Resource Library
Video (231)
- Early Firmware Development on Palladium and Protium, Enables 1st Silicon Success at Toshiba Memory
- BabbleLabs Transforms Speech for Digital World Using Cadence Technology
- Hyperscale Computing and Cadence
- Electromagnetic Analysis for High-Speed Communication
- NVIDIA Partners with Cadence to Overcome Chip Design Challenges
- Ambarella Creating Smarter Vision Systems of Tomorrow
- Design with Cadence to Achieve Your Mission!
- Fujitsu Designing the World’s Leading Innovations with Cadence Intelligent System Design
- Push-Button, Hybrid to In-Cloud Simulation
- Verification Enhances Confidence in Defense Program Success
- A Custom RISC-V SoC in GF 12LP Technology Designed with a Personalized Stylus Common UI Flow
- 5G PHY Use Cases on B20
- Addressing 5G System Design Challenges
- How We Push Largest 5nm High-Performance Arm Core to 4GHz Frequency
- Pushbutton migration from emulation to prototyping based on Protium platform
- Scaling Semiconductor Design Workflows on AWS
- Google’s Story of Moving EDA to Cloud
- Embracing Cloud for Global, High-performance Design Teams
- Samsung 3nm Cadence AMS Design Reference Flow
- Improved Analog Layout Productivity Using ModGen Template-Driven Layout Reuse Methodology in Virtuoso Environment
- Productive Design: Hardware/Software Co-Verification with Virtual Debugging from Simulation to Prototyping
- Timing Characterization for Custom Analog Block
- Functional Safety Flow for ISO 26262 ASIL-C of D Analysis
- Digital Twin Case Study: Applying Emulation-Based Verification of SoC Using Tactical Software
- The Evolution of Sensing, Computing and Architecture Going from ADAS to Automated Driving
- Updating your Automotive SoC from 16FFC to N7
- Ultra low power processor subsytems with customized memories in 22FDX
- RF/Microwave Design in the Era of Connected Cars
- Physical Implementation Methodology of Arm Cortex-A76AE Processor
- A Flexible Lockstep Architecture for ASIL Compliant DSPs and Controllers
- Is Your Design Functionally Safe?
- Simulate Security Attacks on Your Electronics Design Before Fabrication
- Integrating and Simulating Your Design Before Fabrication
- Accelerate Advanced Node Mixed-signal Simulation with AMS-Flexible Flow and Spectre X Simulator
- RF/Microwave Design in the Era of Connected Cars
- Mom, I Have a Digital Twin? Now You Tell Me?
- Marvell Gains High Confidence for Silicon Tapeout Using Palladium Emulator to Validate Processor
- Prototyping Billion-Gate Designs with Protium X1 Prototyping System
- Dynamic Software Analysis in Virtual Platforms- Ericsson Expert Insights
- Building better aerospace and defense electronics: emulate before you fabricate
- Automotive safety & quality reference flow using Tensilica ConnX B10 DSP
- On-Going Challenges to Using Cloud for EDA
- Introduction to the Cadence Palladium Cloud Solution
- Introduction to the Cadence Cloud-Hosted Design Solution for a Complete Design Flow in the Cloud
- Introduction to the Cadence CloudBurst Platform for Ready-to-Use Peak Capacity
- Introduction to the Cadence Cloud Passport Model
- An Introduction to Cloud Computing for Electronic Design
- A Semiconductor Company’s Typical Cloud Concerns
- Virtuoso RF Solution Electromagnetic Analysis
- Better PPA with Innovus Mixed Placer Technology – Gigaplace XL
- Building Aerospace and Defense Electronics Right the First Time
- Cadence Technology and Services Leveraged in the Automotive Development Process
- Accelerate Data Set Processing to Verify Custom and Mixed-Signal Designs
- Simulate 5G Signal Sources for Complete Signoff Verification
- Improve Device Matching with Assisted Component P&R
- How Row-Based Methodology Improves Custom Layout
- Using Row-Based Methodology to Improve Advanced-Node Custom Layout
- Advanced Methodologies to Accelerate Your Custom Layout
- Digital Twinning and the Future of the Aerospace and Defense Industry
- Avoid Density Gradient Effects in 16FF+ Designs with Virtuoso Layout Suite GXL ModGens
- The Cadence Cloud Portfolio
- Aerospace and Defense Challenges in RF/Microwave Design and Integration
- Cloud Computing for Electronic Design (Are We There Yet?)
