GUC Optimizes Quality of Results and Accelerates Time to Tapeout Using the Cadence Digital Full Flow

07 Dec 2021

Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud

01 Dec 2021

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

17 Nov 2021

Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library

16 Nov 2021

Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications

16 Nov 2021

Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards, Featuring Key Advancements in 3DFabric Design and Cloud-Based Solutions

Joint development of 4nm design infrastructure and DSP IP also recognized

12 Nov 2021