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Digital Design and Signoff
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
PRODUCT CATEGORIES
FEATURED PRODUCTS
Custom IC / Analog / RF Design
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Verification
Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
IP
An open IP platform for you to customize your app-driven SoC design.
RESOURCES
IC Package Design and Analysis
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Multiphysics System Analysis
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
Embedded Software
PCB Design and Analysis
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
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AI IP Portfolio
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Shinshu University develops a voice recognition system with Cadence for hands-free use of technology.
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Rodelta optimizes pumps using meshing and non-linear harmonic of Cadence’s Omnis CFD Platform
Raspberry Pi used Allegro X, Xcelium, and Digital Full Flow tools to design their popular computers.
EdgeQ delivers the world’s first 5G base station on a chip using Xcelium and Digital Full Flow
Learn how Sequans develops its next generation 5G IoT platform using Virtuoso RF Solution.
Learn how Nexite uses Cadence Liberate and Spectre technologies to design their NanoBT tag.
Imagination uses Cadence digital design and simulation solutions to deliver leading-edge GPU technology for automotive, mobile, and data center products.
Samsung uses Cerebrus ML to tune their digital implementation flow for the latest foundry nodes, automatically delivering 8% better PPA
Learn how Renesas has been using Cerebrus ML to optimize the digital implementation flow, delivering 15% lower power and 10% better performance.
Corning overcomes the speed, power, and material challenges using Sigrity technology.
Honda implements Cadence Computational Fluid Dynamics platform for solution automation.
Highly accurate and 3X faster simulation ensures IC designs function as intended and meet specifications.
Learn how Cadence technologies help create mmWave ICs for terrestrial and aerial radar.
DSP Concepts partnered with Cadence to create an AI-Optimized Audio framework for Cadence Tensilica HiFi processors.
Learn how Dynamic Duo 2.0 is becoming a game-changer technology for NVIDIA.
Palladium and Protium help AMD push emulation in capacity, next-gen testbench design, advanced clocking, and hybrid use.
ETNZ engineers explain why simulation is key to winning this edition and defending the trophy.
Hailo’s leading-edge solution for AI used Cadence digital design and signoff technology.
Green Hills Software partners with Cadence to leverage their respective strengths.
Fugaku, the world’s most powerful supercomputer addressing Arm-based high-density and high-performance LSI requirements, designed with Cadence.
Ambarella keeps pace with the market by minimizing the design cycle using Clarity 3D Solver.
Ambarella performs fast and accurate 3D analysis of AI vision processors
Find out how BabbleLabs is creating a revolution in speech power devices using Cadence Tensilica processors.
Toshiba speeds storage controller software development using Palladium Z1 and Protium S1 platforms
