Multi-Die 3D-IC Solution

• Custom and Analog Design for 3D-ICs: Our offerings for custom and analog design provide a robust framework for integrating 3D-IC components with advanced layout features, schematic-driven design, and automation tools. These offerings empower designers to manage intricate 3D-IC layouts while maintaining accuracy and consistency across multiple layers and components. With support for complex design rules and manufacturability checks, teams can confidently optimize designs for both performance and production readiness. Photonics integration further enhances the platform's ability to address the unique challenges of hybrid electronic-photonic systems.
• Digital Implementation for 3D-ICs: Delivering a comprehensive digital implementation solution, our offerings and methodologies support hierarchical design approaches, advanced synthesis, and placement optimization to address the unique challenges of 3D-IC architectures. High-performance engines enable rapid convergence on PPA goals, while robust timing and power analysis ensure designs meet stringent requirements. This streamlined approach reduces iterations, accelerates time to market, and ensures design success.

By leveraging our 3D implementation offerings, designers can efficiently navigate the path to cutting-edge 3D-IC designs, ensuring both innovation and manufacturability.

Integrity 3D-IC Platform
Virtuoso Studio
Virtuoso Heterogeneous Integration

• Designing High-Density Packaging: We offer a comprehensive design environment that supports the creation of intricate interconnects, multi-layer substrate designs, and advanced wafer-level redistribution layer (RDL) stacks. With features like on-the-fly library development, constraint-driven routing, and signal integrity analysis, teams can efficiently manage the complexities of packaging technologies while ensuring first-pass success. Explore the Allegro X Advanced Package Designer Platform.
• Evaluating Connectivity and Feasibility: Tools for connectivity assessment and route feasibility enable quick evaluation of the relationship between die and package substrates in the context of the full system. Designers can visualize the impact of adjacent fabrics within a single environment, reducing iterations between silicon and package design teams and streamlining collaboration.

By leveraging our packaging solution, designers can confidently implement complex packaging technologies that meet the demands of modern applications. Our offerings and approach ensure high performance, reliability, and efficiency while reducing design iterations and accelerating the path to production.

Allegro X Advanced Package Designer Platform
Clarity 3D Solver
Sigrity X Platform

• Interposer and Package Analysis: Tools for interposer and package-level analysis enable precise modeling of parasitics, signal and power integrity, and thermal performance. Designers can evaluate interconnect performance, manage heat dissipation, and ensure reliability in densely packed 3D-IC designs. Our tools also support electromagnetic simulation for high-speed interconnects and provide insights into the impact of packaging structures on overall system performance. By addressing these challenges early, teams can reduce the number of design iterations and improve manufacturability.
• Die-Level Signoff: A suite of die-level signoff tools ensures that each die in the 3D-IC stack meets stringent performance and reliability standards. From timing closure and parasitic extraction to power integrity and physical verification, these tools provide the insights needed to optimize performance and ensure compliance with manufacturing and design rules. Early thermal feedback helps identify and mitigate potential issues, while test generation and coverage analysis enhance the testability and quality of logic dies. This comprehensive approach ensures that every die contributes to the overall success of the 3D-IC design.

By integrating 3D analysis and signoff into your workflow, you can confidently navigate the complexities of 3D-IC design. This approach ensures robust performance, reliability, and manufacturability while reducing the risk of late-stage redesigns.

Multiphysics System Analysis
Signoff Solutions

• IP for Chiplets: Chiplet-based designs rely on specialized IP to enable efficient integration and communication between individual dies. Our IP solutions support high-bandwidth, low-latency interconnects that ensure reliable data transfer across chiplets, optimizing performance while minimizing power and area. These solutions are tailored to meet the needs of diverse applications, from high-performance computing to mobile devices.
• Die-to-Die Connectivity: Reliable die-to-die communication is critical for achieving system efficiency in 3D-IC designs. Our IP solutions provide scalable, high-performance interconnects that support seamless data transfer between dies. With features like low-latency operation and high throughput, these solutions ensure robust connectivity while addressing the unique challenges of 3D-IC architectures.
• Chiplet Reference Designs: To accelerate development, we offer reference designs that demonstrate best practices for integrating chiplets into 3D-IC systems. These designs provide a proven framework for achieving optimal performance, reliability, and scalability, helping teams reduce development time and streamline the path to production.
• Design Services for Chiplets: Partner with Cadence to overcome the complexities of 3D-IC design. Our advanced SiP technologies and production-proven methodologies ensure seamless integration, scalability, and manufacturability. With secure collaboration infrastructure and expert engineering teams, we deliver tailored solutions that accelerate development and achieve first-pass silicon success.

By leveraging our IP solutions for 3D-IC, designers can unlock the full potential of their architectures, ensuring seamless communication, scalability, and performance across chiplets and dies. These solutions empower teams to meet the demands of modern applications while reducing design complexity and time to market.

Silicon Solutions Portfolio
Chiplet-Based SoC Design
Cadence Services for Chiplets