Cadence® Voltus™ IC Power Integrity Solution is a full-chip, cell-level power signoff tool that provides accurate, fast, and high-capacity analysis and optimization technologies. The Voltus tool is of particular value to designers for debugging, verifying, and fixing IC chip power consumption, IR drop, and electromigration (EM) constraints and violations. Use the tool to:
The Voltus solution includes innovative technologies such as massively parallel execution, that can be either multi-threaded or distributed-processing, and physically aware power grid analysis and optimization. Beneficial as a standalone power signoff tool, Voltus IC Power Integrity Solution delivers even more significant productivity gains when used in a highly integrated flow with other key Cadence products, including Cadence Innovus™ Implementation System, providing the industry’s fastest design closure technology. When used with Cadence Voltus-Fi Custom Power Integrity Solution, a transistor-level electromigration and IR-drop (EMIR) tool delivering foundry-certified SPICE-level accuracy, the resulting platform accelerates IC power signoff and overall design closure.
Supported by major foundries and intellectual property (IP) providers, Voltus IC Power Integrity Solution has been validated and certified on advanced node processes such as 16nm/10nm/7nm FinFET and 28nm/22nm FDSOI and also included in reference design flows such as for 3D-IC technology.
Developed with advanced algorithms and a power integrity analysis engine with massively parallel execution, the solution:
As a global leader in embedded processing semiconductor solutions, Freescale is always on the lookout for new design tools that help us innovate and create at the most advanced levels of technology.
Ken Hansen, Vice President and Chief Technology Officer, Freescale Semiconductor
IDT produces industry-leading products across a wide range of nodes and applications, and we were pleased to see the Voltus technology delivers up to a 10X performance improvement across various test cases ranging from 180nm to 28nm designs.
Alan Coady, Senior Director, Design Automation Group, IDT
As the global leader in many-core processors, it is critical that Tilera selects the best design signoff technologies to achieve optimum performance-per-watt in our products while meeting aggressive time-to-market requirements.
John F. Brown III, Vice President of IC Engineering, Tilera
