Thermal and Stress Analysis of 3D-ICs
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Key Benefits
- Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy
- Integration with Cadence IC, package, and PCB implementation platforms accelerates and simplifies design iterations
- Transient as well as steady-state analysis enable accurate electrical-thermal co-simulation
- Combination of FEA and CFD provides total system analysis
- Provides RF engineers with ready access to operating temperature data for reliability and performance studies
The Cadence® Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture that delivers up to 10X faster performance than legacy solutions without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and PCB implementation platforms. This enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.
Temperature profile of IC package interconnect structures
Multi-Physics Technology
IC and electronic systems companies, particularly those incorporating 3D-IC packaging, face tremendous thermal challenges that can cause late-stage design modifications and iterations and derail project schedules. As the electronics industry moves toward smaller, faster, smarter, and more complex products with greater power density, time-consuming thermal transient analysis techniques must be deployed together with traditional steady-state analysis to address multiple power profiles and increased heat dissipation. Further complicating the process, traditional thermal simulators require simplified models of the electronics and enclosures, resulting in reduced accuracy.
The Celsius Thermal Solver utilizes innovative multi-physics technology to address these challenges. By combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids, the Celsius Thermal Solver enables complete system analysis in a single tool.
Combination of FEA for solid structures with CFD for airflow
Integrated Solution and Transient Capability
When using the Celsius Thermal Solver in conjunction with the Clarity™ 3D Solver, Voltus™ IC Power Integrity, and Sigrity™ technology for PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both electricity and heat for a more accurate system-level thermal simulation than legacy tools. In addition, the Celsius Thermal Solver performs both static (steady-state) and dynamic (transient) electrical-thermal co-simulations based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behavior.
Transient electrical-thermal co-simulation example
By empowering electronics design teams to analyze thermal issues early and share ownership of thermal analysis, the Celsius Thermal Solver reduces design re-spins and enables new analysis and design insights not possible with legacy solutions. In addition, the Celsius Thermal Solver accurately simulates large systems with detailed granularity for any object of interest and is the first solution capable of modeling structures as small as the IC and its power distribution together with structures as large as the chassis.
Customers
The Cadence Celsius Thermal Solver is tightly integrated with the Virtuoso platform, which makes electro-thermal simulations easily and directly accessible to advanced circuit, layout and package designers. The Celsius Thermal Solver offers fast turnaround times and accurate results.
Goeran Jerke, senior project manager EDA Research and Advance Development, Automotive Electronics Division, Robert Bosch GmbH
The addition of the Celsius Thermal Solver to Cadence’s system analysis portfolio allows our mutual customers to deliver next-generation electronic systems because we are now able to support thermal and electrical co-simulation in our design flows.
Vicki Mitchell, vice president of systems engineering, Central Engineering Group, Arm
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