Resource Library
Video (226)
- Improved Analog Layout Productivity Using ModGen Template-Driven Layout Reuse Methodology in Virtuoso Environment
- Samsung 3nm Cadence AMS Design Reference Flow
- Timing Characterization for Custom Analog Block
- On-Going Challenges to Using Cloud for EDA
- Introduction to the Cadence Palladium Cloud Solution
- Introduction to the Cadence Cloud-Hosted Design Solution for a Complete Design Flow in the Cloud
- Introduction to the Cadence CloudBurst Platform for Ready-to-Use Peak Capacity
- Introduction to the Cadence Cloud Passport Model
- An Introduction to Cloud Computing for Electronic Design
- A Semiconductor Company’s Typical Cloud Concerns
- Embracing Cloud for Global, High-performance Design Teams
- Scaling Semiconductor Design Workflows on AWS
- Virtuoso RF Solution Electromagnetic Analysis
- Better PPA with Innovus Mixed Placer Technology – Gigaplace XL
- Google’s Story of Moving EDA to Cloud
- Building Aerospace and Defense Electronics Right the First Time
- Cadence Technology and Services Leveraged in the Automotive Development Process
- Accelerate Data Set Processing to Verify Custom and Mixed-Signal Designs
- Simulate 5G Signal Sources for Complete Signoff Verification
- Improve Device Matching with Assisted Component P&R
- How Row-Based Methodology Improves Custom Layout
- Using Row-Based Methodology to Improve Advanced-Node Custom Layout
- Advanced Methodologies to Accelerate Your Custom Layout
- Digital Twinning and the Future of the Aerospace and Defense Industry
- Avoid Density Gradient Effects in 16FF+ Designs with Virtuoso Layout Suite GXL ModGens
- The Cadence Cloud Portfolio
- Aerospace and Defense Challenges in RF/Microwave Design and Integration
- BabbleLabs Transforms Speech for Digital World Using Cadence Technology
- Cloud Computing for Electronic Design (Are We There Yet?)
- New Cadence Products Expand the Verification Suite: Xcelium Parallel Simulator and Protium S1 Platform
- Reduce FPGA-Based Prototype Bring-Up From Months to Days with Cadence Protium S1 Platform
- Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging
- Prototyping Billion-Gate Designs with Protium X1 Prototyping System
- Mom, I Have a Digital Twin? Now You Tell Me?
- STMicroelectronics 20nm Constraint Driven Modgen Flow
- Advanced mm-Wave 3D Imaging Radar Solution Powered by Cadence Tensilica Vision DSP
- Automotive In-Cabin Driver Monitoring System Powered by Cadence Tensilica Vision DSP
- Cadence and Autoware—Partnering to Make Autonomous Vehicles for Tomorrow
- Integrating Video, Radar, and Lidar for Autonomous Driving
- Addressing Digital Implementation Challenges with Innovative Machine Learning Techniques
- Cadence Academic Network - Integrating Video, Radar, and Lidar for Autonomous Driving
- Cadence Academic Network - Chips to Study Natural Intelligence and to Build Artificial Intelligence
- Cadence’s Insight into Design Process Helps the US Technology Leadership Council Achieve its Goals
- Cadence and Uhnder—Partnering to Make Fully Autonomous Driving Possible
- System of Systems Verification and Digital Twins for Aerospace Applications
- Intelligent system design of AI and machine learning applications
- The Importance of Semiconductors for the Fast Changing World of Automotive
- Cloud Passport Partner Program for Academia
- Automotive Sensors: Concepts and Trends
- Challenges for Autonomous Driving
- Design Requirements for Autonomous Driving
- Shortening Development Time to Enable Autonomous Driving
- When it Comes to Cloud-Based Design, One Size Does Not Fit All
- Arm and Cadence collaborate on Arm Neoverse N1 platform to advance Cloud-to-Edge infrastructure
- Addressing 5G System Design Challenges
- Toshiba Electronic Device Solutions Overcomes Complexities of Advanced-Node Designs
