PCB Design and Analysis

Key Benefits

Harness the potential of your entire design and engineer teams to solve the most complex design challenges. Collaborate across the wall, across design domains, on a single design or a complex multi-board PCB system. Track your design projects to success as design rules and design goals are established and met.

In-Design Analysis

Simulate early, simulate often

Multi-Board PCB Systems

Simplify the complex

Real-Time Collaborative Design

Build your teamwork

Product Categories

A complete, integrated, simulation-driven design solution for your entire electronic product design team.

Front-End Schematic Capture

Easy-to-use system architecture planning and schematic capture environment

Back-End Board Layout and Routing

Complete rules-based real-time PCB layout and routing environment

Library and Design Data Process Management

Manage a shared library of parts, symbols, and footprints to reduce time and errors

Analog/Mixed-Signal Simulation

Accurate modeling, design optimization, and validation to ensure functionality

SI/PI Analysis

Advanced integrated PI and power-aware SI tools to ensure better design performance

SI/PI Analysis Point Tools

Signal and power integrity analysis with signoff-level accuracy

Solutions

Multi-Board PCB System Design

Ensure connectivity and eliminate unnecessary system re-spins in your multi-board designs

PDN Design

Team-based constraint-driven PDN design flow for efficient communication between PCB designers and PI engineers

3D System Design Solutions

Visualize your complex high-speed systems and simulate signal integrity for signal and return paths to dies, packages, and PCBs as well as connectors, cables, sockets, and other mechanical structures

IC/Package/PCB Co-Design

Ensure shorter cycles times designing high-performance interfaces with cross-domain planning in a single design tool

Technologies

Industry-leading technology to solve the challenges that excite your creativity

Allegro Right First-Time Design

Avoid late-stage design changes and reworks with real-time design rule verification while you design

Allegro TimingVision Environment

Real-time visual feedback and detect timing issues right on your routing canvas

Augmented Reality Lab Tools

Accelerate inspection, debug, rework, and assemble PCBs in less time, without mistakes or frustration with augmented reality

Constraint-Driven PI Signoff

Ensure the power delivery network (PDN) constraints are being met so you can get your designs done faster and with less stress at signoff

Constraint-Driven PCB Layout

The constraint-driven design architecture provides a common, consistent system for creation, management, and validation of constraints from front to back to eliminate unnecessary iterations and cut your design cycle by weeks

Power-Aware Signal Integrity Analysis

Complete power-aware design and SI analysis solution ensures the entire design team understands all the signal integrity design considerations

Interface-Aware Approach

Hierarchical interface-aware approach to accelerate your PCB design authoring and implementation process—and increase design quality, performance, and reliability

Sigrity Serial Link Analysis

Check the compliance of all sections of multi-gigabit serial links to confirm that your product will perform to specification

Service Bureaus

List of independent service bureaus, providers, and contractors

Channel Partners Program

Need PCB design sales, support and training? Find a Cadence Channel Partner, leading companies in IC package and PCB design

Resources

video

Avoid Unexpected Manufacturing Problems

Press Release

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

Press Release

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

Video

CadenceTECHTALK: Integrated PI Analysis and Signoff of a 3D-IC System with Cadence Multi-Physics Solvers

News ReleasesVIEW ALL

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack 11/17/2021

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs 10/26/2021

Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis 03/16/2021

Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers 12/02/2020

Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications 12/02/2019