15 Dec 2020

Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs

Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications

08 Dec 2020

Samsung Foundry Adopts Spectre X Simulator for 5nm Design

High capacity and scalability allowed Samsung Foundry to qualify its latest chips for advanced-node applications in the automotive, mobile, consumer and healthcare industries

02 Dec 2020

Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers

01 Dec 2020

Cadence Appoints Julia Liuson to Board of Directors

11 Nov 2020

Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator

Vidatronic achieved a 3X reduction in memory consumption on its analog IP designs for mobile, 5G, hyperscale and other consumer electronics

10 Nov 2020

L&T Technology Services Reduces Mobile and Communications Systems Design Cycle Time by Nearly 40 Percent with Cadence Clarity 3D Solver

Precise accuracy and higher throughput for 3D analysis of complex high-speed interconnects enables more robust designs