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Cadence Announces Broad IP Collaboration with GLOBALFOUNDRIES on 12LP/12LP+ Solutions
Cadence announced broad IP collaboration with GLOBALFOUNDRIES (GF) on the 12LP platform and 12LP+ solution encompassing support for advanced memory interfaces including DDR4, DDR5, GDDR6, LPDDR4X and LPDDR...

Released Date: 24 Sep 2020
GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design
Cadence announced a collaboration with GLOBALFOUNDRIES (GF) that resulted in the availability of a Mixed-Signal OpenAccess process design kit (PDK) that supports GF’s 22FDX platform.

Released Date: 24 Sep 2020
Cadence Wins Gold Stevie® Awards in the 2020 International Business Awards® Program
Cadence announced that it was named a winner in multiple categories in the 17th Annual International Business Awards®, winning the Gold Stevie® Award for Most Innovative Tech Company of the Year and for In...

Released Date: 17 Sep 2020
Kneron Boosts On-Device Edge AI Computing Performance with Cadence Tensilica IP
Cadence announced that Kneron has integrated the Cadence Tensilica Vision P6 DSP in its next-generation KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveill...

Released Date: 02 Sep 2020
Cadence's Sandhya Venkateshan and Alan Lindstrom to Present at D.A. Davidson Software & Internet Services Virtual Conference
Ms. Venkateshan and Mr. Lindstrom will participate in a virtual fireside chat at the D.A. Davidson Software & Internet Services Conference on September 9, 2020.

Released Date: 26 Aug 2020
Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions
Cadence announced the certification of the Cadence® tools in TSMC reference flows for TSMC’s latest InFO and CoWoS advanced packaging solutions, the Integrated Fan-Out with RDL interconnect (InFO-R) and Ch...

Released Date: 25 Aug 2020
Cadence Digital and Custom Flows Achieve Certification for TSMC N3 Process
Cadence announced that its digital full flow and custom tool suite has been optimized for TSMC’s 3nm (N3) process technology.

Released Date: 25 Aug 2020
Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes
Cadence announced the availability of its silicon-proven Cadence UltraLink D2D PHY IP on the TSMC N7 process.

Released Date: 24 Aug 2020
Nuvoton Accelerates the Development of its MCU Designs with the Cadence Palladium Z1 Enterprise Emulation Platform
Cadence today announced that Nuvoton has deployed the Cadence Palladium Z1 Enterprise Emulation Platform to accelerate the development of its MCUs for industrial and consumer applications.

Released Date: 18 Aug 2020
Cadence’s John Wall to Present at KeyBanc Future of Technology Series
Mr. Wall will participate in a virtual fireside chat at the KeyBanc Capital Markets Future of Technology Series on August 25, 2020.

Released Date: 18 Aug 2020
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