Overview
Unified AI Thermal Analysis Empowering Electrical and Mechanical Engineers with In-Design Multiphysics Simulation
Cadence Celsius Studio is the industry’s first complete AI-enabled thermal platform for electronic systems to address thermal analysis and thermal stress, as well as electronics cooling. While current offerings consist mostly of point tool solutions, Celsius Studio introduces an entirely new approach with a unified platform that lets both electrical and mechanical/thermal engineers concurrently design and analyze from within a single platform without the need for geometry simplification, manipulation, and/or translation.
Celsius Studio Platform
Revolutionizing thermal analysis with AI-driven multiphysics integration
Key Benefits
Unlock Efficiency and Precision While Gaining Innovative Insights, Saving Design Time, and Optimizing Resources
In-Design Analysis
Harness the synergy of Cadence's robust portfolio of technologies elevating electronic design to unprecedented heights
Design Insight
Enables fast and efficient exploration of the full design space to converge on the optimal design through integrated AI-driven technology
Complete System Thermal Analysis
Combines finite element method (FEM) with computational fluid dynamics (CFD) for total system analysis
Applications
Solving Your Most Complex Thermal Challenges with In-Design Analysis




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Capabilities
Fast, Reliable Thermal Analysis for Systems and Beyond
Introducing complete shift left, in-design thermal analysis, a pivotal approach in modern electronics design, aiming to detect and prevent defects early in the process. This strategy integrates thermal analysis seamlessly throughout the design phases, from chip to PCB to system level. With artificial intelligence (AI) and machine learning (ML) technologies, the Cadence Celsius Studio platform optimizes component integration, enhancing system efficiency and performance across diverse industries, from automotive to biomedical markets.
Experience the Power of Electrothermal Innovation

The Celsius Studio Platform seamlessly supports all ECAD and MCAD file formats, boasting robust material and component managers for comprehensive electrical and thermal simulations. With capabilities for static and transient electrothermal co-simulation, Celsius Studio integrates seamlessly with Cadence's renowned Clarity 3D Solver, Sigrity X Platform, and Spectre Simulation platform, ensuring unmatched precision and efficiency.
Elevate Your Design's Structural Integrity with Mechanical Stress Analysis

The Celsius Studio Platform empowers designers with advanced support for linear and nonlinear material structural models, alongside static and quasi-static solvers for precise warpage and stress analysis. Dive deeper with specialized moisture and high-temperature, high-humidity (HTHH) analysis capabilities. Seamlessly perform multi-stage simulations for assembly processes and ensure material reliability. With global and local models for 3D-IC warpage and stress simulation, Celsius Studio ensures your design's resilience at every level.
Unleash the Power of Cadence.AI

The Celsius Studio Platform pioneers AI-enabled optimization for unparalleled thermal design and management. Dive into Monte Carlo analysis and sensitivity studies for rigorous DFM validation, alongside thermal RC and compact model generation for comprehensive network simulation. Experience lightning-fast thermal performance evaluation with the metamodel chip/package/server, ensuring rapid and accurate characterization.
Assure Your Design with In-Design Analysis
The Celsius Studio Platform seamlessly integrates with many Cadence platforms, ushering in early detection and mitigation of thermal challenges. Experience thermally aware digital IC design and optimization through Innovus Implementation System integration, while Virtuoso Studio integration elevates custom IC design. Dive into thermally aware MMIC design and optimization with AWR Design Environment Platform integration, and ensure precision with Allegro X integration for package and PCB board design. With Integrity 3D-IC Platform integration, Celsius Studio enables seamless exploration and optimization of thermally aware 3D-IC designs.
Unlock Peak Performance with Electronics Cooling

The Celsius Studio Platform goes beyond conventional bounds, offering dynamic electronics cooling simulation to optimize the thermal efficiency of entire electronic ecosystems. Experience a revolution in performance-driven design.
Products
Powerful Full-System Thermal Analysis from Chip to Package to Board and End System
Celsius Thermal Solver
The industry's first complete electrothermal co-simulation solution, combing FEA and CFD analysis. Detect and mitigate thermal issues early, streamline development cycles, and foster seamless collaboration across leading design platforms.
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Celsius EC Solver
Maximize performance with our cutting-edge electronics cooling software. Seamlessly analyze complex designs to mitigate product failure risks and optimize thermal solutions, while its intuitive UI saves design time and ensures precise simulations.
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Celsius Advanced PTI
Boost PDN design efficiency with seamless integration of accurate thermal modeling within your design tools. This innovative solution reduces costs and time by identifying issues early, guarantees reliable power delivery with thorough AC, DC, and power-ripple analysis, and optimizes PDNs across the board/package interface, all while streamlining system-level power analysis through an intuitive block-based schematic editor.
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Celsius PowerDC
Experience the pinnacle of efficient DC analysis for IC package and PCB signoff, integrating electrothermal co-simulation to guarantee reliable power delivery and minimize field failure risks. Benefit from cost savings, quicker turnarounds, and definitive IR drop analysis for both package and board designs.
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features
Celsius Studio Platform Highlights
By enabling early thermal simulations, our platform empowers designers to preempt costly implementations, engineering delays, and field failures. Seamlessly collaborate with mechanical engineering teams to minimize late-stage design iterations and ensure optimal product performance from the outset.
Feature name | Description |
---|---|
Multiphysics Technology and Field Solvers | Combining robust FEA solvers for comprehensive system analysis with advanced finite-element method (FEM) meshing technology, the Celsius Studio Platform streamlines and expedites the meshing process for complex systems. |
Transient and Steady State Analysis | Accurate electrothermal co-simulation is facilitated through both transient and steady-state analysis, allowing for thorough examination of heat conduction in intricate solid structures. |
Massively Parallelized Execution | Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy when analyzing 3D-ICs and complex 3D structures. |
Electrothermal Reliability | Seamless, simple, and easy integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations. |
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