- New Cadence Products Expand the Verification Suite: Xcelium Parallel Simulator and Protium S1 Platform
- Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging
- STMicroelectronics 20nm Constraint Driven Modgen Flow
- Advanced mm-Wave 3D Imaging Radar Solution Powered by Cadence Tensilica Vision DSP
- Automotive In-Cabin Driver Monitoring System Powered by Cadence Tensilica Vision DSP
- Cadence and Autoware—Partnering to Make Autonomous Vehicles for Tomorrow
- Integrating Video, Radar, and Lidar for Autonomous Driving
- Addressing Digital Implementation Challenges with Innovative Machine Learning Techniques
- Cadence Academic Network - Integrating Video, Radar, and Lidar for Autonomous Driving
- Cadence Academic Network - Chips to Study Natural Intelligence and to Build Artificial Intelligence
- Cadence’s Insight into Design Process Helps the US Technology Leadership Council Achieve its Goals
- Cadence and Uhnder—Partnering to Make Fully Autonomous Driving Possible
- System of Systems Verification and Digital Twins for Aerospace Applications
- Intelligent system design of AI and machine learning applications
- The Importance of Semiconductors for the Fast Changing World of Automotive
- Cloud Passport Partner Program for Academia
- Automotive Sensors: Concepts and Trends
- Challenges for Autonomous Driving
- Design Requirements for Autonomous Driving
- Shortening Development Time to Enable Autonomous Driving
- When it Comes to Cloud-Based Design, One Size Does Not Fit All
- Arm and Cadence collaborate on Arm Neoverse N1 platform to advance Cloud-to-Edge infrastructure
- Toshiba Electronic Device Solutions Overcomes Complexities of Advanced-Node Designs
- Did You Know - Cadence Aerospace and Defense
- Proven Electronic Design Solutions for Mission-critical Systems
- Systems of Systems Verification and Digital Twins for Aerospace Applications
- Standalone AI Processor: Tensilica DNA 100 Processor IP for On-Device AI
- Designing an SoC on the Cloud
- Whiteboard Wednesdays - Passport Partners Program Expands Customer Cloud Deployment Options
- Whiteboard Wednesdays - Tensilica DSPs, Sensors, and Neural Networks
- Dream CHIP Technologies – Automotive ADAS Chip Architecture
- AI-based Pedestrian Detection powered by Cadence Tensilica
- Digital home assistant speech recognition powered by Tensilica HiFi DSP
- New Cadence Tensilica ConnX B20 DSP for automotive radar/lidar and 5G communications
- Tensilica Hardware Safety Kit ISO 26262
- Significance of Sparsity in Neural Networks
- A Peek Inside Future Automotive Networks
- Whiteboard Wednesdays - Introduction to Functional Safety From an IP Supplier
- The Truth about Designing for Automotive Functional Safety
- An Introduction to Palladium Cloud
- Introducing the Cloud Passport Model
- Cloud-Hosted Design Solution – a Full-Service Cloud Offering
- The 4 Steps Necessary for an Effective Cloud-Based Design Strategy
- CloudBurst – the Fast, Painless, Proven Solution for Hybrid Cloud Environments
- The Cadence Cloud Portfolio of Fast, Painless, Proven Solutions for Cloud-Based Design
- Simplifying Fault Injection Simulations for Functional Safety Verification
- Getting a Jumpstart on 20nm - Part 2
- Cloud Panelist Introductions
- The Palladium Solution and SoC Emulation for 16nm Automotive Devices at NXP
- From TensorFlow to RTL in three months
- Tensilica Neural Network Compiler: Efficiently Deploy Neural Networks
- Automotive Sensor Design Enablement
- Introduction to ADAS with a Real-Life Example
- Faster Routing by Optimizing FPGA Pin Assignments
- Cadence Cloud – The Future of Electronic Design
- Library Characterization in the Cloud
- AI for Image Classification and Object Detection
- Full HD 360° Surround View enabled by Tensilica Vision P6 DSP
- Protium S1 used to prototype a pedestrian detection application.