- Did You Know - Cadence Aerospace and Defense
- Proven Electronic Design Solutions for Mission-critical Systems
- Standalone AI Processor: Tensilica DNA 100 Processor IP for On-Device AI
- Designing an SoC on the Cloud
- Whiteboard Wednesdays - Passport Partners Program Expands Customer Cloud Deployment Options
- Whiteboard Wednesdays - Tensilica DSPs, Sensors, and Neural Networks
- Dream CHIP Technologies – Automotive ADAS Chip Architecture
- AI-based Pedestrian Detection powered by Cadence Tensilica
- Digital home assistant speech recognition powered by Tensilica HiFi DSP
- New Cadence Tensilica ConnX B20 DSP for automotive radar/lidar and 5G communications
- Tensilica Hardware Safety Kit ISO 26262
- Significance of Sparsity in Neural Networks
- A Peek Inside Future Automotive Networks
- Whiteboard Wednesdays - Introduction to Functional Safety From an IP Supplier
- The Truth about Designing for Automotive Functional Safety
- An Introduction to Palladium Cloud
- Introducing the Cloud Passport Model
- Cloud-Hosted Design Solution – a Full-Service Cloud Offering
- The 4 Steps Necessary for an Effective Cloud-Based Design Strategy
- CloudBurst – the Fast, Painless, Proven Solution for Hybrid Cloud Environments
- The Cadence Cloud Portfolio of Fast, Painless, Proven Solutions for Cloud-Based Design
- Simplifying Fault Injection Simulations for Functional Safety Verification
- Getting a Jumpstart on 20nm - Part 2
- Cloud Panelist Introductions
- The Palladium Solution and SoC Emulation for 16nm Automotive Devices at NXP
- From TensorFlow to RTL in three months
- Tensilica Neural Network Compiler: Efficiently Deploy Neural Networks
- Automotive Sensor Design Enablement
- Introduction to ADAS with a Real-Life Example
- Faster Routing by Optimizing FPGA Pin Assignments
- Cadence Cloud – The Future of Electronic Design
- Library Characterization in the Cloud
- AI for Image Classification and Object Detection
- Full HD 360° Surround View enabled by Tensilica Vision P6 DSP
- Protium S1 used to prototype a pedestrian detection application.
- AI for People Detection using Tensilica Vision P6 DSP
- Breaking Down ADAS Sensor Fusion Platforms and Sensor Concepts
- Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications
- Ethernet and Automotive Electronics
- How to Meet the Quality, High Reliability, and Safety Requirements for Analog and Mixed-Signal ICs in Mission-Critical Applications
- Easily Adopt Electro-thermal Simulation for Your High-Reliability Analog Designs
- Improvements in Modeling Device Aging Analysis: Extending Product Lifetime
- Analog Defect Simulation and Analysis for Complex Systems
- Automotive System Trends and the Integration of Analog Electronic Dependability
- Cadence Automotive – from Concepts to Solutions
- Taking FPGA-Based Prototyping to the Next Level
- A Practical Approach to Failure Modes, Effects, and Diagnostic Analysis (FMEDA)
- Understanding ISO 26262 Implications for Automotive Design Teams
- Automotive Memory Technologies and Trends: Technology Implications
- Summary of Keynote by Davide Santo from NXP on Artificial Intelligence in Autonomous Driving
- Hardent: Solution for Next-Generation Automotive Video Systems Enabled with Cadence IP
- Renesas R-Car Audio Channel Processing using Cadence Tensilica DSP
- Low Power Embedded CNN with Tensilica High-Performance Vision DSP
- Active Safety Features
- Automotive Functional Safety and the ISO 26262 Standard
- Industry Trends and Requirements for Autonomous Driving
- Radar Signal Processing for Automotive Applications
- Radar Signal Processing Optimized for the Tensilica Fusion G3 DSP
- Modular VIP Architecture
- Memory Trends to Fit Your Application
- Tensilica Vision P6 DSP Enhanced for CNN
