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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
    • VIEW ALL PRODUCTS
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        • Arm-Based Solutions
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        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
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        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
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        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
        • 5G Systems and Subsystems
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        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
        • Advanced Node
        • AI / Machine Learning
        • Arm-Based Solutions
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
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Low-Power Solution

A design-to-signoff methodology that is comprehensive, interoperable, and proven

  • Low-Power Solution
  • Power-Aware Verification
  • Power-Aware Implementation
Low-Power Solution
  • Contact Us

Key Benefits

  • Comprehensive solution for low power including architecture optimization, power estimation and analysis, functional verification, implementation and signoff, and IP for digital and mixed-signal designs at both chip and system level
  • Support for both industry-standard power intent formats (CPF and IEEE 1801), enabling customers to adopt the design flow of their choice
  • Production proven on thousands of designs mitigating risk of re-spins, reducing product development time and costs

With the emergence of wearables, smart appliances for home, industrial automation, automotive electronics, and big data processing, low-power design is no longer confined to the mobile device end markets. Power management touches every aspect of the design flow, from the architectural stage to chip and system signoff. Consequently, EDA tools have to take a holistic approach to low-power design.

The Cadence® low-power solution considers power at every step of the design flow, from architecture to functional verification, analysis, implementation, and signoff.

High-level synthesis (HLS) methodology users benefit from the power-aware architectural/micro-architectural choices available from a very high-level description of the design. This supports making the right trade-offs for power, performance, and area (PPA) at the earliest stages of the design when it matters the most. 

Once the RTL and power intent are available for analysis, the Cadence solution helps perform a sanity check of the power intent itself. This prevents unexpected surprises as the designer progresses through the low-power flow. The Cadence solution supports both the IEEE 1801 and CPF industry-standard formats for power intent. Simulation, emulation, and formal verification tools from Cadence are power-aware and verify the design interactions between functional and power modes in which the design is meant to operate. This helps to eliminate hard-to-find design or power intent bugs that could potentially cause chip and system failures in the field.

All aspects of implementation consider the power intent and make trade-offs and optimizations for leakage and dynamic power to deliver a low-power design with high Quality of Results (QoR). At every stage of implementation, the Cadence solution helps verify that the low-power design is compliant with the specified power intent. Signoff tools are power intent-driven as well, ensuring that the power intent has been implemented correctly to avoid re-spins and product delays and reduce product costs.

The Cadence low-power solution has also built links between the chip and system level to verify that the power integrity of the entire system is achieved in the context of the chip, board, and package.

Cadence has enabled the low-power flow for mixed-signal designs as well. Intellectual property (IP) in the form of embedded customizable processor cores and interface IP optimized for power consumption is available from Cadence.

Finally, the Cadence low-power solution has been used in production in thousands of designs.

  • Related Products

    • Stratus High-Level Synthesis
    • Genus Synthesis Solution
    • Innovus Implementation System
    • Tempus Timing Signoff Solution
    • Voltus IC Power Integrity Solution
    • Conformal Low Power
    • Joules RTL Power Solution
    • Perspec System Verifier
    • vManager Verification Management
    • Palladium Dynamic Power Analysis
    • Cadence Modus DFT Software Solution
    • Jasper Low-Power Verification App
    • Xcelium Logic Simulator
    • Palladium Z1 Enterprise Emulation Platform
    • Protium S1 Desktop Prototyping Platform
    • Palladium Dynamic Power Analysis
    • Indago Debug Analyzer
Resource Library

Video (12)

  • Hyperscale Computing and Cadence
  • Low-Power Mixed-Signal Verification of Freescale Kinetis Products
  • Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Intent
  • Developing 4G Wireless Designs with Cadence CPF-Driven Low-Power Solution
  • Accurate Low Power verification on a Complex Low Power Design using CLP
  • Freeescale Semiconductor - Cadence Low-Power Solution for Kinetis SoC
  • X-FAB Revamps Low-Power Design Flow with CPF
  • Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES
  • Low-Power Summit ARM Sathya Subramanian
  • Introducing Low-power Verification RAK
  • PMC - Power Estimation – An Evolving Science
  • Design Challenges in Developing Sub-Volt IP Designs for IoT Applications

Success Story Video (1)

  • Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES

Presentation (1)

  • Bluetooth Smart and Low-Power Innovation

Press Releases (1)

  • Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow | Cadence

White Paper (1)

  • Building Energy-Efficient ICs from the Ground Up White Paper
VIEW ALL
Videos

Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Intent

Developing 4G Wireless Designs with Cadence CPF-Driven Low-Power Solution

Accurate Low Power verification on a Complex Low Power Design using CLP

Freeescale Semiconductor - Cadence Low-Power Solution for Kinetis SoC

Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES

Low-Power Summit ARM Sathya Subramanian

News ReleasesVIEW ALL
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  • New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs 06/29/2022

  • Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success 06/28/2022

  • Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions 06/28/2022

  • Cadence Achieves PCIe 5.0 Specification Compliance for PHY and Controller IP in TSMC Advanced Technologies 06/21/2022

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