- AI for People Detection using Tensilica Vision P6 DSP
- Breaking Down ADAS Sensor Fusion Platforms and Sensor Concepts
- Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications
- Ethernet and Automotive Electronics
- How to Meet the Quality, High Reliability, and Safety Requirements for Analog and Mixed-Signal ICs in Mission-Critical Applications
- Easily Adopt Electro-thermal Simulation for Your High-Reliability Analog Designs
- Improvements in Modeling Device Aging Analysis: Extending Product Lifetime
- Analog Defect Simulation and Analysis for Complex Systems
- Automotive System Trends and the Integration of Analog Electronic Dependability
- Cadence Automotive – from Concepts to Solutions
- The Benefits of Running the Xcelium Parallel Logic Simulator on Cavium’s Arm Based ThunderX2
- A Practical Approach to Failure Modes, Effects, and Diagnostic Analysis (FMEDA)
- Understanding ISO 26262 Implications for Automotive Design Teams
- Automotive Memory Technologies and Trends: Technology Implications
- Summary of Keynote by Davide Santo from NXP on Artificial Intelligence in Autonomous Driving
- Hardent: Solution for Next-Generation Automotive Video Systems Enabled with Cadence IP
- Renesas R-Car Audio Channel Processing using Cadence Tensilica DSP
- Low Power Embedded CNN with Tensilica High-Performance Vision DSP
- Combined MathWorks and Cadence Design Flow for Analog/Mixed-Signal IC Development
- Active Safety Features
- Automotive Functional Safety and the ISO 26262 Standard
- Industry Trends and Requirements for Autonomous Driving
- Radar Signal Processing for Automotive Applications
- Radar Signal Processing Optimized for the Tensilica Fusion G3 DSP
- Modular VIP Architecture
- Memory Trends to Fit Your Application
- Tensilica Vision P6 DSP Enhanced for CNN
- Where Ethernet is Used in Automotive Electronics
- Implementation of Higher Speed PCIe Gen4 IP
- Automotive IP Subsystems
- Big Automotive Trends and Challenges - Lars Reger, NXP Semiconductors
- lars reger nxp role of semiconductor industry in automotive innovation 1080p
- Enhancing Design Productivity at STMicroelectronics with Virtuoso Custom/Analog Flow
- Renesas: Balancing Performance, Low-Power and Functional Safety in ADAS Applications
- Improving Quality and Time-to-Market for TSMC 16nm FinFET Process Using the Cadence Certified Tools and Flow
- How to Design a TSMC 20nm Chip with a Completely Validated Cadence Solution
- Low-Power Mixed-Signal Verification of Freescale Kinetis Products
- 2.2 GHz Performance on 28nm ARM Dual-Core Cortex-A9 Processor
- Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Intent
- Developing 4G Wireless Designs with Cadence CPF-Driven Low-Power Solution
- Global Unichip: 20nm Testchip Tapeout with Cadence and TSMC
- How Electronics are Driving the Coolest Features in Today's Cars
- Cadence Implementation, Signoff and DFM Readiness for Samsung FinFET Nodes
- Accurate Low Power verification on a Complex Low Power Design using CLP
- Freeescale Semiconductor - Cadence Low-Power Solution for Kinetis SoC
- Evolution of Electronics in Automotive Industry
- Lars Reger, NXP, Future car- from connectivity to autonomous driving
- Silicon Labs Leverages Cadence Mixed-Signal Solution for Mixed Signal Simulation, Implementation and Signoff
- S3 Group uses Cadence Mixed-Signal Solution for First-Time-Right Silicon
- Emulating Nvidia GPUs
- Cadence virtual hardware in-the-loop environment for ECU design
- Faster Timing Characterization of Analog Macros
- Verify Smarter with Industry's First Datacenter-Class Emulation System
- Cadence DAC 2015 Clio Soft
- Physical Design Flow Challenges at 28nm on Multi-Million Gate Blocks
- Samsung Foundry 14LPP: The Continual Thrust in FinFET Leadership
- Embedded World: Enabling Automotive System Design with Allegro Sigrity Tools
- Offering Leading Edge Total Solutions - GLOBALFOUNDRIES Design Ready 14nm Eco System
- Virtuoso IPVS for Advanced Node Design
- Advanced Node Multi-Patterning Technologies within Virtuoso Environment
- Custom Layout Methodologies with Virtuoso Advanced Node
- TowerJazz AMS Reference Flow
- Physical Design Analytics and DFM Enablement for sub-14nm Technology Nodes
- X-FAB Revamps Low-Power Design Flow with CPF
- Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES
- Faster HW/SW Debug, Embedded Software Development and System Validation
- Xilinx - Industry Leading Solutions for FPGA-based Prototyping
- Freescale Tracks Thousands of Simulations Before Tapeout for Bug-Free Silicon
- Rapid Adoption of Advanced Cadence Design flows Using X-FAB's AMS Reference Kit
- TSMC Europe discusses the importance of 16nm FinFET technology