- Where Ethernet is Used in Automotive Electronics
- Implementation of Higher Speed PCIe Gen4 IP
- Automotive IP Subsystems
- Big Automotive Trends and Challenges - Lars Reger, NXP Semiconductors
- lars reger nxp role of semiconductor industry in automotive innovation 1080p
- Enhancing Design Productivity at STMicroelectronics with Virtuoso Custom/Analog Flow
- Renesas: Balancing Performance, Low-Power and Functional Safety in ADAS Applications
- Improving Quality and Time-to-Market for TSMC 16nm FinFET Process Using the Cadence Certified Tools and Flow
- Augmenting Simulation Via Low-Power Verification Methodologies with Emulation
- How to Design a TSMC 20nm Chip with a Completely Validated Cadence Solution
- Low-Power Mixed-Signal Verification of Freescale Kinetis Products
- UVM methodology based Verification Environment for Imaging IPs/SoCs
- 2.2 GHz Performance on 28nm ARM Dual-Core Cortex-A9 Processor
- Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Intent
- Integrating Chip Verification into an ISO26262 Flow
- Avoiding Low Power Failures
- Developing 4G Wireless Designs with Cadence CPF-Driven Low-Power Solution
- Global Unichip: 20nm Testchip Tapeout with Cadence and TSMC
- How Electronics are Driving the Coolest Features in Today's Cars
- Cadence Implementation, Signoff and DFM Readiness for Samsung FinFET Nodes
- Accurate Low Power verification on a Complex Low Power Design using CLP
- Freeescale Semiconductor - Cadence Low-Power Solution for Kinetis SoC
- Cadence EMEA Student Design Contest Winner- Philipp Wehner, Ruhr University Bochum, at CDNLive EMEA
- Evolution of Electronics in Automotive Industry
- Lars Reger, NXP, Future car- from connectivity to autonomous driving
- Silicon Labs Leverages Cadence Mixed-Signal Solution for Mixed Signal Simulation, Implementation and Signoff
- S3 Group uses Cadence Mixed-Signal Solution for First-Time-Right Silicon
- Cadence virtual hardware in-the-loop environment for ECU design
- Cadence Functional Safety Solution
- Faster Timing Characterization of Analog Macros
- Verify Smarter with Industry's First Datacenter-Class Emulation System
- Cadence DAC 2015 Clio Soft
- Physical Design Flow Challenges at 28nm on Multi-Million Gate Blocks
- Samsung Foundry 14LPP: The Continual Thrust in FinFET Leadership
- Low Power Verification USING CPF/IEEE 1801 and Application of Formal Verification at Chip Level
- Big FPGA Boards for ASIC Prototyping
- Verification Solutions for ARM v7/v8 Based Systems on Chip
- Case Studies for Successful FPGA Based Prototyping
- Embedded World: Enabling Automotive System Design with Allegro Sigrity Tools
- Offering Leading Edge Total Solutions - GLOBALFOUNDRIES Design Ready 14nm Eco System
- Virtuoso IPVS for Advanced Node Design
- Advanced Node Multi-Patterning Technologies within Virtuoso Environment
- Custom Layout Methodologies with Virtuoso Advanced Node
- TowerJazz AMS Reference Flow
- Physical Design Analytics and DFM Enablement for sub-14nm Technology Nodes
- X-FAB Revamps Low-Power Design Flow with CPF
- Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES
- Faster HW/SW Debug, Embedded Software Development and System Validation
- Xilinx - Industry Leading Solutions for FPGA-based Prototyping
- Detecting Low-Power Bugs with X-Optimism Simulation
- Freescale Tracks Thousands of Simulations Before Tapeout for Bug-Free Silicon
- How Real Number Modeling Improves Functional Verification for Mixed-Signal SoCs
- Rapid Adoption of Advanced Cadence Design flows Using X-FAB's AMS Reference Kit
- TSMC Europe discusses the importance of 16nm FinFET technology
- IBM and Cadence Collaborate to Solve Advanced Node Design Challenges
- Cadence virtual hardware in-the-loop environment for ECU design
