2022 EDA Workshop (Taiwan)

2022 電子設計自動化研討會將於12/10 &12/11於新竹關西舉辦，除了延續提升 EDA 產學界國際競爭力，也會探索產學界如何因應未來 EDA 與電子產業的變化、營造 EDA 領域人才創業的氛圍，以持續帶動國內 EDA 領域之研究發展。Join Cadence speech at EDA workshop to learn about 「The Future of Intelligent Chip Design」and visit our booth to know about Cadence and EDA industry.

IEEE Electrical Design of Advanced Packaging and Systems 2022

Cadence is a Silver Sponsor at the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2022 Virtual Conference. Designers and researchers share and discuss their work on all aspects of electrical packaging, including modeling, design and simulation, fabrication, and characterization.

EDAPS 2022

Cadence is a Silver Sponsor at the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2022 Virtual Conference. Designers and researchers share and discuss their work on all aspects of electrical packaging, including modeling, design and simulation, fabrication, and characterization.

CadenceTECHTALK: Best Practices to Achieve the Highest Performance using Xcelium Logic Simulator

Wondering how you can easily achieve up to 3X exemplary performance gains using Xcelium Logic Simulator. This webinar will provide a handy checklist of best practices covering umbrella performance switches, “access” levels, and simulation profiling to achieve the highest performance using Xcelium.

AI Everywhere Forum 2022

Cadence is a Platinum sponsor of the AI Everywhere Forum. Join us as Cadence technology experts discuss how AI is changing chip design, improving engineering productivity and automating design optimization, and enabling the next-generation technology drivers such as 5G, Hyperscale Computing, Industrial IoT, Autonomous Driving, and more.

CadenceTECHTALK: Generate the Best Mesh Every Time – Automatically

Unstructured meshing can automate much of the mesh generation process, saving significant engineering time and cost. However, controlling numerical errors resulting from the discrete mesh requires adaptation to the developing solution. Join this webinar to learn how Cadence CFD mesh adaptation methods use a continuous-size field that gets updated as the solution progresses. As a result, adherence to the underlying CAD geometry is maintained, and mesh quality is ensured.

SEMICON Japan 2022 - APCS 2022

ケイデンスのAdvanced Package向けの統合ソリューション（UCIe die-to-die (D2D) コネクティビティソリューション、Cadence 3D-IC設計ソリューション）をご覧ください。

HiFiLeD Symposium 2022

Join us at HiFiLeD Symposium in December 2022. The topics will be range from issues concerning the complexity, reliability, accuracy and uncertainties in generating the High-Fidelity LES/DNS data, to their application towards turbulence and transition modeling. It will include progress on the underlying high-order numerical methods (HOMs), innovative approaches for CPU acceleration for LES and DNS, exploitation of massive parallel architectures, efficient post-processing on massive parallel hardware, innovative machine learning methods, as well as experimental data. Moreover, the Symposium offers the opportunity to communicate and exchange knowledge for academic researchers, graduate students, industrial engineers, as well as industrial R&D managers and consultants working in the fields of turbulent flow modeling, simulations, measurements, and multidisciplinary CFD applications.

CadenceCONNECT: Club Formal India

Cadence is pleased to once again bring you CadenceCONNECT: Club Formal, a platform for formal verification experts to come together and discuss the latest in formal technologies, including challenges, benefits, and best practices. Hear from your peers on how they are using formal verification techniques in their flows and interact with members of the Cadence® R&D team to discuss the technology, roadmap, and use cases. In this in-person seminar, you will hear an industry keynote, a Cadence R&D keynote on the latest in JasperTM technology, and several users who will discuss best practices. Plus, we will have deep technical demos and presentations by Cadence formal experts.

CadenceTECHTALK: チップ全体の最適化およびサインオフを10倍高速化するCertus Closure Solutionのご紹介

今年10月11日に発表した新製品Certus Closure Solutionを紹介いたします。並列分散同時処理によって、デザインの大きさに制限なく、タイミングおよびパワーの最適化を一晩で完了可能なソリューションの概要をユーザ事例と併せて説明いたします。