Home
  • 技術產品
  • 解決方案
  • 支援與培訓
  • 公司資訊
  • ZH TW
    • SELECT YOUR COUNTRY OR REGION

    • US - English
    • China - 简体中文
    • Japan - 日本語
    • Korea - 한국어

DESIGN EXCELLENCE

  • 數位設計流程
  • 客製IC/類比/RF設計
  • Verification
  • IP
  • IC封裝設計與分析

SYSTEM INNOVATION

  • Multiphysics System Analysis
  • 嵌入式軟體
  • PCB設計與分析
  • Computational Fluid Dynamics

PERVASIVE INTELLIGENCE

  • AI / 機器學習
  • AI IP系列

CADENCE雲端方案

VIEW ALL PRODUCTS

數位設計流程

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows
  • Voltus IC Power Integrity Solution

客製IC/類比/RF設計

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

系統設計與驗證

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
  • Virtual Prototyping
  • Emulation and Prototyping
  • Static and Formal Verification
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Denali Memory Interface and Storage IP
  • 112G/56G SerDes
  • PCIe and CXL
  • Tensilica Processor IP
  • Chiplet and D2D
  • Interface IP

RESOURCES

  • Discover PCIe

IC封裝設計與分析

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows

系統分析

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

嵌入式軟體

PCB設計與分析

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / 機器學習

AI IP系列

Industries

  • 5G 系統
  • 航太與國防
  • 車用方案
  • Hyperscale Computing

Technologies

  • 3D-IC 設計
  • 先進製程
  • AI / 機器學習
  • Arm-Based方案
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • 低功耗方案
  • 混合訊號
  • Photonics
  • RF / Microwave
See how our customers create innovative products with Cadence

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Stay up to date with the latest software 24/7 - Cadence Online Support Visit Now

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

Media Center

  • Events
  • Newsroom
  • Blogs

Culture and Careers

  • Culture and Diversity
  • Careers
Learn how Intelligent System Design™ powers future technologies Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
ZH - Taiwan
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • 客製IC/類比/RF設計
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • 系統設計與驗證
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC封裝設計與分析
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • 嵌入式軟體
      • PCB設計與分析
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / 機器學習
      • AI IP系列
    • CADENCE雲端方案
    • VIEW ALL PRODUCTS
  • 解決方案
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
  • 支援與培訓
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • 公司資訊
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers

Celsius Advanced PTI

Accelerating PDN designs

  • Overview
  • Videos
  • News and Blogs

Key Benefits

  • Accurate thermal modeling of SoC with Voltus/Celsius integration
  • Thermal-aware electronic designs with integration of Celsius with Virtuoso, AWR, and OrbitIO
  • Reduces cost and time by identifying potential problems early with both pre-route and post-route
  • Ensures reliable power delivery by verifying AC, DC, and power-ripple analysis
  • Optimizes a PDN across the board/package interface
  • Easily addresses system-level power analysis challenges with a block-based schematic editor

To help you quickly validate the sufficiency, efficiency, and stability of the power delivery network (PDN), Cadence® Celsius™ Advanced PTI allows power terminal integrity (PTI) experts to perform PDN verification from each power source to each sink across multiple boards and packages.

Cadence Allegro® PowerTree™ technology lets you set up the analysis before the physical design process and validate the bill of materials defined during the logical design stage. As the physical implementation proceeds, the set-up captured in the PowerTree environment can be reused, essentially making DC and AC power integrity analysis a push-button process at each design stage.

sigrity-advanced-pi-figure1-600w
Figure 1: Accurately simulate problematic real-world structures such as cutouts, via fields, wire bonds, and neck downs

Thermal-Aware DC Analysis

Celsius PowerDC™ technology provides an efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation to maximize accuracy. Celsius PowerDC technology quickly pinpoints excessive IR drop along with areas of excess current density and thermal hotspots to minimize your design’s risk of field failure.

