Key Benefits
Chip / Package Co-Design
Create higher performing, lower cost packages
Multi-Chip(let) Design
Robust support for multi-chip(let) heterogeneously integrated designs
Comprehensive Design
Analysis and verification flow for fan-out wafer-level package (FOWLP)
Reference Flows
Support for major foundry and OSAT advanced packaging
Training and Support
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Training
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Online Support
The Cadence Online Support (COS) system fields our entire library of accessible materials for self-study and step-by-step instruction.
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Technical Forums
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