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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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  • Products
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Integrity 3D-IC Platform
          • Cadence Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Voltus IC Power Integrity Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
      • Custom IC / Analog / RF Design
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • Verification
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
      • IP
        • PRODUCT CATEGORIES
          • 112G/56G SerDes
          • Chiplet and D2D
          • Denali Memory Interface and Storage IP
          • Interface IP
          • PCIe and CXL
          • Tensilica Processor IP
        • RESOURCES
          • Discover PCIe
      • IC Package Design and Analysis
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • Multiphysics System Analysis
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
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          • Fidelity CFD
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          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • Embedded Software
      • PCB Design and Analysis
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • Allegro X Design Platform
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
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        • Photonics
        • RF / Microwave
      • Industries
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        • Hyperscale Computing
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        • Computational Fluid Dynamics
        • Functional Safety
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • Industries
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        • Automotive
        • Hyperscale Computing
      • Technologies
        • 3D-IC Design
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        • AI / Machine Learning
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Clarity 3D Solver

True 3D electromagnetic field solver for PCB
and IC package design

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Key Benefits

  • Up to 10X faster than legacy 3D field solvers while maintaining gold-standard accuracy
  • True 3D analysis to avoid error-prone divide-and-conquer methodology
  • Solve larger structures with the same computing resources
  • Architecture runs on hundreds of CPUs optimized for both cloud and on-premises distributed computing
  • Easily reads design data from all standard chip, PCB, and IC package platforms and offers unique integration with Cadence implementation platforms
  • Combines with Cadence Microwave Office® software to provide a best-in-class antenna/phased array design and analysis solution

Cadence® Clarity™ 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. The Clarity 3D Solver lets you tackle the most complex electromagnetic (EM) challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning applications with gold-standard accuracy.

Industry-leading Cadence distributed multiprocessing technology enables the Clarity 3D Solver to deliver virtually unlimited capacity and 10X speed required to efficiently and effectively address these larger and more complex structures. It creates highly accurate S-parameter models for use in signal integrity (SI), power integrity (PI), and electromagnetic compliance (EMC) analysis, enabling simulation results that match lab measurement, even at 112Gbps+ data transfer speeds. The Clarity 3D Solver can solve the true 3D structure by efficiently matching the available computing resources to the size of the design.

ASK US A QUESTION

Save Design Time with Parallelization

Historically, large structures have been manually cut up into smaller structures for analysis using the largest and most powerful computing resources. No more. We designed the Clarity 3D Solver from the ground up to take advantage of your multi-core compute resources by parallelizing the mathematical tasks required to solve for 3D structures. The tasks can be parallelized within one computer’s cores or across multiple computers, cutting the time to solve for complex structures by 10X and even more.

Industry-leading parallelization technology ensures that both meshing and frequency sweeping can be partitioned and parallelized across as many computers, computer configurations, and cores as are available. The amount of time required to solve is scalable based on the number of computer cores. If a user can double the number of computer cores, performance will be nearly doubled as well.

clarity-3d-solver-em-600px
Clarity 3D Solver EM software optimizes the connector-PCB interface and models critical 3D interconnect from TX to RX.
Cost Savings Solving for 3D Structures with Cloud Infrastructure

Using web-based cloud servers to solve 3D structures can be an alternative to purchasing computing hardware. Instead of choosing large and costly servers, designers using the Clarity 3D Solver can select lower cost cloud-computing resources and still maintain the highest performance. This flexibility can produce considerable savings on the cost of cloud computing expenses when solving for 3D structures.

Complete Design and Analysis Flow

The Clarity 3D Solver is a key component in the intelligent system design methodology required by advanced electronic product design teams. With a complete design and analysis flow from Cadence, you will be empowered to create reliable and competitive products, deliver on-time and on-budget, and increase your market share.

Features
  • Enhanced usability: Automatically matches computing resources available to the structure being solved, so 3D experts and non-3D experts can get accurate results in a timely manner
  • Breakthrough parallelization: Allows engineering managers more flexibility when budgeting for computer configurations required for 3D simulation
  • Flexibility: Brings true 3D analysis to any engineer with either desktop, on- premises, or cloud HPC resources
  • Maximizing resources: No fear of early termination due to computer resources being fully consumed if only a small number of cores is available
  • Available to users of all design platforms: Easily reads design data from all standard chip, IC package, and PCB platforms
  • Integrated 3D solutions: Easily integrate with Cadence Allegro® Package Designer Plus SiP Layout Option, Virtuoso®, and Allegro platforms to optimize in the analysis tool and implement in the design tool without being redrawn
  • Model EM interface: Merge mechanical structures such as cables and connectors with their system design and model an EM interface as a single model

Contact Us

file


Clarity 3D Solver for EM Analysis
of RF/Microwave Systems
Read DataSheet
Fast and Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
Read More
Socionext America Cuts 3D Full Wave EM Analysis Time by 7X with Clarity 3D Solver
Download Presentation
  • Related Products

    • Sigrity SystemSI
    • Cadence PCB: Back-End Board Layout and Routing
    • Allegro Package Designer Plus
    • Allegro Package Designer Plus SiP Layout Option
    • Virtuoso RF Solution
    • Virtuoso System Design Platform
    • Celsius Thermal Solver
    • Clarity 3D Transient Solver

Resources

video

True 3D System Analysis with Faster Speeds, More Capacity, and Integration

Videos

Clarity 3D Solver Empowering 112G SerDes and DDR4 Design Analyses

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 1

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 2

True 3D System Analysis with Faster Speeds, More Capacity, and Integration

News ReleasesVIEW ALL
  • Cadence Shifts into High Gear with McLaren Racing 05/25/2022

  • Cadence Ushers in New Era of Performance and Accuracy for Multiphysics System Simulation with Fidelity CFD 04/19/2022

  • Butterfly Network Leverages Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design 12/14/2021

  • Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack 11/17/2021

  • Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs 10/26/2021

Blogs VIEW ALL
Customers

With the Cadence Clarity 3D Solver, we can achieve the necessary accuracy in a fraction of the time it has previously taken. This has opened up a new era of analysis possibilities for us since we can now run dozens of simulations in the time it has previously taken to run one.

Rick Burns, vice president of engineering, Semiconductor Test Division at Teradyne

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