DVCon Europe 2022

Join Matt Graham, Product Engineering Group Director, on December 6 at 4pm for his presentation on Verification 2.0 – Multi-Engine, Multi-Run – AI-Driven Verification. This talk covers some of the near-term opportunities for applying AI and ML pragmatically to verification problems and presents potential future directions for AI and ML area. Be sure to visit booth #601 to learn how Cadence is leveraging big data and AI to optimize verification productivity and efficiency with the Verisium™ platform.

CadenceTECHTALK: テンシリカIPセミナー

サブシステムに要求されるプリプロセッシング、AI推論、ポストプロセッシング、Always-On(AON)、レーダーなど、それぞれの処理に最適なテンシリカIPとそれらにおいて包括的にサポートされている機能安全、セキュリティ機能について、具体的なパフォーマンスや採用事例なども交えながらテンシリカIPの最新状況をご紹介します。

Training Webinar: Solve Tricky SVA Problems with Jasper Visualize and WaveEdit

Join Cadence Training and Sr. Principal Education Application Engineer Mike Avery for this free technical Training Webinar. We’ll demonstrate how Jasper Visualize and WaveEdit provide an easy-to-use vehicle, so you can get the answers to your own questions—quickly and easily

CadenceCONNECT: Functional Verification Seminar 2022

Verisiumをはじめとする検証課題を解決する先進的ソリューションをご紹介します。

2022 EDA Workshop (Taiwan)

2022 電子設計自動化研討會將於12/10 &12/11於新竹關西舉辦，除了延續提升 EDA 產學界國際競爭力，也會探索產學界如何因應未來 EDA 與電子產業的變化、營造 EDA 領域人才創業的氛圍，以持續帶動國內 EDA 領域之研究發展。Join Cadence speech at EDA workshop to learn about 「The Future of Intelligent Chip Design」and visit our booth to know about Cadence and EDA industry.

EDAPS 2022

Cadence is a Silver Sponsor at the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2022 Virtual Conference. Designers and researchers share and discuss their work on all aspects of electrical packaging, including modeling, design and simulation, fabrication, and characterization.

CadenceTECHTALK: Best Practices to Achieve the Highest Performance using Xcelium Logic Simulator

Wondering how you can easily achieve up to 3X exemplary performance gains using Xcelium Logic Simulator. This webinar will provide a handy checklist of best practices covering umbrella performance switches, “access” levels, and simulation profiling to achieve the highest performance using Xcelium.

AI Everywhere Forum 2022

Cadence is a Platinum sponsor of the AI Everywhere Forum. Join us as Cadence technology experts discuss how AI is changing chip design, improving engineering productivity and automating design optimization, and enabling the next-generation technology drivers such as 5G, Hyperscale Computing, Industrial IoT, Autonomous Driving, and more.

CadenceTECHTALK: Generate the Best Mesh Every Time – Automatically

Unstructured meshing can automate much of the mesh generation process, saving significant engineering time and cost. However, controlling numerical errors resulting from the discrete mesh requires adaptation to the developing solution. Join this webinar to learn how Cadence CFD mesh adaptation methods use a continuous-size field that gets updated as the solution progresses. As a result, adherence to the underlying CAD geometry is maintained, and mesh quality is ensured.

SEMICON Japan 2022 - APCS 2022

ケイデンスのAdvanced Package向けの統合ソリューション（UCIe die-to-die (D2D) コネクティビティソリューション、Cadence 3D-IC設計ソリューション）をご覧ください。