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Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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客製IC/類比/RF設計

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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系統設計與驗證

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

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IC封裝設計與分析

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Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

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Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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ZH - Taiwan
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  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • 客製IC/類比/RF設計
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • 系統設計與驗證
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC封裝設計與分析
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • 嵌入式軟體
      • PCB設計與分析
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / 機器學習
      • AI IP系列
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      • Industries
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        • 航太與國防
        • 車用方案
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        • AI / 機器學習
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      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
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        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
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RF / Microwave Design

Circuit, system, and EM simulation for
RF/microwave product development

RF / Microwave Design
  • Contact Us
  • Related Products

    • EMX Planar 3D Solver
    • Virtuoso RF Solution
    • AWR Design Environment Platform
    • AWR Microwave Office
    • AWR VSS Software
    • AWR AXIEM Analysis
    • AWR Analyst Software
    • What's New in AWR
    • AWR E-Learning
    • AWR Support
Cadence Advances RF Design with Latest AWR Software
Learn More

To meet the high-performance and reduced footprint requirements for multi-mode/multi-band handsets, wireless smart devices, and aerospace systems, companies are differentiating themselves by developing best-in-class RF/microwave IP. Whether these products are MMIC-based or tightly integrated into a PCB and/or multi-functional module, designers of RF/microwave front-end electronics require specialized design and simulation capabilities to meet aggressive performance targets.

RF/microwave devices are defined by unique performance metrics, impacted by operating conditions, such as frequency, input power, bias and modulation waveform, temperature, and terminal impedances. In addition to operating conditions, performance is largely driven by the physical layout of the design itself, requiring a tight coupling between electrical and physical design.

Our RF/microwave design tools, such as the Cadence® AWR Design Environment® platform, AWR® Microwave Office® software, AWR Visual System Simulator™ (VSS) communications and radar systems design software, AWR AXIEM® 3D Planar EM Analysis, and AWR Analyst™ 3D FEM EM analysis, address these challenges with electrical/physical co-design through RF-aware device models, electromagnetic (EM) analysis along with specialized circuit simulation technology, and design support aids. RF product development also may require system-level analysis to simulate the behavior within a radar and communications link.

  • AWR Design Environment platform – Design platform provides RF/microwave engineers with integrated high-frequency circuit, system, and EM simulation technologies and design automation to develop physically realizable electronics ready for manufacturing
  • AWR Microwave Office software – Circuit design software with intuitive interface, innovative design automation, and powerful harmonic-balance circuit simulation ensure greater engineering productivity and accelerated design cycles
  • AWR VSS software – RF/wireless communications and radar system design software supports VSWR-aware modeling of RF and DSP blocks, providing time-domain, frequency-domain, and circuit-envelope analyses
  • AWR AXIEM analysis – 3D planar method-of-moments (MoM) EM analysis simulator addresses passive structures, transmission lines, large planar antennas, and patch arrays. AWR AXIEM analysis delivers the accuracy, capacity, and speed designers need to characterize and optimize passive components on RF PCBs, modules, LTCCs, MMICs, RFICs, and antennas
  • AWR Analyst software – 3D finite-element method (FEM) EM simulation and analysis software accelerates high-frequency product development from early physical design characterization through to full 3DEM verification. The advanced solver technology provides fast and accurate analysis of the 3D structures/interconnects found in today's complex high-frequency electronics
  • AWR What's New – Offers new and enhanced technologies that provide greater design efficiency and first-pass success to engineering teams developing or integrating III-V ICs, multi-technology modules, and PCB assemblies for 5G, automotive, and aerospace/defense applications
awr-rf-microwave-design-environment-600w

At the IC level, our advanced EM simulation tool, the Cadence EMX® Planar 3D Solver, allows designers to accurately and efficiently simulate large RF circuit blocks, characterize the behavior of passive components, and analyze the parasitics due to interconnect. The easy-to-use EMX Planar 3D Solver shortens design cycles and helps bring to market substantially better products with less risk. It seamlessly integrates with the Cadence Virtuoso® and Spectre® platforms. The simulator has been extensively used by foundries as the “golden” reference tool for IC characterization of passive components.

diemesh-600w
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