- IBM and Cadence Collaborate to Solve Advanced Node Design Challenges
- Accelerating design-in of Xilinx FPGAs while optimizing PCB layout for cost and performance
- Accelerating design-in of Altera FPGAs while optimizing PCB layout for cost and performance
- Tackling 16nm Challenges for Arm Cortex-A72 Processor
- Automotive Ethernet Audio Demo: An Overview
- FPGA board design: Introduction to Cadence FPGA System Planner
- Hitachi: Faster Bring Up with Protium Platform
- Arm AMBA Protocol Overview
- Virtuoso Mixed-Signal "SmartPower" Implementation Flow
- Virtuoso Technology for Advanced Process Nodes
- Is SystemVerilog the Future of Analog Behavioral Modeling
- Cadence and GLOBALFOUNDRIES 20nm Reference Flow
- Building Energy Efficient SoCs with big.LITTLE Technology
- TowerJazz Substrate Noise Enablement
- Arm Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-Efficient Processors for Mixed-Signal Applications
- Silicon Signoff and Verification - 16nm FinFET Challenges and Features
- Texas Instruments - Highly Scalable Multicore ARM A15 Verification with Specman/e
- STMicroelectronics Automates Full Custom Analog Layout Flow Using Constraints
- STMicro Shortens Turnaround Time with Cadence's Mixed-Signal Solutions
- GLOBALFOUNDRIES - Collaboration Keys to Building Complex PDKs
- Addressing MCU Mixed-Signal Design Challenges for SoCs and IoT
- Low-Power Summit ARM Sathya Subramanian
- Efficient Design Verification and Yield Estimation
- Introducing Low-power Verification RAK
- Is SystemVerilog the Future of Analog Behavioral Modeling
- PMC - Power Estimation – An Evolving Science
- Overcoming Patterning-Induced Place-and-Route Challenges at 10nm
- Enabling Cadence Signoff Technologies for 14nm FinFET at Samsung
- How Nvidia is Speeding Up Timing Closure of Advanced-Node Application Processors
- The Best of Both Worlds – Combining Virtual and FPGA-based Prototypes
- Getting a Jumpstart on 20nm - Part 1
- Silicon Labs - Power Mode Verification in Mixed-Signal Chips
- Cadence and IBM - Custom 20nm Solution Webinar
- Design Challenges in Developing Sub-Volt IP Designs for IoT Applications
- Digital 20nm RTL-to-GDSII Methodology
- Get real-time electrical feedback on 16FF designs with Virtuoso Layout Suite for Electrically Aware Design
White Paper (43)
- mmWave Chip, Package, and Board Beamforming Solutions
- Achieving Enhanced Signal Processing Using a Powerful Unified Framework
- Best Practices for Efficient and Effective Planar EM Simulation
- RF to Millimeter-Wave Front-End Component Design Trends 5G Communications
- Overcoming Next-Generation AESA Radar Design Challenges
- 5G NR Design for eMBB
- RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design
- SLAM and DSP Implementation
- 5G Communications with AWR Software
- RFIC PA Development for Communication and Radar Systems
- Design of Class F PAs to Optimize Gain, Efficiency, and Stability
- RF Module Design and Development
- Load-Pull Analysis for Optimizing PA Performance
- Predicting Critical Metrics for Wireless RF Links
- 5G Primer for MIMO/Phased Array Antennas
- Radar Systems Primer
- System Simulation for RF Link Budget Analysis
- 5G NR Primer for Amplifier and Filter Design
- Design of a Complete RF Downconverter Module for Test Equipment
- Design and Physical Realization of Phased Array Antennas for MIMO/Beam Steering Applications
- AWR Software for the Design and Modeling of a Solid-State T/R Module for Radar Applications
- Cadence Cloud—The Future of Electronic Design Automation White Paper
- A Complete System-Level Security Verification Methodology White Paper
- Automotive Functional Safety Using LBIST and Other Detection Methods
- Accelerating SoC Time to Market with Cloud-Based Verification White Paper
- Improving Test Coverage and Eliminating Test Ecapes Using Analog Defect Analysis White Paper
- DO-254 Explained White Paper
- Accelerating DO-254 Approval with Cadence Tools White Paper
- Meeting the Challenges of the National Defense Strategy
- Functional Safety Methodologies for Automotive Applications White Paper
- A Program Manager’s Guide to Successful Integrated Circuit Verification
- Addressing the Challenges of Photonic IC Design Via an Integrated Electronic/Photonic Design Automation Environment, Addressing the Challenges of Photonic IC Design Via an Integrated Electronic/Photonic Design Automation Environment White Paper
- Plan-Based Analog Verification Methodology White Paper
- A Better Tool for Functional Verification of Low-Power Designs with IEEE 1801 UPF White Paper
- Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools and Techniques White Paper
- Pushing the Performance Boundaries of ARM Cortex-M Processors for Future Embedded Design White Paper
