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CADENCE CLOUD

Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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IP

An open IP platform for you to customize your app-driven SoC design.

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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

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System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
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        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
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        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
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        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
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        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
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      • SUPPORT
        • Support Process
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        • Support Process
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Clarity 3D Solver

True 3D electromagnetic field solver for PCB
and IC package design

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Key Benefits

  • Up to 10X faster than legacy 3D field solvers while maintaining gold-standard accuracy
  • Up to 10X capacity enables true 3D model analysis
  • Architecture runs on hundreds of CPUs optimized for both cloud and on-premises distributed computing
  • Easily reads design data from all standard chip, PCB, and IC package platforms and offers unique integration with Cadence implementation platforms

Cadence® Clarity™ 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. The Clarity 3D Solver lets you tackle the most complex electromagnetic (EM) challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning applications with gold-standard accuracy.

Industry-leading Cadence distributed multiprocessing technology enables the Clarity 3D Solver to deliver virtually unlimited capacity and 10X speed required to efficiently and effectively address these larger and more complex structures. It creates highly accurate S-parameter models for use in signal integrity (SI), power integrity (PI), and electromagnetic compliance (EMC) analysis, enabling simulation results that match lab measurement, even at 112Gbps+ data transfer speeds. The Clarity 3D Solver can solve the true 3D structure by efficiently matching the available computing resources to the size of the design.

ASK US A QUESTION
Save Design Time with Parallelization

Historically, large structures have been manually cut up into smaller structures for analysis using the largest and most powerful computing resources. No more. We designed the Clarity 3D Solver from the ground up to take advantage of your multi-core compute resources by parallelizing the mathematical tasks required to solve for 3D structures. The tasks can be parallelized within one computer’s cores or across multiple computers, cutting the time to solve for complex structures by 10X and even more.

Industry-leading parallelization technology ensures that both meshing and frequency sweeping can be partitioned and parallelized across as many computers, computer configurations, and cores as are available. The amount of time required to solve is scalable based on the number of computer cores. If a user can double the number of computer cores, performance will be nearly doubled as well.

Clarity 3D Solver EM software optimizes the connector-PCB interface and models critical 3D interconnect from TX to RX.
Cost Savings Solving for 3D Structures with Cloud Infrastructure

Using web-based cloud servers to solve 3D structures can be an alternative to purchasing computing hardware. Instead of choosing large and costly servers, designers using the Clarity 3D Solver can select lower cost cloud-computing resources and still maintain the highest performance. This flexibility can produce considerable savings on the cost of cloud computing expenses when solving for 3D structures.

Complete Design and Analysis Flow

The Clarity 3D Solver is a key component in the intelligent system design methodology required by advanced electronic product design teams. With a complete design and analysis flow from Cadence, you will be empowered to create reliable and competitive products, deliver on-time and on-budget, and increase your market share.

Features
  • Enhanced usability: Automatically matches computing resources available to the structure being solved, so 3D experts and non-3D experts can get accurate results in a timely manner
  • Breakthrough parallelization: Allows engineering managers more flexibility when budgeting for computer configurations required for 3D simulation
  • Flexibility: Brings true 3D analysis to any engineer with either desktop, on- premises, or cloud HPC resources
  • Maximizing resources: No fear of early termination due to computer resources being fully consumed if only a small number of cores is available
  • Available to users of all design platforms: Easily reads design data from all standard chip, IC package, and PCB platforms
  • Integrated 3D solutions: Easily integrate with Cadence Allegro® Package Designer Plus SiP Layout Option, Virtuoso®, and Allegro platforms to optimize in the analysis tool and implement in the design tool without being redrawn
  • Model EM interface: Merge mechanical structures such as cables and connectors with their system design and model an EM interface as a single model

Contact Us

file

 

Fast and Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver

Read More

True 3D system analysis with faster speeds, more capacity, and integration

Socionext America Cuts3D Full Wave EM Analysis Time by 7Xwith Clarity 3D Solver

DOWNLOAD PRESENTATION

EM Analysis: Why, When, and What?

Read Technical Brief
  • Related Products

    • Sigrity SystemSI
    • Cadence PCB: Back-End Board Layout and Routing
    • Allegro Package Designer Plus
    • Allegro Package Designer Plus SiP Layout Option
    • Virtuoso RF Solution
    • Virtuoso System Design Platform
    • Celsius Thermal Solver
    • Clarity 3D Transient Solver
Videos

Clarity 3D Solver Empowering 112G SerDes and DDR4 Design Analyses

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 1

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 2

True 3D System Analysis with Faster Speeds, More Capacity, and Integration

News ReleasesVIEW ALL
  • Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics 01/20/2021

  • Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs 12/16/2020

  • Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers 12/02/2020

  • L&T Technology Services Reduces Mobile and Communications Systems Design Cycle Time by Nearly 40 Percent with Cadence Clarity 3D Solver 11/10/2020

  • Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards 11/02/2020

Blogs VIEW ALL
Customers

With the Cadence Clarity 3D Solver, we can achieve the necessary accuracy in a fraction of the time it has previously taken. This has opened up a new era of analysis possibilities for us since we can now run dozens of simulations in the time it has previously taken to run one.

Rick Burns, vice president of engineering, Semiconductor Test Division at Teradyne

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