Chip / Package Co-Design
Create higher performing, lower cost packages
Multi-Chip(let) Design
Robust support for multi-chip(let) heterogeneously integrated designs
Comprehensive Design
Analysis and verification flow for fan-out wafer-level package (FOWLP)
Reference Flows
Support for major foundry and OSAT advanced packaging
White Paper
Chiplets and Heterogeneous Packaging Are Changing System Design and Analysis
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Video
Corning Provides Reliable Optical Solution to the World Using Sigrity Technology
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Video
Design and Performance Consideration of Silicon Interposer, Wafer-Level Fan-Out and Flip Chip BGA Packages
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