- Techniques to Accelerate Power and Timing Signoff of Advanced-Node SoCs White Paper
- Solutions for Mixed-Signal SoC Verification Using Real Number Models White Paper
- Analyzing and Debugging Performance Issues with Advanced ARM CoreLink System IP Components White Paper
- Building Energy-Efficient ICs from the Ground Up White Paper
- Solutions for Mixed-Signal SoC Verification White Paper
- 20nm Design - How this Advanced Technology Node Will Transform SoCs and EDA White Paper
Webinar (19)
- RF/Microwave Design in the Era of Connected Cars
- Accelerate Data Set Processing to Verify Custom and Mixed-Signal Designs
- Simulate 5G Signal Sources for Complete Signoff Verification
- Improve Device Matching with Assisted Component P&R
- How Row-Based Methodology Improves Custom Layout
- Using Row-Based Methodology to Improve Advanced-Node Custom Layout
- Advanced Methodologies to Accelerate Your Custom Layout
- Digital Twinning and the Future of the Aerospace and Defense Industry
- Avoid Density Gradient Effects in 16FF+ Designs with Virtuoso Layout Suite GXL ModGens
- Aerospace and Defense Challenges in RF/Microwave Design and Integration
- Cloud Computing for Electronic Design (Are We There Yet?)
- Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging
- Combined MathWorks and Cadence Design Flow for Analog/Mixed-Signal IC Development
- Get More Performance and Lower Energy for Automotive Using Tensilica DSPs
- Addressing Smart Sensor Design Challenges for SoCs and IoT Webinar (IoT Webinar Series - Part 2)
- Addressing Smart Sensor Design Challenges for SoCs and IoT (Part 1)
- Addressing Smart Sensor Design Challenges for SoCs and IoT (Part 1)
- Arm Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-Efficient Processors for Mixed-Signal Applications
- Understanding the What If to Avoid the What Now
Magazine (14)
Article (11)
- Cracking Intractable Chip Design Challenges with the Help of Machine Learning
- Making AUTONOMOUS VEHICLES affordable
- Developing Military Electronic Systems Calls for Holistic Strategy
- Emulate Before You Fabricate: A Mantra for Defense Electronics
- Preventing Expensive Electronic Hardware Mistakes
- Consumer Electronics Break Augustine's Laws
- Realizing the Potential of AI on the Edge
- Virtual is Real With Electronic Systems Prototyping
- Understanding 5G for the DoD
Press Releases (94)
- Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D
- New Cadence Report Reveals Majority of Consumers Believe Hyperconnectivity Will Positively Impact Their Lives
- Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform
- EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design
- Cadence Collaboration with Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs
- Cadence Collaborates with Arm to Accelerate Hyperscale Computing and 5G Communications SoC Development
- Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
- Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts
- GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design
- Cadence Digital and Custom Flows Achieve Certification for TSMC N3 Process
- Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
- Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies
- Cadence Optimizes Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development
- Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
- Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for Mission-Critical Applications
- Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications
- Cadence and National Instruments Enter into Strategic Alliance Agreement to Enhance Electronic System Innovation
- Cadence Presented with Four 2019 TSMC Partner of the Year Awards
- Cadence Collaborates with Arm and Samsung Foundry on Delivery of 5LPE Flow for Mission-Critical Applications Using Next-Generation “Hercules” CPU
- Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies
- Cadence and UMC Collaborate on Certification of Analog/Mixed-Signal Flow for 28HPC+ Process
- NSITEXE Accelerates Delivery of Data Flow Processor IP for Automotive and Industrial Applications Using the Cadence Digital Design Full Flow
- Cadence Digital Full Flow Achieves Certification for Samsung Foundry 5LPE Process Technology
- Cadence Expands Customer-Managed Cloud Options with New Cloud Passport Partner Program
- Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design
- Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
- Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications
- Cadence Tools and IP Optimized for New Arm Neoverse N1 Platform to Advance the Cloud-to-Edge Infrastructure Market
- Media Alert: Cadence to Showcase Photonics Applications at Photonics Summit and Workshop with Lumerical
- Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology
- Cadence Verification Suite Enabled on Arm-Based HPC Datacenters
- Cadence Accelerates Arm-Based Server Development by Automating Arm Pre-Silicon Bare Metal Compliance Testing
- Cadence Recognized with Four 2018 TSMC Partner of the Year Awards
- Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment
- Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies
- Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation
- Cadence Achieves Amazon Web Services Industrial Software Competency Status for Its Cloud-Hosted Design Solution
- Cadence Full-Flow Digital Tool Suite Achieves GLOBALFOUNDRIES 22FDX® Certification
- Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification
- Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry’s 7LPP Process Technology
- Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors
- Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud
- Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform
- Cadence Collaborates with Google Cloud to Enable Cloud-Based Development of Electronic Systems and Semiconductors
- Cadence Launches Liberate Trio Characterization Suite Employing Machine Learning and Cloud Optimizations
- Cadence Full-Flow Digital and Signoff Tools and Verification Suite Provide Optimal Results for 7nm Arm Cortex-A76 CPU Designs
- Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution
- Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
- Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP
- Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout
- Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology
- Cadence Achieves TÜV SÜD’s First Comprehensive “Fit for Purpose - TCL1” Certification in Support of Automotive ISO 26262 Standard
- Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS® 3D Packaging Technologies
- Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU
- Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM
- Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs
- Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
- Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery
- Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung’s 7LPP and 8LPP Process Technologies
- Cadence Unveils Expanded Virtuoso Advanced-Node Platform for 7nm Processes
- Cadence Delivers Industry’s First Comprehensive TCL1 Documentation to Support Automotive ISO 26262 Standard
- Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors
- Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms
- Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology
- Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New ARM Cortex-R52 CPU
- Cadence Debuts PSpice Web Portal and Ecosystem to Help Designers Address System Level Mixed-Signal Wireless and IoT Challenges
- Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry’s First End-to-End Hosted Design Solution
- Cadence Delivers Rapid Adoption Kits Based on a 10nm Reference Flow for New ARM Cortex-A73 CPU and ARM Mali-G71 GPU
- Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs
- Cypress Adopts Cadence Digital Implementation and Circuit Simulation Tools for 40nm Automotive Designs
- Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution
- Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
- Cadence Digital and Signoff Tools Certified on Samsung Foundry's 14LPP Process
- Cadence Design Tools Certified for TSMC 7nm Design Starts and 10nm Production
- Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow
- Building the Car of the Future Today-Cadence Showcases Automotive Solutions at embedded world 2016
- Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process
- Cadence Collaborates with Lumerical and PhoeniX Software to Offer Virtuoso Platform-Based Design Flow for Electronic /Photonic ICs
- Cadence Unveils Virtuoso Advanced-Node Platform for 10nm Processes
- Cadence Receives Customers' Choice Award for Automotive IP Paper Presented at TSMC OIP Ecosystem Forum
- Cadence and ARM Deliver an IP Reference System for Internet of Things Applications
- Cadence Announces Verification IP for ARM AMBA 5 AHB5
- Cadence Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 22FDX Platform Reference Flow
- Media Alert: Cadence to Host Mixed-Signal Technology Summit
- Cadence and ARM Announce Strategic IP Interoperability Agreement
- Cadence Announces Fourth Generation Tensilica HiFi DSP Architecture
- Cadence Introduces Automotive Functional Safety Verification Solution, Reducing ISO 26262 Compliance Preparation Effort by up to 50 Percent
- Müller-BBM Active Noise Control and Sound Design Now Optimized on Cadence Tensilica HiFi Audio/Voice Processors for Automotive Applications
