Designers of systems for 5G, automotive, high-performance computing (HPC), IoT, and other advanced applications have been facing growing challenges in thermal profiling, the process of analyzing the complex interactions between electrical and thermal responses across chip, package, board, and chassis or enclosure.
The thermal analysis of ICs and electronic systems is made more complex by interconnected electrical and thermal effects. IC-centric factors (process technology, switching frequency, power grid geometries), package and PCB factors (materials, component placement, conductor geometries), and system factors (enclosure spacing, conduction, and air flow) must all be accounted for. Switching between system operating modes such as on, standby, low power, and sleep can result in unexpected transients, further complicating the analysis.
Cadence is committed to advancing system innovation through our core competency in computational software. Our thermal solutions are a key part of fulfilling that commitment.