Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

17 Nov 2021

Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library

16 Nov 2021

Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications

16 Nov 2021

Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards, Featuring Key Advancements in 3DFabric Design and Cloud-Based Solutions

Joint development of 4nm design infrastructure and DSP IP also recognized

12 Nov 2021

Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices

New Tensilica HiFi 1 DSP delivers increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy

28 Oct 2021

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

26 Oct 2021