- SPL Vitalizer In-Car Audio Software Now Available on Cadence Tensilica HiFi Audio/Voice DSP Family
- Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control
- CSR Selects Cadence Palladium XP Platform for Development of ARM-based Automotive Infotainment Systems
- Cadence Expands ARM-based System Verification Solution, Reducing Time-to-Market for Mobile, Networking and Server Applications
- Cadence Announces Sensor Platforms as New Tensilica HiFi Audio Partner for Sensor Fusion and Context Awareness Applications
Presentation (21)
- Embracing Cloud for Global, High-performance Design Teams
- New Virtuoso Design Platform
- Speed Up Your Mixed-Signal Verification with Spectre X Simulator
- Quantus Extraction Solution for Accurate and Fast Silicon Signoff and Verification
- Co-Design of Chip and Package with Virtuoso System Design Platform Presentation
- Creating Liberty Models for Custom and Mixed-Signal Blocks Presentation
- Best Practices for Verifying Mixed-Signal Systems Presentation
- Analyzing Mismatch and Predicting Yield in Virtuoso ADE Assembler Presentation
- Measuring the Impact of Aging in Spectre and ADE Presentation
- Using Spectre RF Analyses for Non-RF Circuits Presentation
- Getting The Most Out Of Spectre APS Presentation
- Building Analog Self-Checking Presentation
- Accounting for Calibration/Trimming in ADE Presentation
- Model-Based Verification of Mixed-Signal SoCs
- Mixed-Signal Design Challenged: From Transistors to Systems
- AnaViP:vaUVM-MS Component to Drive and Monitor Analog Signals
- DSP-Assisted RF, analog, and Mixed-Signal Design
- Connecting MATLab and Simulinlk to Cadence Virtuosos AMS Designer
- Making the Design Simpler and More Efficient
- Cadence and GLOBALFOUNDRIES 20nm Reference Flow
- Bluetooth Smart and Low-Power Innovation
Datasheet (19)
- PCB Design Leveraging RF/Microwave Expertise in AWR Software
- Module Design with AWR Software Datasheet
- AWR Analyst Full 3D Finite Element Method EM Analysis Software Datasheet
- AWR Visual System Simulator Datasheet
- RF PCB Design with AWR Software Datasheet
- Radar Systems with AWR Software
- 5G Systems with AWR Software
- AWR Software Product Portfolio Datasheet
- AWR AXIEM Planar 3D System Analysis Datasheet
- AWR Microwave Office Datasheet
- Protium S1 FPGA-Based Prototyping Platform
- Legato Reliability Solution Cadence
- Perspec System Verifier Datasheet
- Protium S1 Single-FPGA Board Datasheet
- vManager Metric-Driven Signoff Platform Datasheet
- Virtuoso ADE Verifier Datasheet
- Palladium Z1 Enterprise Emulation Platform Datasheet
- Protium FPGA-Based Prototyping Platform Datasheet
- Allegro FPGA System Planner Datasheet
Customer Presentation (14)
- A Custom RISC-V SoC in GF 12LP Technology Designed with a Personalized Stylus Common UI Flow
- Pushbutton migration from emulation to prototyping based on Protium platform
- Scaling Semiconductor Design Workflows on AWS
- Google’s Story of Moving EDA to Cloud
- Samsung 3nm Cadence AMS Design Reference Flow
- Improved Analog Layout Productivity Using ModGen Template-Driven Layout Reuse Methodology in Virtuoso Environment
- Productive Design: Hardware/Software Co-Verification with Virtual Debugging from Simulation to Prototyping
- Timing Characterization for Custom Analog Block
- Functional Safety Flow for ISO 26262 ASIL-C of D Analysis
- Digital Twin Case Study: Applying Emulation-Based Verification of SoC Using Tactical Software
- The Evolution of Sensing, Computing and Architecture Going from ADAS to Automated Driving
- Updating your Automotive SoC from 16FFC to N7
- Physical Implementation Methodology of Arm Cortex-A76AE Processor
- Is Your Design Functionally Safe?
Videos
Customers
Due to the Palladium Z1 platform's capacity to handle our billion gate-class designs and its highly sophisticated debug and advanced multiuser capabilities, all in a small form factor, we will be able to design and deliver our next generation GPU and Tegra designs with high quality and on schedule.
Narenda Konda, Director of Engineering, NVIDIA
Processors for automotive and industrial markets are driving higher levels of integration and complexity. This requires larger design partitions to deliver the efficiencies and time to market demanded by our customers.
Anthony Hill, Director of Processor Technology, Texas Instruments
Electrically aware design can enable us to save several iterations on the design of each block sensitive to parasitic effects. Depending on block complexity, design time savings can range from half a day to several days per block.
Martin Kejhar, Senior Technical Staff Engineer and Scientist, ON Semiconductor