CadenceTECHTALK: What’s New in Sigrity 2021.1 – Korea

Sigrity 2021.1 Base has been released including many features highlighted. This webinar provides an overview of the new and enhanced features in Sigrity 2021.1 Base release.

CadenceTECHTALK Series: Reducing Design Cycle Time in Advanced Packaging

How can you accelerate PCB design cycle on your next PCB design starting from accurate creation of ECAD libraries from MCAD, design with manufacturing in mind and cutting down post-layout signoff iterations? Attend the Accelerate Design Cycle series of webinars to learn the best practices in Allegro to help you master techniques that help you cut down your design cycle time.

iMAPS Device Packaging

Join Cadence at the virtual 17th International Conference on Device Packaging, Where we will be showcasing our advanced IC packaging and cross-domain co-design automation; cross-platform, unified solution for RFIC and module design; foundry and OSAT reference flows supporting the latest advanced IC packaging technologies; and electro-thermal, power delivery, and signal integrity tools.

Cade​nceT​ECHTALK:​Hierarchical PI Analysis of Large Designs with Voltus Solution (Taiwan)​

Learn how you can use the Voltus IC Power Integrity Solution to run hierarchical analysis using IP modeling technology to create xPGV models of your IP blocks, accurately capturing the demand current and electrical parasitics.

Linley Spring Processor Conference 2021

This year, the Linley Spring Processor Conference will feature live-streamed presentations addressing processors and IP cores for AI applications, embedded, data center, automotive, and server designs. Join us as we introduce our comprehensive portfolio of DSP solutions—ranging from ultra-high-end mobile and multi-camera applications to always-on sensor and IoT applications.

CadenceTECHTALK Series: Scale Up System Simulations with Cadence Multiphysics Solvers

Join our multiphysics experts in their live sessions discussing the new generation of multiphysics solvers which are created with multi-core, cloud computing in mid with algorithms that produce virtually unlimited scalability, up to 10X performance gain and still gold standard accuracy.​

Bringing Supply Chain Intelligence to the Engineering Desktop - A Look at the Cadence/SiliconExpert Integration​

It's never too early to think about the viability of the components that you are adding to your design. When choosing a part, design engineers have the option of researching the inherent risks that come with it. Searching the Internet for the latest product information is not always the best use of an engineer’s time. Cadence and SiliconExpert have found a way get that information into the engineer’s hands using the design tool’s native interface. Join Bruce Riggins and Dwight Morse to find out how you can decrease the risk of your designs without ever leaving your design tool.​

CadenceTECHTALK: Successful IC Verification Program Management Using Data

Join this webinar and learn how the vManager platform’s out-of-the-box data analysis can help users review progress and quickly jump to areas that need attention. For more advanced analysis, we will touch on the vAPI and how it offers full flexibility to analyze the data and visualize results. Finally, we will discuss how machine learning will play a part in using data to make our lives easier.​

Electronic Systems SI/PI Forum​

Don't miss this half-day online Electronic Systems SI/PI Forum featuring industry leaders covering key design topics for SI/PI engineers. Watch Cadence experts present on Sigrity 2021: 10X Performance for Next-Gen SI/PI.

TTMA Annual Seminar

The Taiwan Thermal Management Association (TTMA) Annual Seminar gathers members from industry, research institutes, and academia to report on the development of heat dissipation technology. Visit the Cadence booth and learn more about the Celsius Thermal Solver.