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CADENCE CLOUD

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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Genus Synthesis Solution
  • Conformal Smart LEC
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows

Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Virtuoso RF Solution
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus IC Power Integrity Solution
  • RESOURCES
  • Flows

Verification

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
  • Emulation and Prototyping
  • Formal and Static Verification
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • JasperGold Formal Verification Platform
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Interface IP
  • Denali Memory IP
  • Tensilica Processor IP
  • Analog IP
  • System / Peripherals IP
  • Verification IP

IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Omnis
  • Sigrity Advanced SI
  • Sigrity Advanced PI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • What's New in Sigrity
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

AI / Machine Learning

AI IP Portfolio

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  • Low Power
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  • RF / Microwave
See how our customers create innovative products with Cadence

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Training

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  • Tensilica Processor IP
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US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • Taiwan - 繁體中文
  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Genus Synthesis Solution
          • Conformal Smart LEC
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Virtuoso RF Solution
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus IC Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Emulation and Prototyping
          • Formal and Static Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • JasperGold Formal Verification Platform
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • Interface IP
          • Denali Memory IP
          • Tensilica Processor IP
          • Analog IP
          • System / Peripherals IP
          • Verification IP
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Omnis
          • Sigrity Advanced SI
          • Sigrity Advanced PI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • What's New in Sigrity
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
  • Solutions
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • Support
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • Company
      • Corporate
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        • Careers

Services

Helping you meet your broader business goals

  • Services
  • Design Services
  • Methodology Services
  • Silicon/Package/Board Services
  • VCAD Services

Cadence® Services specializes in collaborating with you on methodology and technology adoption, silicon enablement, and talent development to enhance productivity and reduce risk. Our world-class engineering services teams leverage advanced, production-proven design environments for analog/RF, mixed-signal, custom digital, and complex SoC design to address your unique requirements.

With 20+ years of experience, Cadence Services has a proven track record across a broad spectrum of industry segments—wired, wireless, medical, automotive, military/aerospace, and consumer electronics—in a range of process geometries including 16nm and below, for startups and large global customers alike. We've helped 600+ customers bring more than 1,700 innovative products to market. Our worldwide organization adapts to each customer's geographic needs and provides around-the-clock virtual teams focused on specific customer challenges.

Technology Focus Areas

While there is no such thing as a typical design, Cadence does see commonalities among the challenges our customers face when developing leading-edge devices. As such, we provide comprehensive support in specific focus areas, including:

  • Power-efficient design for both high-performance and ultra-low-power devices
  • Complex mixed-signal design and integration
  • Manufacturability solutions for customers migrating to advanced nodes
  • Functional verification for both digital and mixed-signal design
  • Process design kit creation for advanced custom design
  • Design foundations for new and emerging technologies

Collaboration Infrastructure

Effective and streamlined communication is a key to any successful services partnership. Cadence has developed a collaboration infrastructure and process that is unique in the industry. Secure "collaboration chambers" give you direct access to our engineering capabilities—regardless of geography—and ensure that both Cadence and your team members are working in a predictable environment with consistent data views.

Delivery Methods

  • Methodology and Technology Adoption: Our extensive expertise in production-proven methodologies ensures that you can adopt advanced Cadence technologies quickly and optimize their use, reducing risk and ramp-up time.
  • Design Services: Whether developing large power-efficient SoCs, complex mixed-signal designs, or key infrastructure components, our design services group collaborates with you to achieve your design goals.
  • Talent Development: To ensure that your teams are equipped with the skills they need, we offer a broad range of services, such as training, design-first collaborations, and knowledge transfer

Service Offerings

  • Accelerated adoption of new tools
  • Standardization of design systems and flows
  • Advanced design methodologies
  • Design team outsourcing and support
  • Custom PDK development and enablement
  • Advanced system-in-package (SiP) technologies including 3D-IC
  • Transition to advanced process nodes
  • Advanced functional verification
  • DFM support and validation
  • Library characterization
  • Design team ramp-up

Cadence Services is focused entirely on enabling the most efficient design capabilities for our customers. Our world-class engineering teams deliver the most advanced, efficient, and production-proven design systems for custom, digital, and complex SoC designs. By collaborating with you on methodology, design, and training—and by tailoring each engagement to your specific design, budget, and schedule needs—Cadence Services can help you meet your broader business and project goals.

Experience and Capabilities

Cadence Services has a proven track record of addressing our customers’ production design environment needs. We have experience with a broad array of industry segments—consumer electronics, wired and wireless communications, computing, automotive, and military/aerospace—in a range of process geometries including today’s leading process nodes.

  • More than 20 years of production-proven success with 600+ customers
  • Enabling thousands of products across more than 70 design processes
  • 99% first-pass silicon success for digital and mixed-signal SoCs
  • Low-power, mixed-signal, digital, and SoC expertise
  • 24x7 virtual team support via global services sites and VCAD collaboration infrastructure

Assets

  • Pre-packaged and custom-developed production-proven methodologies and environments to address customer design challenges and help designers accelerate technology-specific product development
  • Silicon-proven and customizable digital and analog/mixed-signal design components along with hardware/software verification IP
  • VCAD collaboration infrastructure provides secure networked chambers for project collaboration, giving customers access to our engineering capabilities, regardless of geography
  • Centers of Excellence to maximize customer access to our engineering expertise and capabilities.

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