- Shorter cycle times and predictability with multi-fabric planning
- Supports bottom-up PCB influenced planning of silicon and package
- Design data compatibility with OSAT providers
Meeting product deadlines and performance objectives necessitates coordinated planning and optimization of the system fabrics—silicon, package, and PCB. Cadence co-design solutions help design teams optimize device and system performance by managing the increasing challenge of planning and coordinating high-performance interfaces like DDR4 or PCIe Gen3 across the multiple fabrics that comprise a system. A key component of the Cadence solution is the OrbitIO™ interconnect designer, a revolutionary environment that brings these fabrics together into a single canvas to perform rapid planning and assessment of assignments, connectivity, and route feasibility. The results are well-qualified design definitions that are ready for implementation, leading to more predictable system cost, performance, and product delivery.