Thermal Live, the Celsius Webinar

12 Oct 2021

Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform

Industry’s first comprehensive 3D-IC platform for multi-chiplet design and advanced packaging

06 Oct 2021

Cadence Accelerates Development of Mobile, Automotive and Hyperscale Systems with the Helium Virtual and Hybrid Studio

The Helium Virtual and Hybrid Studio enables high-performance pre-silicon software validation in virtual and hybrid configurations for 5G, mobile, automotive, hyperscale and other markets

22 Sep 2021

Cadence Collaborates with GlobalFoundries to Qualify Pegasus Verification System for 12LP/12LP+ and 22FDX™ Technologies

Pegasus Verification System qualification enables customers to confidently perform physical verification for hyperscale, aerospace 5G communications, consumer and automotive designs

15 Sep 2021

Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform

New Tensilica AI engine boosts performance and AI accelerators provide a turnkey solution for consumer, mobile, automotive and industrial AI SoC designs

13 Sep 2021

Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon

Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications

08 Sep 2021