• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • Products
  • Solutions
  • Support
  • Company

Free Trials

Cadence.AI

  • Millennium Platform

    AI-driven digital twin supercomputer

  • Cadence Cerebrus AI Studio

    Multi-block, multi-user SoC design platform

  • Optimality Intelligent System Explorer

    AI-driven Multiphysics analysis

  • Verisium Verification Platform

    AI-driven verification platform

  • Allegro X AI

    AI-driven PCB Design

  • Tensilica AI Platform

    On-device AI IP

IC Design & Verification

  • Virtuoso Studio

    Analog and custom IC design

  • Spectre Simulation

    Analog and mixed-signal SoC verification

  • Innovus+ Platform

    Synthesis and implementation for advanced nodes

  • Xcelium Logic Simulation

    IP and SoC design verification

  • Silicon Solutions

    Protocol IP and Compute IP, including Tensilica IP

  • Palladium and Protium

    Emulation and prototyping platforms

System Design & Analysis

  • Allegro X Design Platform

    System and PCB design platform

  • Allegro X Adv Package Designer Platform

    IC packaging design and analysis platform

  • Sigrity X Platform

    Signal and power integrity analysis platform

  • AWR Design Environment Platform

    RF and microwave development platform

  • Cadence Reality Digital Twin Platform

    Data center design and management platform

  • Fidelity CFD Platform

    Computational fluid dynamics platform

  • All Analog IC Design Products

  • All Verification Products

  • All Digital Design and Signoff Products

  • All 3D-IC Design Products

  • All PCB Design Products

  • All 3D Electromagnetic Analysis Products

  • All Thermal Analysis Products

  • All Molecular Simulation Products

  • All Cadence Cloud Services and Solutions

  • All Products (A-Z)

Industries

  • 5G Systems and Subsystems
  • Aerospace and Defense
  • Automotive
  • Data Center Solutions
  • Hyperscale Computing
  • Life Sciences

Services

  • Services Overview

Technologies

  • Artificial Intelligence
  • 3D-IC Design
  • Advanced Node
  • Arm-Based Solutions
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • Low Power
  • Mixed-signal
  • Molecular Simulation
  • Multiphysics System Analysis
  • Photonics
  • RF / Microwave
Designed with Cadence See how our customers create innovative products with Cadence
Explore Cadence Cloud Now Explore Cadence Cloud Now

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Community Forums
  • OnCloud Help Center
  • Doc Assistant

Training

  • Computational Fluid Dynamics Courses
  • Custom IC / Analog / Microwave & RF Design Courses
  • Digital Design and Signoff Courses
  • IC Package Courses
  • Languages and Methodologies Courses
  • Mixed-Signal Design Modeling, Simulation, and Verification
  • Onboarding Curricula
  • PCB Design Courses
  • Reality DC
  • System Design and Verification Courses
  • Tech Domain Certification Programs
  • Tensilica Processor IP Courses
Stay up to date with the latest software
Cadence award-winning online support available 24/7
Connect with expert users in our Community Forums

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Channel Partners
  • Technology Partners
  • Corporate Social Responsibility
  • Cadence Academic Network
  • Intelligent System Design

Culture and Careers

  • Careers
  • Culture
  • One Team

Media Center

  • Cadence Events
  • Events
  • Newsroom
  • Blogs
Cadence Giving Foundation
Premier Cadence Events

