis, this offers a big benefit for advanced-node design convergence.

As voltage decreases in the latest FinFET process nodes, IR and EM constraints become increasingly important. The Innovus system includes comprehensive power integrity-aware placement, optimization, clock tree, and routing features to ensure IR and EM violations are addressed during implementation without impacting final PPA.

Cadence’s Tempus™ Timing Signoff Solution, Quantus™ Extraction Solution, and Voltus™ IC Power Integrity Solution are integrated with the Innovus system. With this integration, you can accurately model parasitics, timing, signal, and power integrity effects at the early stage of physical implementation, and achieve faster convergence on these electrical metrics, resulting in more efficient design closure.

 

Innovus Implementation system
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TRAINING COURSES

Overcoming PPA and Productivity Challenges of New Age ICs with Mixed Placement Innovation
READ WHITE PAPER

Addressing Digital Implementation Challenges with Machine Learning

Better PPA With Innovus Mixed Placer Technology - GigaplaceXL

  • Related Products
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    • First Encounter Design Exploration and Prototyping
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    • Genus Synthesis Solution
  • Related Solutions
    • [Redirect] Mixed-Signal Implementation
Resource Library
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  • Genus / Innovus Safety Implementation Flow for Automotive Designs
  • Voltus/Innovus IR Aware Full Flow: Experience with IR Drop Aware Placement and Reinforce PG
  • GigaPlace Solver-Based Placement Technology In Innovus Implementation System
  • Pushing frequency, power and area with the iSpatial flow to achieve Design Excellence
  • Better PPA with Innovus Mixed Placer Technology – Gigaplace XL
  • Maximizing PPA on ARM’s Next-Generation High-Performance Processor Using the Latest Cadence Implementation and Signoff Tools/Flow
  • Samsung Foundry 14LPP: The Continual Thrust in FinFET Leadership
  • eInfochips Shortens Runtime on 300M Gate Count SoCs with Innovus Implementation System
  • In Sync with Innovus Technology: Learn how Genus and Innovus technologies are tightly correlated
  • Tackling 16nm Challenges for Arm Cortex-A72 Processor
  • Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results
  • Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies
  • Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
  • How to Achieve Optimal PPA and Up to 10X TAT Gain in Your Next Digital Design Implementation White Paper
  • GigaPlace Solver-Based Placement Technology In Innovus Implementation System
  • Better PPA with Innovus Mixed Placer Technology – Gigaplace XL
  • In Sync with Innovus Technology: Learn how Genus and Innovus technologies are tightly correlated
  • Tackling 16nm Challenges for Arm Cortex-A72 Processor
  • Maximizing PPA on ARM’s Next-Generation High-Performance Processor Using the Latest Cadence Implementation and Signoff Tools/Flow
  • eInfochips Shortens Runtime on 300M Gate Count SoCs with Innovus Implementation System
VIEW ALL
Videos

Technical Overview: Innovus implementation System for Digital Designs

Reducing Design Flow Iterations with GigaPlace Engine

GigaPlace Solver-Based Placement Technology In Innovus Implementation System

Concurrent Clock Optimization Boosts Performance, Lowers Power

Optimizing Power with New Digital Implementation Tool

Addressing Digital Implementation Challenges with Innovative Machine Learning Techniques

Better PPA with Innovus Mixed Placer Technology – Gigaplace XL

News ReleasesVIEW ALL
  • Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand 05/28/2026

  • Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud 06/11/2025

  • Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications 06/12/2024

  • Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design 04/24/2024

  • Phison Deploys Cadence Cerebrus AI-Driven Chip Optimization to Accelerate Product Development 01/22/2024

Blogs VIEW ALL
Customers

Our products enable the reception of broadband data and video content, requiring high levels of performance, small silicon die-size, and rapid time to market. Innovus Implementation System has provided us with unprecedented full-flow speed-up, so we can deliver reliable designs to market faster.

Dr. Paolo Miliozzi, Senior Director, SOC Technology and Physical Design, MaxLinear

Read More or View All Customers

We've tested the full Innovus Implementation System flow on some of our most congestion-challenged 28nm networking IP blocks and have achieved excellent results while seeing significant throughput improvements. The new Cadence solution has enabled us to resolve our most difficult timing requirements…

Fares Bagh, Vice President, Hardware and Architecture Engineering in Freescale's Digital Networking Group

Read More or View All Customers

Our next system-on-chip (SoC) projects will be on a 16nm process, and the Innovus Implementation System can enable much larger blocks than previously possible, decreasing area and top-level complexity.

Debashis Basu, ‎SVP Engineering, Silicon and Systems Engineering, Juniper Networks

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Innovus Implementation System provided us with substantial gains in quality of results and speed-up for our most challenging design.

Tatsuji Kagatani, Dept. Manager, Design Automation Dept., Elemental Technology Development Division at Renesas System Design Co., Ltd.

Read More or View All Customers

At ARM, we push the limits of silicon and EDA tool technology to deliver products on tight schedules required for consumer markets. We partnered closely with Cadence to utilize the Innovus Implementation System during the development of our ARM® Cortex®-A72 processor. This demonstrated a 5X runtime improvement…

Noel Hurley, General Manager, CPU Group, ARM

Read More or View All Customers

The Innovus Implementation System significantly improved the runtime on a critical multi-million-cell IP core compared to our previous solution. With runtimes improved to deliver more than a million cells per day of implementation throughput, we can confidently drive our aggressive schedules…

Robin Lu, Vice President of ASIC, Spreadtrum Communications

Read More or View All Customers

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