Design complexity and signal speeds have increased. As we continue the path of providing more technology in smaller footprints, electromagnetic (EM) interconnect modeling has become a cornerstone of system analysis.
Cadence offers several types of EM field solvers that help you analyze EM coupling effects, signal coupling, EMI / EMC, and simultaneous switching noise (SSN). Whether your design challenge is developing a chip, package, PCB, or the complete subsystem, Cadence offers the right technology to address your EM modeling challenge quickly and efficiently.
Cadence can help you develop resistance-inductance-capacitance (RLC), package IBIS models, or S-parameter models with gold-standard accuracy in a fraction of the time of legacy field solver technology. Cadence EM solver technology includes:
- Silicon extraction (redistribution layer and/or silicon interposer)
- Full package modeling
- Full PCB modeling
- High-fidelity and full-system interconnect modeling