CadenceTECHTALK Series: Scale Up System Simulations with Cadence Multiphysics Solvers

Join our multiphysics experts in their live sessions discussing the new generation of multiphysics solvers which are created with multi-core, cloud computing in mid with algorithms that produce virtually unlimited scalability, up to 10X performance gain and still gold standard accuracy.​

COMPUTEX Taipei 2021

COMPUTEX 2021 Online Exhibition is held lively from May 31 to June 30. Cadence is excited to appear in COMPUTEX for the first time to share our fruitful results such as Allegro PCB Editor, Clarity 3D Solver​, Sigrity X Simulator, and Celsius Thermal Solver, which are under the Intelligent System De​​sign Strategy! Welcome to visit Cadence Virtual Booth to learn more about the products of Cadence!

IMS2021

IMS2021 will be centered around the theme of "Connecting for a Smarter, Safer World." and will feature both in person and virtual events. Cadence is an official sponsor of Wireless Internet at IMS live and will present a number of MicroApps at the virtual event.

CadenceTECHTALK: Package Layout in Allegro Package Designer Plus (17.4) – Tips & Tricks (Korea)

This webinar is intended for package designers who wish to maximize the performance of Cadence’s Allegro Package Designer for their environment. The webinar will include tips to help reduce the number of mouse clicks to travel to the options panel and operating large pin count design for performance improvements, as well as usage and examples to customize the environment to maximize productivity.​ Base release.

2021 Cadence中国技术巡回研讨会

2021 CadenceCONNECT: China Technology Day is coming soon! This year we will hold seminar in five cities including Beijing, Shanghai, Shenzhen, Chengdu and Xi’an. Cadence will bring you best practices and ideas. Warm​ly welcome you to join in us! ​

CadenceTECHTALK: Tensilica HiFi DSP面向NN算法开发的支持与应用TFLM​

This one-hour webinar gives an overview of how the Tensilica HiFi DSP endorses the future NN world and the benefits of using the HiFi DSP for advanced audio/voice processing.

ChipEx User Conference 2021

ChipEx is the largest annual event of the Israeli semiconductor industry, and Cadence will be attending as a major track sponsors in these two topics: Tensilica and Verification. Join us at this event and hear from our experts!

Boost Your Productivity with the Latest Version of OMNIS

A new particle solver, surface-to-volume meshing, and more than 100+ new capabilities to boost your productivity are available in the latest version of OMNIS. Witness its power during this live webinar and ask our expert your questions.

Solving the Voltage Drop Challenge Using Innovus-PI Signoff -Integrated Implementation

Join this webinar and learn how Cadence full flow power integrity (PI) solution delivers signoff integrated in-design IR drop closure to address your stringent IR requirements while maintaining the PPA targets. We will share the latest on the full flow PI / EM-IR closure solutions and also share results from challenging advanced-node designs.

Higher Performance and Longer Life for Turbomachinery Through Retrofitting Optimization

Aging equipment represents a serious challenge for engineers, often requiring retrofitting of entire rows or overhauling of the entire assembly. Learn how CFD simulation can optimize this process, extending rotating machinery life and increasing performance.