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DESIGN EXCELLENCE

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Digital Design and Signoff

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

  • Logic Equivalence Checking
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  • Functional ECO
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  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
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Custom IC / Analog / RF Design

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

  • Circuit Design
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  • Solve analog simulation challenges in complex designs Watch Now
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System Design and Verification

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

  • Debug Analysis
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  • Prototype your embedded software development Watch Now
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IP

An open IP platform for you to customize your app-driven SoC design.

  • Interface IP
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  • Analog IP
  • System / Peripherals IP
  • Verification IP
  • Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
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IC Package Design and Analysis

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

  • Cross-Platform Co-Design and Analysis
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  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

System Analysis

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions
  • System Analysis Resources Hub

Embedded Software

PCB Design and Analysis

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
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  • What's New in Allegro
  • What's New in Sigrity
  • RF / Microwave Design
  • Flows
  • Advanced PCB Design & Analysis Blog
  • Watch how to easily tackle complex and cutting edge designs. Learn More
  • Learn why signal integrity analysis needs to be power-aware Watch Now
  • Augmented Reality Lab Tools

AI / Machine Learning

AI IP Portfolio

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View all Products
  • PRODUCTS
    • DESIGN EXCELLENCE
      • Digital Design and Signoff
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • Custom IC / Analog / RF Design
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • System Design and Verification
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC Package Design and Analysis
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • System Analysis
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • Embedded Software
      • PCB Design and Analysis
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / Machine Learning
      • AI IP Portfolio
    • CADENCE CLOUD
  • SOLUTIONS
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G Systems and Subsystems
        • Aerospace and Defense
        • Automotive
        • AI / Machine Learning
      • TECHNOLOGIES
        • 3D-IC Design
        • Advanced Node
        • Arm-Based Solutions
        • Cloud Solutions
        • Low Power
        • Mixed Signal
        • Photonics
        • RF / Microwave
  • SUPPORT
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • COMPANY
      • CORPORATE
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      • MEDIA CENTER
        • Events
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      • CULTURE AND CAREERS
        • Culture and Diversity
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      • CORPORATE
        • About Us
        • Designed with Cadence
        • Investor Relations
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        • Computational Software
        • Alliances
        • Corporate Social Responsibility
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      • MEDIA CENTER
        • Events
        • Newsroom
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      • CULTURE AND CAREERS
        • Culture and Diversity
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      • CORPORATE
        • About Us
        • Designed with Cadence
        • Investor Relations
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        • Alliances
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Circuit Simulation

Block-level, chip-level, and mixed-signal simulation

  • Circuit Simulation

    • Spectre Simulation Platform
    • Spectre X Simulator
    • Spectre Accelerated Parallel Simulator
    • Spectre eXtensive Partitioning Simulator (XPS)
    • Spectre RF Option
    • Spectre AMS Designer

Block-Level Simulation

Cadence® custom simulation technology delivers all the tools required for designing and verifying your analog/mixed-signal blocks. Simulating blocks has evolved since the days of op-amps and comparators. Consider a typical block such as a fractional-N PLL that has more devices than some traditional analog chips. For block-level design, the steady-state analysis provided by the Spectre® platform can be invaluable for evaluating the noise and transfer functions of blocks like dynamic comparators, time-to-digital converters, et cetera. Block-level verification includes long transient simulations to calibrate blocks, for example, VCO calibration. For blocks, transistor-level simulation is used for verification and it may require transient noise analysis to simulate the key parameters like phase noise. 

Chip-Level Simulation

Leveraging custom design abstraction capabilities, Cadence chip-level simulation looks at all the blocks abstracted into a variety of languages combined with transistor-level blocks that converge on a whole design understanding. Cadence chip-level simulation solutions provide the large capacity and high performance required to ensure that a full chip is working as intended, regardless of how the blocks perform in aggregate.

Mixed-Signal Simulation

Today’s system-on-chip (SoC) designs integrate complex analog and digital blocks, requiring thorough testing and analysis of how analog and digital circuits interact and the influence they have on each other. Cadence mixed-signal simulation solution combines the industry-leading digital and analog circuit simulators: XceliumTM and Spectre, to provide designers and verification engineers superior performance and accuracy required for today’s designs.

With the Spectre platform, you have tools with a common infrastructure, advanced simulation database, versatile front-end parser, and a robust device library. Through integration with our Virtuoso®, Allegro®, and InnovusTM solutions, the Spectre tools deliver comprehensive design and verification.

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