17 Sep 2020

Cadence Wins Gold Stevie® Awards in the 2020 International Business Awards® Program

Awards Include Most Innovative Tech Company of the Year and Innovation of the Year for the Cadence Clarity 3D Solver

02 Sep 2020

Kneron Boosts On-Device Edge AI Computing Performance with Cadence Tensilica IP

Vision P6 DSP enabled Kneron to achieve up to a 2X performance gain for its next-generation SoC

25 Aug 2020

Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions

Customers creating multi-chip(let) advanced packages for hyperscale and networking applications can achieve accelerated productivity through streamlined design, analysis and verification reference flows

25 Aug 2020

Cadence Digital and Custom Flows Achieve Certification for TSMC N3 Process

Companies broaden collaboration to continue advancing mobile, AI and hyperscale electronics innovation

24 Aug 2020

Under the Hood of Xcelium ML

24 Aug 2020

Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes

NRZ-based die-to-die connectivity IP addressing cost-effective, multi-chip applications supports organic substrate packaging