CadenceTechTALK: Automate Chip Design with ML for Productivity and Performance Gains

Achieve 10X productivity and a 20% performance gain using machine learning to automate and optimize chip design. Attend this CadenceTECHTALK to hear how customers use the Cadence Cerebrus Intelligent Chip Explorer to achieve these results and more.

CadenceTECHTALK:Cadence System Analysis & PCB Webinar Series

Welcome to join this CadenceTECHTALK, which we prepare a series of wonderful online speeches and will share best practices for RF, package, and multiphysics analysis at all system levels by our Cadence experts.

European Test Symposium 2022

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing, reliability, security and validation. Join Cadence at 12:15PM on Thursday May 26, as we discuss how advanced DFT users using conventional 2D DFT methodologies can elevate their DFT flows to the fast-growing 3D IC packaging-based design flows.

ISCAS 2022

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society (CASS). The 2022 event will be focused on emerging issues in intelligent, ubiquitous, autonomous, mobile devices to promote multidisciplinary solutions for societal and engineering challenges. There will be keynotes, panel discussions, technical papers, special and focus sessions, an industry forum, and more. Register on the ISCAS website to secure your attendance.

CadenceTECHTALK：使用 Clarity 3D Solver进行快速简单的软硬结合板分析

Please join this free one-hour webinar to learn how to use Cadence® Clarity™ 3D Solver

Itherm 2022

Cadence is a panel sponsor at ITherm 2022, which co-exhibits with IEEE 72nd Electronic Components and Technology Conference, a premier electronics packaging conference in the U.S. ITherm 2022 includes panel discussions, keynote speeches by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition. Visit us in Booth 614 at ECTC to speak to our thermal experts and learn about the Celsius Thermal Solver—the electrothermal co-simulation solution for package and PCB designs.

Electronic Components and Technology Conference (ECTC) 2022

Cadence is a Gold-level sponsor at the IEEE 72nd Electronic Components and Technology Conference. Visit us in Booth 614 for the latest in advanced IC packaging technologies, and hear our packaging experts discuss design challenges with 3D packaging and multi-chiplet heterogeneous architectures. Join us on June 1 for the ECTC/ITherm Diversity and Career Growth Panel and Reception on “Solving Diversification Challenges and Workforce Retention Issues” with panelist KT Moore, VP, Corporate Marketing.

CadenceTECHTALK：Via modeling and optimization

Please join this free one-hour webinar to learn Cadence High Speed Structure Optimization

Benelux RF Conference

The Benelux RF Conference brings together Belgian and Dutch high-tech professionals and companies involved in the development and application of high-end RF techniques. Come and meet with Cadence Channel Partners HiTech RF to discuss Multiphysics System Analysis including circuit, system, and EM simulation for RF/microwave product development.

CadenceTECHTALK：电热联合仿真：提高热签核精度

Please join this free one-hour webinar to learn how to use Cadence® Celsius™ Thermal Solver