- Accelerating design-in of Xilinx FPGAs while optimizing PCB layout for cost and performance
- Accelerating design-in of Altera FPGAs while optimizing PCB layout for cost and performance
- Tackling 16nm Challenges for Arm Cortex-A72 Processor
- Automotive Ethernet Audio Demo: An Overview
- FPGA board design: Introduction to Cadence FPGA System Planner
- Hitachi: Faster Bring Up with Protium Platform
- Arm AMBA Protocol Overview
- Virtuoso Mixed-Signal "SmartPower" Implementation Flow
- Virtuoso Technology for Advanced Process Nodes
- Is SystemVerilog the Future of Analog Behavioral Modeling
- Cadence and GLOBALFOUNDRIES 20nm Reference Flow
- Building Energy Efficient SoCs with big.LITTLE Technology
- TowerJazz Substrate Noise Enablement
- Arm Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-Efficient Processors for Mixed-Signal Applications
- Silicon Signoff and Verification - 16nm FinFET Challenges and Features
- Bluespec Taps Into Rapid Prototyping Platform for Hybrid Prototyping
- MediaTek Gets High-Quality Smart Devices to Market Quickly with Palladium Platform
- Emulating a Dual-Port 10G/40G NIC on Palladium and RPP
- FPGA Prototyping Enables Rapid Development of Customizable Processors
- Hardware Solutions for FPGA-Based Prototyping
- 5 Steps to Your First Power Shut-off (PSO) Verification
- 6 Must Know Tips to Optimize LPDDR and Wide I/O Performance
- System Level Low Power Verification Using Palladium and CPF
- Analog Behavioral Modeling and Model Generation
- Texas Instruments - Highly Scalable Multicore ARM A15 Verification with Specman/e
- Hardware Solutions for FPGA-based Prototyping
- Firmware Development and Pre-silicon Verification with FPGA-based Prototyping
- FPGA-Prototyping of an Automotive Ethernet based Parking Assist System
- STMicroelectronics Automates Full Custom Analog Layout Flow Using Constraints
- STMicro Shortens Turnaround Time with Cadence's Mixed-Signal Solutions
- GLOBALFOUNDRIES - Collaboration Keys to Building Complex PDKs
- Addressing MCU Mixed-Signal Design Challenges for SoCs and IoT
- Low-Power Summit ARM Sathya Subramanian
- Efficient Design Verification and Yield Estimation
- Introducing Low-power Verification RAK
- Is SystemVerilog the Future of Analog Behavioral Modeling
- PMC - Power Estimation – An Evolving Science
- Overcoming Patterning-Induced Place-and-Route Challenges at 10nm
- Enabling Cadence Signoff Technologies for 14nm FinFET at Samsung
- How Nvidia is Speeding Up Timing Closure of Advanced-Node Application Processors
- The Best of Both Worlds – Combining Virtual and FPGA-based Prototypes
- Getting a Jumpstart on 20nm - Part 1
- Silicon Labs - Power Mode Verification in Mixed-Signal Chips
- Cadence and IBM - Custom 20nm Solution Webinar
- Design Challenges in Developing Sub-Volt IP Designs for IoT Applications
- Digital 20nm RTL-to-GDSII Methodology
- Plan-Driven Low-Power Verification and Debugging at STMicroelectronics
- Get real-time electrical feedback on 16FF designs with Virtuoso Layout Suite for Electrically Aware Design
- Allegro Microsystems Improves Efficiency and Productivity with Incisive vManager Solution
Webinar (23)
- Accelerate Data Set Processing to Verify Custom and Mixed-Signal Designs
- Simulate 5G Signal Sources for Complete Signoff Verification
- Improve Device Matching with Assisted Component P&R
- How Row-Based Methodology Improves Custom Layout
- Using Row-Based Methodology to Improve Advanced-Node Custom Layout
- Advanced Methodologies to Accelerate Your Custom Layout
- Digital Twinning and the Future of the Aerospace and Defense Industry
- Avoid Density Gradient Effects in 16FF+ Designs with Virtuoso Layout Suite GXL ModGens
- Aerospace and Defense Challenges in RF/Microwave Design and Integration
- Cloud Computing for Electronic Design (Are We There Yet?)
- Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging
- Get More Performance and Lower Energy for Automotive Using Tensilica DSPs
- Protium FPGA-Based Prototyping Platform
- Addressing Smart Sensor Design Challenges for SoCs and IoT Webinar (IoT Webinar Series - Part 2)
- Augmenting Simulation Via Low-Power Verification Methodologies with Emulation
- Integrating Chip Verification into an ISO26262 Flow
- Addressing Smart Sensor Design Challenges for SoCs and IoT (Part 1)
- Addressing Smart Sensor Design Challenges for SoCs and IoT (Part 1)
- Arm Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-Efficient Processors for Mixed-Signal Applications
- 5 Steps to Your First Power Shut-off (PSO) Verification
- 6 Must Know Tips to Optimize LPDDR and Wide I/O Performance
- Analog Behavioral Modeling and Model Generation
- Understanding the What If to Avoid the What Now
Presentation (17)
- Co-Design of Chip and Package with Virtuoso System Design Platform Presentation
- Creating Liberty Models for Custom and Mixed-Signal Blocks Presentation
- Best Practices for Verifying Mixed-Signal Systems Presentation
- Analyzing Mismatch and Predicting Yield in Virtuoso ADE Assembler Presentation
- Measuring the Impact of Aging in Spectre and ADE Presentation
- Using Spectre RF Analyses for Non-RF Circuits Presentation
- Getting The Most Out Of Spectre APS Presentation
- Building Analog Self-Checking Presentation
- Accounting for Calibration/Trimming in ADE Presentation
- Model-Based Verification of Mixed-Signal SoCs
- Mixed-Signal Design Challenged: From Transistors to Systems
- AnaViP:vaUVM-MS Component to Drive and Monitor Analog Signals
- DSP-Assisted RF, analog, and Mixed-Signal Design
- Connecting MATLab and Simulinlk to Cadence Virtuosos AMS Designer
- Making the Design Simpler and More Efficient
- Cadence and GLOBALFOUNDRIES 20nm Reference Flow
- Bluetooth Smart and Low-Power Innovation
Success Story Video (8)
- Enhancing Design Productivity at STMicroelectronics with Virtuoso Custom/Analog Flow
- UVM methodology based Verification Environment for Imaging IPs/SoCs
- Silicon Labs Leverages Cadence Mixed-Signal Solution for Mixed Signal Simulation, Implementation and Signoff
- S3 Group uses Cadence Mixed-Signal Solution for First-Time-Right Silicon
- Faster Timing Characterization of Analog Macros
- Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES
- Improving Performance of SoCs with Interconnect Workbench and CoreLink System IP
- Plan-Driven Low-Power Verification and Debugging at STMicroelectronics
Press Releases (87)
- Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
- Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts
- Cadence Digital and Custom Flows Achieve Certification for TSMC N3 Process
- Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
- Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies
- Cadence Optimizes Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development
- Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
- Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for Mission-Critical Applications
- Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications
- Cadence and National Instruments Enter into Strategic Alliance Agreement to Enhance Electronic System Innovation
- Cadence Presented with Four 2019 TSMC Partner of the Year Awards
- Cadence Collaborates with Arm and Samsung Foundry on Delivery of 5LPE Flow for Mission-Critical Applications Using Next-Generation “Hercules” CPU
- Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies
- Cadence and UMC Collaborate on Certification of Analog/Mixed-Signal Flow for 28HPC+ Process
- NSITEXE Accelerates Delivery of Data Flow Processor IP for Automotive and Industrial Applications Using the Cadence Digital Design Full Flow
- Cadence Digital Full Flow Achieves Certification for Samsung Foundry 5LPE Process Technology
- Cadence Expands Customer-Managed Cloud Options with New Cloud Passport Partner Program
- Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design
- Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
- Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications
- Cadence Tools and IP Optimized for New Arm Neoverse N1 Platform to Advance the Cloud-to-Edge Infrastructure Market
