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  • Celsius Thermal Solver

Celsius Thermal Solver

Electrical-thermal co-simulation for system analysis

Celsius Thermal Solver Datasheet

Thermal Challenge Technical Brief

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Key Benefits

  • Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy
  • Integration with Cadence IC, package, and PCB implementation platforms accelerates and simplifies design iterations
  • Transient as well as steady-state analysis enable accurate electrical-thermal co-simulation
  • Combination of FEA and CFD provides total system analysis

The Cadence® Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture that delivers up to 10X faster performance than legacy solutions without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and PCB implementation platforms. This enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.

ASK US A QUESTION

Temperature profile of IC package interconnect structures
Multi-Physics Technology

IC and electronic systems companies, particularly those incorporating 3D-IC packaging, face tremendous thermal challenges that can cause late-stage design modifications and iterations and derail project schedules. As the electronics industry moves toward smaller, faster, smarter, and more complex products with greater power density, time-consuming thermal transient analysis techniques must be deployed together with traditional steady-state analysis to address multiple power profiles and increased heat dissipation. Further complicating the process, traditional thermal simulators require simplified models of the electronics and enclosures, resulting in reduced accuracy.

The Celsius Thermal Solver utilizes innovative multi-physics technology to address these challenges. By combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids, the Celsius Thermal Solver enables complete system analysis in a single tool.

 

Combination of FEA for solid structures with CFD for airflow
Integrated Solution and Transient Capability

When using the Celsius Thermal Solver in conjunction with the Clarity™ 3D Solver, Voltus™ IC Power Integrity, and Sigrity™ technology for PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both electricity and heat for a more accurate system-level thermal simulation than legacy tools. In addition, the Celsius Thermal Solver performs both static (steady-state) and dynamic (transient) electrical-thermal co-simulations based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behavior.

 

Transient electrical-thermal co-simulation example

 

By empowering electronics design teams to analyze thermal issues early and share ownership of thermal analysis, the Celsius Thermal Solver reduces design re-spins and enables new analysis and design insights not possible with legacy solutions. In addition, the Celsius Thermal Solver accurately simulates large systems with detailed granularity for any object of interest and is the first solution capable of modeling structures as small as the IC and its power distribution together with structures as large as the chassis.

REQUEST A DEMO

Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver

Rising to Meet the Thermal Challenge Technical Brief

DOWNLOAD TECHNICAL BRIEF

Customer Paper from
InterPACK

DOWNLOAD PAPER

  • Related Products

    • Voltus IC Power Integrity Solution
    • Virtuoso System Design Platform
    • Allegro PCB Designer
    • Allegro Package Designer
    • SiP Layout
    • Clarity 3D Solver
Videos

Announcing Celsius Thermal Solver, a New Approach to System-Level Thermal Analysis

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 1

An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 2

The Need for Electro-Thermal Co-simulation

Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver

News ReleasesVIEW ALL
  • Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications 12/02/2019

  • Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis 09/17/2019

  • Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design 04/02/2019

  • Cadence Introduces Voltus-XP Technology with Extensive Parallelism, Up to 5X Acceleration, and Increased Capacity for Power Signoff at Advanced Nodes 07/23/2018

  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis 07/19/2018

BlogsVIEW ALL
Customers

The Cadence Celsius Thermal Solver is tightly integrated with the Virtuoso platform, which makes electro-thermal simulations easily and directly accessible to advanced circuit, layout and package designers. The Celsius Thermal Solver offers fast turnaround times and accurate results.

Goeran Jerke, senior project manager EDA Research and Advance Development, Automotive Electronics Division, Robert Bosch GmbH

The addition of the Celsius Thermal Solver to Cadence’s system analysis portfolio allows our mutual customers to deliver next-generation electronic systems because we are now able to support thermal and electrical co-simulation in our design flows.

Vicki Mitchell, vice president of systems engineering, Central Engineering Group, Arm

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