Chip / Package Co-Design
Create higher performing, lower cost packages
Multi-Chip(let) Design
Robust support for multi-chip(let) heterogeneously integrated designs
Comprehensive Design
Analysis and verification flow for fan-out wafer-level package (FOWLP)
Reference Flows
Support for major foundry and OSAT advanced packaging
Video
CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
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Video
CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
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White Paper
Overcoming Signal, Power, and Thermal Challenges Implementing GDDR6 Interfaces
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