- Media Alert: Cadence to Showcase Photonics Applications at Photonics Summit and Workshop with Lumerical
- Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology
- Cadence Verification Suite Enabled on Arm-Based HPC Datacenters
- Cadence Accelerates Arm-Based Server Development by Automating Arm Pre-Silicon Bare Metal Compliance Testing
- Cadence Recognized with Four 2018 TSMC Partner of the Year Awards
- Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment
- Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies
- Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation
- Cadence Achieves Amazon Web Services Industrial Software Competency Status for Its Cloud-Hosted Design Solution
- Cadence Full-Flow Digital Tool Suite Achieves GLOBALFOUNDRIES 22FDX® Certification
- Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification
- Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry’s 7LPP Process Technology
- Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors
- Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud
- Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform
- Cadence Collaborates with Google Cloud to Enable Cloud-Based Development of Electronic Systems and Semiconductors
- Cadence Launches Liberate Trio Characterization Suite Employing Machine Learning and Cloud Optimizations
- Cadence Full-Flow Digital and Signoff Tools and Verification Suite Provide Optimal Results for 7nm Arm Cortex-A76 CPU Designs
- Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution
- Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
- Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP
- Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout
- Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology
- Cadence Achieves TÜV SÜD’s First Comprehensive “Fit for Purpose - TCL1” Certification in Support of Automotive ISO 26262 Standard
- Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS® 3D Packaging Technologies
- Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU
- Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM
- Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs
- Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
- Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery
- Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung’s 7LPP and 8LPP Process Technologies
- Cadence Unveils Expanded Virtuoso Advanced-Node Platform for 7nm Processes
- Cadence Delivers Industry’s First Comprehensive TCL1 Documentation to Support Automotive ISO 26262 Standard
- Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors
- Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms
- Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology
- Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New ARM Cortex-R52 CPU
- Cadence Debuts PSpice Web Portal and Ecosystem to Help Designers Address System Level Mixed-Signal Wireless and IoT Challenges
- Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry’s First End-to-End Hosted Design Solution
- Cadence Delivers Rapid Adoption Kits Based on a 10nm Reference Flow for New ARM Cortex-A73 CPU and ARM Mali-G71 GPU
- Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs
- Cypress Adopts Cadence Digital Implementation and Circuit Simulation Tools for 40nm Automotive Designs
- Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution
- Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
- Cadence Digital and Signoff Tools Certified on Samsung Foundry's 14LPP Process
- Cadence Design Tools Certified for TSMC 7nm Design Starts and 10nm Production
- Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow
- Building the Car of the Future Today-Cadence Showcases Automotive Solutions at embedded world 2016
- Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process
- Cadence Collaborates with Lumerical and PhoeniX Software to Offer Virtuoso Platform-Based Design Flow for Electronic /Photonic ICs
- Cadence Unveils Virtuoso Advanced-Node Platform for 10nm Processes
- Cadence Receives Customers' Choice Award for Automotive IP Paper Presented at TSMC OIP Ecosystem Forum
- Cadence and ARM Deliver an IP Reference System for Internet of Things Applications
- Cadence Announces Verification IP for ARM AMBA 5 AHB5
- Cadence Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 22FDX Platform Reference Flow
- Media Alert: Cadence to Host Mixed-Signal Technology Summit