AC Analysis

Sigrity OptimizePI™ technology does a complete AC frequency analysis of boards and IC packages. Supporting both pre-and post-layout studies, it quickly pinpoints the best decap selections and placement locations to meet your PDN needs at the lowest possible cost. PDN impedance profiles are checked against target impedance constraints to ensure that the design meets PDN specifications.

Power-Ripple Analysis

The power ground noise simulation workflow from Sigrity SPEED2000™ technology can be used for direct time-domain power/ground noise simulation for the I/O power supply. Instead of having to extract S-parameter models and use them in a SPICE simulation, Sigrity Advanced PI provides a straightforward time-domain power integrity approach for either a PCB or IC package. It delivers a stable simulation result that would otherwise be more time consuming to obtain.

Sigrity Topology Explorer

This general-purpose topology exploration function can be used for exploring power topologies across multiple fabrics. By connecting the power ports of chip, package, and boards, you can create and simulate complete source-to-sink connectivity. PDN models for each fabric, created using the Sigrity PowerSI™ or Cadence Clarity™ 3D Solver, are excited using a model for the voltage regulator module (VRM). The resulting signal provides a time-domain view of the PDN voltage at each critical point from source to sink. You can determine if any portion of the PDN generates problems delivering power within the system specification.

sigrity-advanced-pi-figure2-600w
Figure 2: The intuitive Sigrity topology explorer user experience makes it easy to join interconnect models for the PDN
across multiple boards, as well as chip and package, and see the impact to power stability

Features

  • Automatically set up DC simulations using PowerTree data (source/sink definitions) captured at the schematic stage of the design process
  • Identifies difficult-to-locate, highly resistive routing neck-downs and finds the one via among thousands that will fail under stress
  • Determines if it is possible to reduce plane layers without adding DC or thermal reliability risk
  • Reduces PDN cost for new designs and post-production products
  • Intuitive and interactive visualization of PDN performance

Contact Us

Demonstrating electrical-thermal co-simulation with Celsius Thermal Solver
Watch Now
View a demo of Sigrity OptimizePI which provides an analytical basis for decisions regarding PDN design tradeoffs.
Watch Now
  • Related Links

    • Celsius DC
    • Sigrity OptimizePI
    • Celsius Thermal Solver
Videos

GLOBALFOUNDRIES: MCM LPDDR4 Analysis Accelerates Turnaround Time by 12X Using Sigrity SystemSI

Seagate Uses Cadence Allegro and Sigrity PCB Tools to Develop Next-Generation Solid-State Drives

DesignCon 2017: Sigrity 2017 Portfolio Highlights

Sigrity Tech Tip: How PCB Designers Can Create Initial PDN Constraints Without Becoming a PI Expert

Sigrity Tech Tip: How to Build an IBIS-AMI Model

Sigrity Tech Tip: How DDR interfaces can be accurately analyzed pain-free (without large S-parameters)

Sigrity Tech Tip: How PCB Designers Can Find and Fix Power Integrity Problems

Multi-Board Electrical and Thermal Co-simulation using Sigrity PowerDC

Why Does Signal Integrity Analysis Need to be Power-Aware?

Simulation of the Automotive Ethernet using Cadence Sigrity tools

Lattice Saves Millions, Avoids Respins and Product Delays with Sigrity Tools

Ericsson Meets DDR and PCIe Specs While Avoiding Crosstalk

News ReleasesVIEW ALL
  • Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis 07/19/2018

  • Cadence Sigrity PowerDC Technology Supports Future Facilities' New Open Neutral File Format for Thermal Interoperability 03/19/2018

  • Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff 01/25/2017

  • Cadence Sigrity 2016 Portfolio Improves Product Creation Time with PCB Design and Analysis Methodology for Multi-Gigabit Interfaces 01/19/2016

  • Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers' Design Cycle by Up to 12 Weeks 12/01/2015

Blogs VIEW ALL

A Great Place to Do Great Work!

Eighth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Press Releases
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • General Inquiry
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2022 Cadence Design Systems, Inc. All Rights Reserved.

Terms of Use Privacy US Trademarks