Cadence Advances RF Design with the Latest AWR Design Environment Platform

22 Jun 2021

New Cadence Tensilica FloatingPoint DSP Family Delivers Scalable Performance for a Broad Range of Compute-Intensive Applications

Low-energy DSP IP optimizes power, performance and area, offering up to 40% area savings for mobile, automotive, consumer and hyperscale computing markets

17 Jun 2021

Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform

10 Jun 2021

New Cadence Allegro X Design Platform Revolutionizes System Design

Allegro X Platform Offers Unparalleled Integration and Technology Across Multiple Engineering Domains, Delivering Up to 4X Productivity Improvements over Traditional Design Tools

08 Jun 2021

EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design

02 Jun 2021

Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

Joint customers successfully use the certified Cadence digital flow and custom/analog tool suite to complete test chip tapeouts on TSMC’s advanced processes

27 May 2021