Home
  • 技術產品
  • 解決方案
  • 支援與培訓
  • 公司資訊
  • ZH TW
    • SELECT YOUR COUNTRY OR REGION

    • US - English
    • China - 简体中文
    • Japan - 日本語
    • Korea - 한국어

DESIGN EXCELLENCE

  • 數位設計流程
  • 客製IC/類比/RF設計
  • Verification
  • IP
  • IC封裝設計與分析

SYSTEM INNOVATION

  • Multiphysics System Analysis
  • 嵌入式軟體
  • PCB設計與分析
  • Computational Fluid Dynamics

PERVASIVE INTELLIGENCE

  • AI / 機器學習
  • AI IP系列

CADENCE雲端方案

VIEW ALL PRODUCTS

數位設計流程

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows
  • Voltus IC Power Integrity Solution

客製IC/類比/RF設計

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

系統設計與驗證

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
  • Virtual Prototyping
  • Emulation and Prototyping
  • Static and Formal Verification
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Denali Memory Interface and Storage IP
  • 112G/56G SerDes
  • PCIe and CXL
  • Tensilica Processor IP
  • Chiplet and D2D
  • Interface IP

RESOURCES

  • Discover PCIe

IC封裝設計與分析

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows

系統分析

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

嵌入式軟體

PCB設計與分析

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / 機器學習

AI IP系列

Industries

  • 5G 系統
  • 航太與國防
  • 車用方案
  • Hyperscale Computing

Technologies

  • 3D-IC 設計
  • 先進製程
  • AI / 機器學習
  • Arm-Based方案
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • 低功耗方案
  • 混合訊號
  • Photonics
  • RF / Microwave
Designed with Cadence See how our customers create innovative products with Cadence

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Link for support software downloads Stay up to date with the latest software 24/7 - Cadence Online Support Visit Now

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

Media Center

  • Events
  • Newsroom
  • Blogs

Culture and Careers

  • Culture and Diversity
  • Careers
Intelligent System Design Learn how Intelligent System Design™ powers future technologies Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
ZH - Taiwan
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • 客製IC/類比/RF設計
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • 系統設計與驗證
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC封裝設計與分析
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • 嵌入式軟體
      • PCB設計與分析
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / 機器學習
      • AI IP系列
    • CADENCE雲端方案
    • VIEW ALL PRODUCTS
  • 解決方案
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
  • 支援與培訓
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • 公司資訊
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers

Allegro PCB Symphony Team Design Option

Concurrent engineering and distributed design

  • Overview
  • News and Blogs
  • Support and Training

Key Benefits

  • Concurrent engineering and distributed design let multiple designers work on the same PCB design in real time
  • Shortens the largest portion of your PCB layout design cycle
  • Reduces time to route advanced high-speed interfaces by 80%

With a worldwide PCB design team, it can be difficult to shorten design cycle times. Manual workarounds that address multi-user issues are time consuming, slow, and prone to error. The Cadence Allegro PCB Designer provides two ways for PCB design teams to collaborate—concurrent engineering using a shared canvas and distributed team design with a partitioned canvas. Either way, multiple PCB designers can work on the same design to reduce layout time.

Ask Us A Question

Concurrent Engineering Using a Shared Canvas

The concurrent engineering option, Allegro® PCB Symphony™ Team Design Option, shortens the largest portion of the PCB layout design cycle. Its shared canvas provides a low-overhead environment that enables multiple designers to work on the same design, on the same canvas, and at the same time without the set-up requirements of a partitioned project. The more routing engineers you add, the faster your team can finish routing.

Allegro PCB Symphony Team Design Software
Savings example using five routing engineers

 

By connecting multiple PCB designers to a common Allegro PCB layout database, any changes made on their canvases are reflected on the server and seen by other designers, eliminating copy/paste “chaos.”

Easy to Set Up and Easy to Use
  • Ad-hoc mode eliminates setup—Bring other team members into a design on a moment’s notice. Join or leave the session at any time, knowing that all design updates have been updated to the master database.
  • More structured approach—Host the design on a network server where multiple designers can access the server and start the concurrent design process. Design can be managed centrally without requiring user intervention.
Collaboration with Extended Team

Many tasks—such as netlist updates, MCAD updates, constraint updates, etc.—very frequently interrupt the PCB implementation process.

  • Constraint editing in Allegro PCB Symphony Team Design Option allows a client exclusive access to Constraint Manager while everyone continues their design work concurrently.
  • You can leverage netlist import and MCAD import within the Symphony Team Design Option session without disconnecting team members from the session.

Use Powerful Features of Allegro PCB Designer

While in concurrent team design environment, designers can use features of Allegro PCB Designer to accelerate new product introduction:

  • 3D visualization while connected to a session
  • Shape editing and shape design for power delivery
  • Placement Edit Application mode
  • Interactive etch-editing commands and Allegro auto-interactive phase tune (AiPT) and auto-interactive delay tune (AiDT) capabilities, as well as dynamic shape voiding during routing
  • Combined with AiPT and AiDT, the TimingVision™ environment shortens timing closure of high-speed PCB interfaces by up to 75 percent
  • Impedance analysis and vision
  • Silkscreening to label and identify items such as test points, component labels, and assembly instructions
  • Report generation and Full/Window DRC update
  • Testability

Distributed Team Design on Partitioned Canvas

The distributed partitioning option, Allegro PCB Design Partitioning Option (also available separately), lets designers work on individual design sections exported from a master design. Partitioning a design for layout and editing by several design team members accelerates the time to complete the layout process. Each designer can see all partitioned sections and update the design view for monitoring the status and progress of other users’ sections.

Want more information on Allegro PCB Symphony Team Design Option?

For technical details or a demonstration, please contact us.

Contact Us

Allegro PCB Symphony Team Design provides dynamic concurrent PCB team design for multiple PCB designers to work on the same design at the same time without any set-up requirements.

  • Related Products

    • Allegro PCB Designer
Blogs VIEW ALL
Support

Cadence is committed to keeping design teams highly productive. A range of support offerings and processes helps Cadence users focus on reducing time-to-market and achieving silicon success. Overview

Cadence Online Support

  • Details about online supportLearn more

  • Have an account already?Log in

  • New to support?Sign up

  • Online support overview Link to video

Customer Support

  • Support Process
  • Software Downloads
  • Computing Platform Support
  • University Software Program
  • Customer Support Contacts
Training

Get the most out of your investment in Cadence technologies through a wide range of training offerings. We offer instructor-led classes at our training centers or at your site. We also offer self-paced online courses. Overview

Course Delivery Methods

  • Instructor-Led Training
  • Online Training
  • Get Cadence Certified

Regional Training Information

  • China
  • Europe, Middle East, and Africa
  • India
  • Japan
  • Korea
  • North America
  • Singapore
  • Taiwan
Fortune 100 Best Companies to Work for 2022

A Great Place to Do Great Work!

Eighth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Press Releases
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • General Inquiry
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2022 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • US Trademarks