The electronics industry is seeing rapid growth of hyper-connected embedded systems, which are processing huge volumes of data on high-speed connections. The speed and close proximity of signals on silicon, through packages to boards and through connectors and cables exposes these communications to various kinds of interference, generates heat, and emits magnetic radiation. Careful analysis is required to assure these systems will work as designed under wide-ranging operating conditions and within compliance of standards and laws. The complexity of these devices and signal transmissions requires analysis and simulation throughout the product lifecycle to meet these objectives.
Cadence built its analysis and simulation solutions on many years of innovation and leadership of chip, package, and board design and analysis technologies:
- The Cadence® Clarity™ 3D Solver is for electromagnetic and power electronics analysis and simulation, providing 10X electromagnetic simulation performance, near-linear scalability, and true 3D system analysis. The product is designed for any chip, package, or board design and has a unique integration with the Virtuoso® and Allegro® platforms.
- The Cadence Celsius™ Thermal Solver, the first complete electrical-thermal co-simulation solution for electronic systems from ICs to physical enclosures, offers up to 10X faster performance, enables new system analysis and design insights, and allows electrical design teams to detect and mitigate thermal issues earlier. This product seamlessly integrates with Cadence IC, package, and PCB implementation platforms.