This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  • Products

    • Products

      Cadence.AI

      • Millennium Platform

        AI-driven digital twin supercomputer

      • Cadence Cerebrus AI Studio

        Multi-block, multi-user SoC design platform

      • Optimality Intelligent System Explorer

        AI-driven Multiphysics analysis

      • Verisium Verification Platform

        AI-driven verification platform

      • Allegro X AI

        AI-driven PCB Design

      • Tensilica AI Platform

        On-device AI IP

    • Products

      IC Design & Verification

      • Virtuoso Studio

        Analog and custom IC design

      • Spectre Simulation

        Analog and mixed-signal SoC verification

      • Innovus+ Platform

        Synthesis and implementation for advanced nodes

      • Xcelium Logic Simulation

        IP and SoC design verification

      • Silicon Solutions

        Protocol IP and Compute IP, including Tensilica IP

      • Palladium and Protium

        Emulation and prototyping platforms

    • Products

      System Design & Analysis

      • Allegro X Design Platform

        System and PCB design platform

      • Allegro X Adv Package Designer Platform

        IC packaging design and analysis platform

      • Sigrity X Platform

        Signal and power integrity analysis platform

      • AWR Design Environment Platform

        RF and microwave development platform

      • Cadence Reality Digital Twin Platform

        Data center design and management platform

      • Fidelity CFD Platform

        Computational fluid dynamics platform

    • All Analog IC Design Products
    • All Verification Products
    • All Digital Design and Signoff Products
    • All 3D-IC Design Products
    • All PCB Design Products
    • All 3D Electromagnetic Analysis Products
    • All Thermal Analysis Products
    • All Molecular Simulation Products
    • All Cadence Cloud Services and Solutions
    • All Products (A-Z)
  • Solutions

    Industries

    • 5G Systems and Subsystems

    • Aerospace and Defense

    • Automotive

    • Data Center Solutions

    • Hyperscale Computing

    • Life Sciences

    Services

    • Services Overview

    Technologies

    • Artificial Intelligence

    • 3D-IC Design

    • Advanced Node

    • Arm-Based Solutions

    • Cloud Solutions

    • Computational Fluid Dynamics

    • Functional Safety

    • Low Power

    • Mixed-signal

    • Molecular Simulation

    • Multiphysics System Analysis

    • Photonics

    • RF / Microwave

    Designed with Cadence See how our customers create innovative products with Cadence
    Explore Cadence Cloud Now Explore Cadence Cloud Now
  • Support

    Support

    • Support Process

    • Online Support

    • Software Downloads

    • Computing Platform Support

    • Customer Support Contacts

    • Community Forums

    • OnCloud Help Center

    • Doc Assistant

    Training

    • Computational Fluid Dynamics

    • Custom IC / Analog / RF Design

    • Digital Design and Signoff

    • IC Package

    • Languages and Methodologies

    • Mixed-Signal Design Modeling, Simulation, and Verification

    • Onboarding Curricula

    • PCB Design

    • Reality DC

    • System Design and Verification

    • Tech Domain Certification Programs

    • Tensilica Processor IP

    Stay up to date with the latest software
    Cadence award-winning online support available 24/7
    Connect with expert users in our Community Forums
  • Company

    Corporate

    • About Us

    • Designed with Cadence

    • Investor Relations

    • Leadership Team

    • Computational Software

    • Alliances

    • Channel Partners

    • Technology Partners

    • Corporate Social Responsibility

    • Cadence Academic Network

    • Intelligent System Design

    Culture and Careers

    • Careers

    • Culture

    • One Team

    Media Center

    • Cadence Events

    • Events

    • Newsroom

    • Blogs

    Cadence Giving Foundation
    Premier Cadence Events

Free Trials

Low-Power Solution

A design-to-signoff methodology that is comprehensive, interoperable, and proven

  • Low-Power Solution
  • Power-Aware Verification
  • Power-Aware Implementation
  • Contact Us
  • Contact Us

Key Benefits

  • Comprehensive solution for low power including architecture optimization, power estimation and analysis, functional verification, implementation and signoff, and IP for digital and mixed-signal designs at both chip and system level
  • Support for both industry-standard power intent formats (CPF and IEEE 1801), enabling customers to adopt the design flow of their choice
  • Production proven on thousands of designs mitigating risk of re-spins, reducing product development time and costs

With the emergence of wearables, smart appliances for home, industrial automation, automotive electronics, and big data processing, low-power design is no longer confined to the mobile device end markets. Power management touches every aspect of the design flow, from the architectural stage to chip and system signoff. Consequently, EDA tools have to take a holistic approach to low-power design.

The Cadence® low-power solution considers power at every step of the design flow, from architecture to functional verification, analysis, implementation, and signoff.

High-level synthesis (HLS) methodology users benefit from the power-aware architectural/micro-architectural choices available from a very high-level description of the design. This supports making the right trade-offs for power, performance, and area (PPA) at the earliest stages of the design when it matters the most. 

