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Digital Design and Signoff
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Custom IC / Analog / RF Design
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
An open IP platform for you to customize your app-driven SoC design.
IC Package Design and Analysis
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
PCB Design and Analysis
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
AI / Machine Learning
AI IP Portfolio
Culture and Careers
Imagination uses Cadence digital design and simulation solutions to deliver leading-edge GPU technology for automotive, mobile, and data center products.
Samsung uses Cerebrus ML to tune their digital implementation flow for the latest foundry nodes, automatically delivering 8% better PPA
Learn how Renesas has been using Cerebrus ML to optimize the digital implementation flow, delivering 15% lower power and 10% better performance.
Corning overcomes the speed, power, and material challenges using Sigrity technology.
Honda implements Cadence Computational Fluid Dynamics platform for solution automation.
Highly accurate and 3X faster simulation ensures IC designs function as intended and meet specifications.
Learn how Cadence technologies help create mmWave ICs for terrestrial and aerial radar.
DSP Concepts partnered with Cadence to create an AI-Optimized Audio framework for Cadence Tensilica HiFi processors.
Learn how Dynamic Duo 2.0 is becoming a game-changer technology for NVIDIA.
Palladium and Protium help AMD push emulation in capacity, next-gen testbench design, advanced clocking, and hybrid use.
ETNZ engineers explain why simulation is key to winning this edition and defending the trophy.
Hailo’s leading-edge solution for AI used Cadence digital design and signoff technology.
Green Hills Software partners with Cadence to leverage their respective strengths.
Fugaku, the world’s most powerful supercomputer addressing Arm-based high-density and high-performance LSI requirements, designed with Cadence.
Ambarella keeps pace with the market by minimizing the design cycle using Clarity 3D Solver.
Ambarella performs fast and accurate 3D analysis of AI vision processors
Find out how BabbleLabs is creating a revolution in speech power devices using Cadence Tensilica processors.
Toshiba speeds storage controller software development using Palladium Z1 and Protium S1 platforms
Samsung accelerated its ISP IP verification Using the Palladium Z1 Platform with UVM
Discover how Renesas used Cadence tools for faster performance analysis.
Discover how Toshiba is using the Tensilica Vision P6 DSP as an image recognition processor for ADAS applications.
Find out how Cadence helps overcome challenges faced while designing GPUs and SoCs.
Understanding how brains compute by using Cadence solutions to process artificial heart beats
Cadence Allegro tools used to build largest neuromorphic computer in the world