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DESIGN EXCELLENCE

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SYSTEM INNOVATION

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PERVASIVE INTELLIGENCE

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CADENCE雲端方案

數位設計流程

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

  • Logic Equivalence Checking
  • Innovus Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test
  • Flows
  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
  • Address digital implementation challenges with machine learning Watch Now

客製IC/類比/RF設計

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions
  • Flows
  • Solve analog simulation challenges in complex designs Watch Now
  • See how the Virtuoso Design Platform addresses advanced custom IC and system design challenges Watch Now

系統設計與驗證

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

  • Debug Analysis
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  • FPGA-Based Prototyping
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP
  • Flows
  • Prototype your embedded software development Watch Now
  • Learn how early firmware development enabled first silicon success at Toshiba Memory Watch Now

IP

An open IP platform for you to customize your app-driven SoC design.

  • Interface IP
  • Denali Memory IP
  • Tensilica Processor IP
  • Analog IP
  • System / Peripherals IP
  • Verification IP
  • Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
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IC封裝設計與分析

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows
  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

系統分析

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Thermal Solutions
  • System Analysis Resources Hub

嵌入式軟體

PCB設計與分析

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • What's New in Allegro
  • What's New in Sigrity
  • RF / Microwave Design
  • Flows
  • Advanced PCB Design & Analysis Blog
  • Watch how to easily tackle complex and cutting edge designs. Learn More
  • Learn why signal integrity analysis needs to be power-aware Watch Now
  • Augmented Reality Lab Tools

AI / 機器學習

AI IP系列

INDUSTRIES

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TECHNOLOGIES

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  • Photonics
  • RF / Microwave
See how our customers create innovative products with Cadence Explore Now

SUPPORT

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TRAINING

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
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  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • 客製IC/類比/RF設計
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • 系統設計與驗證
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC封裝設計與分析
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • 嵌入式軟體
      • PCB設計與分析
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / 機器學習
      • AI IP系列
    • CADENCE雲端方案
  • 解決方案
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
        • Cloud Solutions
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
        • Cloud Solutions
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
        • Cloud Solutions
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
        • Cloud Solutions
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
  • 支援與培訓
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • 公司資訊
      • CORPORATE
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      • CORPORATE
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      • CULTURE AND CAREERS
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      • CORPORATE
        • About Us
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SI/PI Analysis Point Tools

  • SI/PI Analysis Point Tools

    • Sigrity PowerSI
    • Sigrity PowerDC
    • Sigrity System Explorer
    • Sigrity SPEED2000
    • Sigrity SystemSI
    • Sigrity Broadband SPICE
    • Clarity 3D Solver

Cadence® power integrity (PI) solutions, based on Sigrity™ technology, provide signoff-level accuracy for AC and DC power analysis of PCBs and IC packages. Each tool seamlessly interfaces with Cadence Allegro® PCB and IC packaging physical design solutions.

Cadence power-aware signal integrity (SI) tools, based on Sigrity technology, provide signoff-level accurate SI analysis for PCBs and IC packages. Signoff-level SI accuracy of signals with frequency higher than 1GHz must consider the signals and the power/ground network that enables the current return path. Cadence power-aware SI tools interface seamlessly with Allegro PCB and IC packaging physical design tools to create a complete power-aware design and SI analysis solution for the entire design team to understand signal integrity design considerations.

Cadence package design and assessment tools, based on Sigrity technology, provide IC package design, analysis, and model extraction capability—and can exchange data with Allegro Package Designer. and its SiP Layout Option. Assessment capabilities allow you to quickly spot potential signal and power integrity issues. Model extraction capabilities provide unique full package model extraction with accuracy into the multi-GHz frequency range.

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