Once the RTL and power intent are available for analysis, the Cadence solution helps perform a sanity check of the power intent itself. This prevents unexpected surprises as the designer progresses through the low-power flow. The Cadence solution supports both the IEEE 1801 and CPF industry-standard formats for power intent. Simulation, emulation, and formal verification tools from Cadence are power-aware and verify the design interactions between functional and power modes in which the design is meant to operate. This helps to eliminate hard-to-find design or power intent bugs that could potentially cause chip and system failures in the field.

All aspects of implementation consider the power intent and make trade-offs and optimizations for leakage and dynamic power to deliver a low-power design with high Quality of Results (QoR). At every stage of implementation, the Cadence solution helps verify that the low-power design is compliant with the specified power intent. Signoff tools are power intent-driven as well, ensuring that the power intent has been implemented correctly to avoid re-spins and product delays and reduce product costs.

The Cadence low-power solution has also built links between the chip and system level to verify that the power integrity of the entire system is achieved in the context of the chip, board, and package.

Cadence has enabled the low-power flow for mixed-signal designs as well. Intellectual property (IP) in the form of embedded customizable processor cores and interface IP optimized for power consumption is available from Cadence.

Finally, the Cadence low-power solution has been used in production in thousands of designs.

  • Related Products
    • Stratus High-Level Synthesis
    • Genus Synthesis Solution
    • Innovus Implementation System
    • Tempus Timing Solution
    • Voltus IC Power Integrity Solution
    • Conformal Low Power
    • Joules RTL Power Solution
    • Perspec System Verifier
    • vManager Verification Management
    • Palladium Dynamic Power Analysis
    • [REDIRECT] Jasper Low-Power Verification App
    • Xcelium Logic Simulator
    • Palladium Emulation
    • Protium S1 Desktop Prototyping Platform
    • Palladium Dynamic Power Analysis
    • Indago Debug Analyzer
    • Jasper RTL Apps
Resource Library
  • Low-Power Mixed-Signal Verification of Freescale Kinetis Products
  • Accurate Low Power verification on a Complex Low Power Design using CLP
      • A Better Tool for Functional Verification of Low-Power Designs with IEEE 1801 UPF White Paper
      VIEW ALL
      Videos

      Low-Power Mixed-Signal Verification of Freescale Kinetis Products

      Freeescale Semiconductor - Cadence Low-Power Solution for Kinetis SoC

      Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Intent

      Accurate Low Power verification on a Complex Low Power Design using CLP

      Hyperscale Computing and Cadence

      X-FAB Revamps Low-Power Design Flow with CPF

      News ReleasesVIEW ALL
      • Cadence Accelerates Physical AI Applications with Tensilica NeuroEdge 130 AI Co-Processor 05/08/2025

      • Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design 05/07/2025

      • Cadence’s Nimish Modi to Present at Needham Conference 05/05/2025

      • Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications 04/29/2025

      • Cadence Reports First Quarter 2025 Financial Results 04/28/2025

      Blogs VIEW ALL
      Fortune: 100 Best Companies to Work for 2025

      A Great Place to Do Great Work!

      Tenth year on the FORTUNE 100 list

      Wall Street Journal Best Managed Companies

      The Wall Street Journal

      Best Managed Companies

      Our Culture Join The Team

      Products Products

      • Custom IC and RF
      • Digital Design and Signoff
      • IC Package
      • Silicon Solutions
      • PCB Design
      • System Analysis
      • Verification
      • All Products

      Company Company

      • About Us
      • Leadership Team
      • Investor Relations
      • Alliances
      • Channel Partners
      • Technology Partners
      • Careers
      • Cadence Academic Network
      • Supplier

      Media Center Media Center

      • Events
      • Newsroom
      • Designed with Cadence
      • Blogs
      • Forums
      • Glossary
      • Resources

      Contact Us Contact Us

      • Customer Support
      • Media Relations
      • Global Office Locator
      • Information Security

      Sign up to receive the latest Cadence news

      Thank you for subscribing. You will get an email to confirm your subscription.

      English (US)
      • English
        United States
      • 简体中文
        China
      • 日本語
        Japan
      • 한국어
        Korea
      • 繁體中文
        Taiwan

      © 2025 Cadence Design Systems, Inc. All Rights Reserved.

      • US Trademarks
      • Terms of Use
      • Privacy
      • Cookie Policy
      • Accessibility
      • Do Not Sell or Share My Personal Information

      © 2025 Cadence Design Systems, Inc. All Rights Reserved.