IC Package Design Flows

With complex advanced packages, you are faced with power integrity (PI) and signal integrity (SI) issues driven by increasing IC speeds and data transmission rates combined with decreases in power-supply voltages and denser, smaller geometries. Stacked die and packages, higher pin counts, and greater electrical performance constraints are making the physical design of semiconductor packages more complex.

Cadence^® IC packaging and multi-fabric co-design flows deliver the automation and accuracy to expedite the design process. To address these issues, you need the latest releases of PI and power-aware Sigrity^™ SI tools that can be used throughout the design process. Cross-substrate interconnects unify IC, package, and PCB data so signal-to-bump/ ball-assignment and connectivity/routing-pathway scenarios can be easily derived and evaluated. Once this data is unified in a single canvas environment, IC/package/PCB co-design can take place, as well as constraint-driven power delivery network (PDN) design with an integrated layout and analysis solution.