- Cadence and ARM Announce Strategic IP Interoperability Agreement
- Cadence Announces Fourth Generation Tensilica HiFi DSP Architecture
- Cadence Introduces Automotive Functional Safety Verification Solution, Reducing ISO 26262 Compliance Preparation Effort by up to 50 Percent
- Müller-BBM Active Noise Control and Sound Design Now Optimized on Cadence Tensilica HiFi Audio/Voice Processors for Automotive Applications
- SPL Vitalizer In-Car Audio Software Now Available on Cadence Tensilica HiFi Audio/Voice DSP Family
- Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control
- CSR Selects Cadence Palladium XP Platform for Development of ARM-based Automotive Infotainment Systems
- Cadence Expands ARM-based System Verification Solution, Reducing Time-to-Market for Mobile, Networking and Server Applications
- Cadence Announces Sensor Platforms as New Tensilica HiFi Audio Partner for Sensor Fusion and Context Awareness Applications
White Paper (22)
- 5G NR Primer for Amplifier and Filter Design
- Cadence Cloud—The Future of Electronic Design Automation White Paper
- A Complete System-Level Security Verification Methodology White Paper
- Automotive Functional Safety Using LBIST and Other Detection Methods
- Accelerating SoC Time to Market with Cloud-Based Verification White Paper
- Improving Test Coverage and Eliminating Test Ecapes Using Analog Defect Analysis White Paper
- DO-254 Explained White Paper
- Accelerating DO-254 Approval with Cadence Tools White Paper
- Meeting the Challenges of the National Defense Strategy
- Functional Safety Methodologies for Automotive Applications White Paper
- A Program Manager’s Guide to Successful Integrated Circuit Verification
- Addressing the Challenges of Photonic IC Design Via an Integrated Electronic/Photonic Design Automation Environment, Addressing the Challenges of Photonic IC Design Via an Integrated Electronic/Photonic Design Automation Environment White Paper
- Plan-Based Analog Verification Methodology White Paper
- A Better Tool for Functional Verification of Low-Power Designs with IEEE 1801 UPF White Paper
- Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools and Techniques White Paper
- Pushing the Performance Boundaries of ARM Cortex-M Processors for Future Embedded Design White Paper
- Techniques to Accelerate Power and Timing Signoff of Advanced-Node SoCs White Paper
- Solutions for Mixed-Signal SoC Verification Using Real Number Models White Paper
- Analyzing and Debugging Performance Issues with Advanced ARM CoreLink System IP Components White Paper
- Building Energy-Efficient ICs from the Ground Up White Paper
- Solutions for Mixed-Signal SoC Verification White Paper
- 20nm Design - How this Advanced Technology Node Will Transform SoCs and EDA White Paper
Datasheet (13)
- Radar Systems with AWR Software
- 5G Systems with AWR Software
- Module Design with AWR Software Datasheet
- AWR Software Product Portfolio Datasheet
- Protium S1 FPGA-Based Prototyping Platform
- Legato Reliability Solution Cadence
- Perspec System Verifier Datasheet
- Protium S1 Single-FPGA Board Datasheet
- vManager Metric-Driven Signoff Platform Datasheet
- Virtuoso ADE Verifier Datasheet
- Palladium Z1 Enterprise Emulation Platform Datasheet
- Protium FPGA-Based Prototyping Platform Datasheet
- Allegro FPGA System Planner Datasheet
Videos
Customers
Due to the Palladium Z1 platform's capacity to handle our billion gate-class designs and its highly sophisticated debug and advanced multiuser capabilities, all in a small form factor, we will be able to design and deliver our next generation GPU and Tegra designs with high quality and on schedule.
Narenda Konda, Director of Engineering, NVIDIA
Processors for automotive and industrial markets are driving higher levels of integration and complexity. This requires larger design partitions to deliver the efficiencies and time to market demanded by our customers.
Anthony Hill, Director of Processor Technology, Texas Instruments
Electrically aware design can enable us to save several iterations on the design of each block sensitive to parasitic effects. Depending on block complexity, design time savings can range from half a day to several days per block.
Martin Kejhar, Senior Technical Staff Engineer and Scientist, ON Semiconductor