Overview

Unified AI Thermal Analysis Empowering Electrical and Mechanical Engineers with In-Design Multiphysics Simulation

Cadence Celsius Studio is the industry’s first complete AI-enabled thermal platform for electronic systems to address thermal analysis and thermal stress, as well as electronics cooling. While current offerings consist mostly of point tool solutions, Celsius Studio introduces an entirely new approach with a unified platform that lets both electrical and mechanical/thermal engineers concurrently design and analyze from within a single platform without the need for geometry simplification, manipulation, and/or translation.

Celsius Studio Platform

Revolutionizing thermal analysis with AI-driven multiphysics integration

CelsiusPowerDC Celsius ECSolver Celsius Thermal Solver
Celsius PowerDC Celsius EC Solver Celsius Thermal Solver

Key Benefits

Unlock Efficiency and Precision While Gaining Innovative Insights, Saving Design Time, and Optimizing Resources

In-Design Analysis

Harness the synergy of Cadence's robust portfolio of technologies elevating electronic design to unprecedented heights

Design Insight

Enables fast and efficient exploration of the full design space to converge on the optimal design through integrated AI-driven technology

Complete System Thermal Analysis

Combines finite element method (FEM) with computational fluid dynamics (CFD) for total system analysis

Applications

Solving Your Most Complex Thermal Challenges with In-Design Analysis

Celsius SOC
Celsius in MMIC
Celsius in IC Packaging
Celsius in PCB Design

Next Steps

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Capabilities

Fast, Reliable Thermal Analysis for Systems and Beyond   

Introducing complete shift left, in-design thermal analysis, a pivotal approach in modern electronics design, aiming to detect and prevent defects early in the process. This strategy integrates thermal analysis seamlessly throughout the design phases, from chip to PCB to system level. With artificial intelligence (AI) and machine learning (ML) technologies, the Cadence Celsius Studio platform optimizes component integration, enhancing system efficiency and performance across diverse industries, from automotive to biomedical markets.

Experience the Power of Electrothermal Innovation 

The Celsius Studio Platform seamlessly supports all ECAD and MCAD file formats, boasting robust material and component managers for comprehensive electrical and thermal simulations. With capabilities for static and transient electrothermal co-simulation, Celsius Studio integrates seamlessly with Cadence's renowned Clarity 3D Solver, Sigrity X Platform, and Spectre Simulation platform, ensuring unmatched precision and efficiency.

Elevate Your Design's Structural Integrity with Mechanical Stress Analysis

The Celsius Studio Platform empowers designers with advanced support for linear and nonlinear material structural models, alongside static and quasi-static solvers for precise warpage and stress analysis. Dive deeper with specialized moisture and high-temperature, high-humidity (HTHH) analysis capabilities. Seamlessly perform multi-stage simulations for assembly processes and ensure material reliability. With global and local models for 3D-IC warpage and stress simulation, Celsius Studio ensures your design's resilience at every level. 

Unleash the Power of Cadence.AI 

The Celsius Studio Platform pioneers AI-enabled optimization for unparalleled thermal design and management. Dive into Monte Carlo analysis and sensitivity studies for rigorous DFM validation, alongside thermal RC and compact model generation for comprehensive network simulation. Experience lightning-fast thermal performance evaluation with the metamodel chip/package/server, ensuring rapid and accurate characterization.

Assure Your Design with In-Design Analysis 

The Celsius Studio Platform seamlessly integrates with many Cadence platforms, ushering in early detection and mitigation of thermal challenges. Experience thermally aware digital IC design and optimization through Innovus Implementation System integration, while Virtuoso Studio integration elevates custom IC design. Dive into thermally aware MMIC design and optimization with AWR Design Environment Platform integration, and ensure precision with Allegro X integration for package and PCB board design. With Integrity 3D-IC Platform integration, Celsius Studio enables seamless exploration and optimization of thermally aware 3D-IC designs.

Unlock Peak Performance with Electronics Cooling 

The Celsius Studio Platform goes beyond conventional bounds, offering dynamic electronics cooling simulation to optimize the thermal efficiency of entire electronic ecosystems. Experience a revolution in performance-driven design. 

Products

Powerful Full-System Thermal Analysis from Chip to Package to Board and End System 

Celsius Thermal Solver

The industry's first complete electrothermal co-simulation solution, combing FEA and CFD analysis. Detect and mitigate thermal issues early, streamline development cycles, and foster seamless collaboration across leading design platforms.

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  • Transient as well as steady-state analysis enables accurate electrothermal co-simulation to analyze transient, steady-state, and heat conduction in complicated solid structures
  • Unlock critical operating temperature data effortlessly for in-depth reliability and performance studies
  • Import and analyze large package and PCB designs in full detail with no input simplification and perform joule-heating, stress, and warpage analysis
  • Accurately simulate thermal-induced stress and strain in solid allows designers to pinpoint problem areas and avoid costly product reliability issues
  • Advanced finite-element method (FEM) meshing technology makes meshing any complex system fast and easy

Celsius EC Solver

Maximize performance with our cutting-edge electronics cooling software. Seamlessly analyze complex designs to mitigate product failure risks and optimize thermal solutions, while its intuitive UI saves design time and ensures precise simulations.

