Key Benefits

With over 25 years of advanced packaging experience, we enable our customers to generate higher bandwidth, lower power consumption, and reduce area without traditional process scaling.

Heterogeneous Integration

Allows heterogeneous integration of different dies for 2.5D or 3D designs

Performance and Power

Power efficiency through smaller interconnects without compromising performance

Maximum Functionality

Support for numerous applications in AI, datacenter, graphics, and mobile communications ICs with a smaller form factor


Cadence provides a comprehensive suite of packaging, IP, implementation, test, analysis, and verification products to address the requirements of 3D-IC design for digital SoCs, analog/mixed-signal designs, and entire systems.



Die Package Planning and Route Optimization

To efficiently plan and assess connectivity and route feasibility in your 3D-IC design, look to Cadence OrbitIO™ Interconnect Designer. You’ll be able to quickly evaluate the connectivity between the die and package in the context of your full system. You’ll also be equipped to make or refine decisions, then immediately visualize the impact on adjacent fabrics within this single tool. This capability will help you cut down on iterations between silicon and package design teams.

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Logic Die Design for Test DFT

When you’re ready to test, look to our Genus™ Synthesis Solution and Modus DFT Software products for logic die design for test (DFT). Using these tools, you can perform a DFT insertion to test the die-to-die interconnect, including silicon interposers.

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Logic Die Implementation

For logic die implementation, look to our Innovus™ Implementation System and the Cadence Physical Verification System (PVS). With unique capabilities in place and route, optimization, and clocking, the Innovus Implementation System delivers production-proven power, performance, and area (PPA) advantages as well as faster turnaround times. An Innovus plug-in provides functions for 3D-IC designs, including creation of TSVs and micro-bumps. The Cadence PVS can perform design rule checking (DRC) as well as layout vs. schematic (LVS) that runs multiple die verification concurrently.

If your design also contains analog components, you can use this same flow. Integrated into this flow, our Virtuoso® custom design platform can support custom 3D-IC realization, from TSV feed-through implementation on the memory die to the mapping of memory die bumps to the logic die.

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Signoff and Analysis

In the analysis and signoff phase, you’ll need to validate your design, ensuring that the inter-die in your 3D implementation is correct. You can use our Cadence PVS to perform a cross die check. You’ll also need to evaluate electrical performance. On the digital side, we offer an array of tools for extraction and timing and power signoff

Quantus™ Extraction Solution provides parasitic extraction and analysis for TSVs, micro-bumps, and other characteristics associated with 3D technologies. 

Tempus™ Timing Signoff Solution provides silicon-accurate timing signoff and signal integrity analysis across multiple dies

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Thermal Management

Cadence offers a unique capability for thermal management of 3D-IC designs. Our Voltus™ IC Power Integrity Solution generates a power map that is fed into the Celsius™ Thermal Solver, which uses this power consumption data to determine the temperature distribution for each die. This data then goes back to the Voltus solution for temperature-dependent IR drop analysis. If you need to run thermal analysis through many iterations, the Voltus solution's GUI allows you to invoke the thermal engine within the solution to get the temperature results automatically displayed at the die level.

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