The Cadence® AWR Design Environment® platform provides RF/microwave engineers with integrated high-frequency circuit (Microwave Office®), system (Visual System Simulator™ (VSS)), and electromagnetic (EM) simulation (AXIEM®/Analyst™) technologies and electronic design automation (EDA) to develop physically realizable electronics ready for manufacturing. The platform helps designers create RF/microwave IP with the aid of complex IC, package, and PCB modeling, simulation, and verification, and address all aspects of circuit behavior to achieve optimal performance and reliable results for first-pass success.
Cadence RF/microwave solutions enable design teams to build and assemble ICs and interposers, PCBs, and modules from a wide array of process technologies through proven capabilities in its EDA software portfolio. The interoperable platform includes the Cadence Allegro® PCB Editor for the design of PCBs and systems in package (SiP), the Cadence Virtuoso® platform for the design of RFICs and modules, and the Cadence AWR® platform for monolithic microwave IC (MMIC) and RF PCB IP design.
A powerful and intuitive user interface ensures optimal engineering productivity with smart, customizable design flows for today's high-frequency semiconductor and PCB technologies
System, circuit, and EM simulation technologies are integrated for fast and accurate analysis of device performance prior to prototype manufacturing and test, saving development time and costs
RF IP created within AWR software can be integrated systems designed with newer process technologies and integration methodologies using the Cadence RFIC, PCB, and SiP design platforms and advanced RF workflows
Unified Design Capture
Provides a front-to-back physical design flow with dynamically linked electrical and layout design entry. Components placed in an electrical schematic automatically generate a synchronized physical layout based on libraries of standard, customized, and/or vendor-provided components, foundry-developed process design kits (PDKs) and Allegro parts libraries.
Simulation and Analysis
Integrates circuit, system, and EM/multiphysics simulation technologies for investigating linear and nonlinear network behavior. Designers can perform in-situ EM extraction of interconnects, conduct EM analysis for design verification of large/complex RF structures, perform thermal analysis on power devices, develop component specifications from system link budgets, and analyze device performance with system testbenches for communication standards.
The powerful application programming interface (API) extends the capabilities of the software using popular programming languages, providing user-defined scripts for automating common or complex tasks and custom design flows.
Interoperability and Manufacturing
Interoperability enables the exchange of schematic and layout design with the Virtuoso and/or Allegro platforms, fully integrated EM co-simulation, electrical-rule check (ERC)/design-rule check (DRC)/layout vs. schematic (LVS), and production-ready GDSII, DXF, and Gerber file export. Additionally, powerful yield analysis and optimization capabilities address manufacturing tolerances for more robust designs and greater profitability.
Supports complex hierarchical projects with parameterized subcircuits for easy optimization and tuning. Circuit, system, or EM-based subcircuits can be quickly developed and used to populate larger, more complex networks common in today’s RF front-end circuitry.