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  • Object-based meshing feature adapts the mesh to ensure accurate analysis of the device. Rules can be optionally defined, providing meshing guidance to ensure that the individual objects are simulated correctly
  • Parallel processing technology distributes simulation tasks across multiple cores and multiple machines, enabling fast analysis of complex electronics designs in both transient and steady-state simulation modes
  • Imports complex mechanical computer-aided design (MCAD) models from Creo Parametric, SOLIDWORKS, CATIA, and other major MCAD tools. Imported MCAD models can be analyzed without simplification
  • Automatically places intelligent modeling objects within the system-level model, providing automatic object-based mesh generation, determining the ideal grid size for a simulation, and automatically checking for collision and modeling errors before solving

Celsius Advanced PTI

Boost PDN design efficiency with seamless integration of accurate thermal modeling within your design tools. This innovative solution reduces costs and time by identifying issues early, guarantees reliable power delivery with thorough AC, DC, and power-ripple analysis, and optimizes PDNs across the board/package interface, all while streamlining system-level power analysis through an intuitive block-based schematic editor.

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  • Automatically set up DC simulations using PowerTree data (source/sink definitions) captured at the schematic stage of the design process
  • Identifies difficult-to-locate, highly resistive routing neck-downs and finds the one via among thousands that will fail under stress
  • Determines if it is possible to reduce plane layers without adding DC or thermal reliability risk
  • Reduces PDN cost for new designs and post-production products
  • Intuitive and interactive visualization of PDN performance

Celsius PowerDC

Experience the pinnacle of efficient DC analysis for IC package and PCB signoff, integrating electrothermal co-simulation to guarantee reliable power delivery and minimize field failure risks. Benefit from cost savings, quicker turnarounds, and definitive IR drop analysis for both package and board designs.

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  • Automatically set up DC simulations using PowerTree data captured at the schematic stage to define sources/sinks, visualize the power portion of your schematics, and conduct pre-layout simulations without copper, aiding in component selection to meet design criteria
  • Identify difficult-to-locate highly resistive routing neck-downs and finds the one via among thousands that will fail under stress
  • Determine if it is possible to reduce plane layers without adding DC or thermal reliability risk
  • Assess multi-structure PCB and package designs along with chip-level information
  • Consider what-if improvement options with a unique block-diagram results view, and a range of visualization options
  • Patented automation to pinpoint the best remote sense line location
  • Comprehensive support for multi-structure designs including stacked die, multiple boards, and all popular package types
  • Optimized for flows with Allegro X Advanced Package Designer and Allegro X Design Platform
  • Accepting a mix of CAD databases where needed for multi-structure design support, including Mentor, Zuken, and Altium flows

features

Celsius Studio Platform Highlights

By enabling early thermal simulations, our platform empowers designers to preempt costly implementations, engineering delays, and field failures. Seamlessly collaborate with mechanical engineering teams to minimize late-stage design iterations and ensure optimal product performance from the outset. 

Feature name Description
Multiphysics Technology and Field Solvers  Combining robust FEA solvers for comprehensive system analysis with advanced finite-element method (FEM) meshing technology, the Celsius Studio Platform streamlines and expedites the meshing process for complex systems. 
Transient and Steady State Analysis  Accurate electrothermal co-simulation is facilitated through both transient and steady-state analysis, allowing for thorough examination of heat conduction in intricate solid structures. 
Massively Parallelized Execution Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy when analyzing 3D-ICs and complex 3D structures.
Electrothermal Reliability Seamless, simple, and easy integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations. 
Temperature Data Design engineers have ready access to operating temperature data for reliability and performance studies.
Thermal Stress and Strain Accurate simulation of thermal-induced stress and strain in solid, allows designers to pinpoint problem areas and avoid costly product reliability issues.
Thermal-Aware DC Analysis Efficient DC analysis for IC package and PCB signoff, including electrical/thermal co-simulation for accuracy, swiftly identifing excessive IR drop, current density areas, and thermal hotspots, minimizing the risk of field failure.
AC Analysis Thorough AC frequency analysis for boards and IC packages, rapidly identifying optimal decap selections and placement locations, ensuring PDN specifications are met at minimal cost.
Power-Ripple Analysis A streamlined power ground noise simulation workflow directly from Sigrity X Platform, eliminating the need for complex S-parameter model extraction. With Sigrity X Platform integration, achieve stable time-domain power integrity simulations for PCBs or IC packages efficiently.
Sigrity Topology Explorer This versatile topology exploration function enables exploration of power topologies across multiple fabrics. By linking the power ports of chips, packages, and boards, you can simulate complete source-to-sink connectivity. Utilizing PDN models created with Sigrity X Platform or Clarity 3D Solver, excited by a voltage regulator module (VRM) model, provides a time-domain view of PDN voltage at critical points from source to sink, facilitating identification of potential power delivery issues within system specifications.
MCAD Integration Import complex mechanical computer-aided design (MCAD) models seamlessly from PTC Creo, Solidworks, CATIA, and other major MCAD tools, allowing for analysis without simplification. Automatically position intelligent modeling objects within the system-level model, offering automatic object-based mesh generation, optimal grid size determination for simulations, and automatic collision and modeling error checks prior to solving.

resources

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