Reality Is Not Linear
The changing landscape
of physical design
-
Digital Design and Signoff Flows
-
SoC Implementation and Floorplanning
-
Synthesis
-
Logic Equivalence Checking
-
Functional ECO
-
Power Analysis
-
Low-Power Validation
-
SDC and CDC Signoff
-
Silicon Signoff and Verification
- Assura Physical Verification
- CMP Predictor
- LDE Electrical Analyzer
- Litho Physical Analyzer
- MaskCompose Reticle and Wafer Synthesis Suite
- Cadence Pattern Analysis
- Pegasus Verification System
- Process Proximity Compensation
- Physical Verification System
- Quantus Extraction Solution
- QuickView Signoff Data Analysis Environment
- Tempus Timing Signoff Solution
- Voltus IC Power Integrity Solution
- Voltus-Fi Custom Power Integrity Solution
-
Library Characterization
-
Test
Meet Your PPA and Schedule Targets
Designs are getting bigger and more complex, making power and area usage critical components. It’s a tall engineering order to meet, made tougher with schedules that continue to shrink. How can you achieve your quality objectives without missing project milestones?
The Cadence® integrated full-flow digital toolset offers innovations that go across individual point-tool boundaries to work to your advantage. Other point-tool-oriented flows create multiple bottlenecks between synthesis and implementation and between optimization and signoff. By using shared technology, integrated engines, and full-flow parallelism, the Cadence flow avoids those bottlenecks and provides a fast path to design closure and better predictability.
Additionally, with embedded machine learning technology, the toolset offers a way to model and train the flow for pushing operational frequencies while minimizing power and area metrics on specific design styles.
Where traditional tools fall short, our toolset has been developed to help you meet—and even exceed—power, performance, and area (PPA) targets and deliver your products on time, with high quality. When you tap into the integrated and intelligent tool suite, you’ll be able to achieve much more powerful results.
- Up to 20% better PPA
- Up to 10X faster turnaround time and capacity gain
- Full-flow timing and power correlation for better design convergence
- Early signoff optimization for reduced iterations
Optimized for Advanced Nodes
Cadence developed its revolutionary full-flow digital toolset to address today’s advanced-node design challenges at the creation, implementation, and signoff stages.
Key Benefits at Advanced Nodes
- Unified digital architecture based on a foundation of core common engines and full-flow optimizations, allowing rapid feature deployment for newer nodes
- Massively parallel technology facilitates the handling of the large data size and complexity of advanced nodes
- Comprehensive full-flow integrated toolset for design creation, implementation, and signoff, enabling faster convergence and design closure for advanced nodes
Select a product from the integrated tool suite below to learn more:
Resource Library VIEW ALL
Video (79)
- Addressing Digital Implementation Challenges with Innovative Machine Learning Techniques
- INVECAS’ Smart Constraint and CDC Signoff with Cadence’s Conformal Litmus
- Israeli HiPer Consortium N16 Tapeout with Pegasus
- Arm and Cadence collaborate on Arm Neoverse N1 platform to advance Cloud-to-Edge infrastructure
- Whiteboard Wednesdays: Inductance Extraction for Digital Designs
- Visualize and Prevent EM Effects in Automotive Designs
- imec and Cadence Collaboration on Test – Translating Academic Research into Production Software
- imec, TU Eindhoven, and Cadence – Advances in Defect Location Identification & Making Cell Aware Test Accessible for Production Use
- Fast Accurate RTL Power Analysis with Joules RTL Power Solution
- GlobalFoundries Expert Insights: Aging Analysis for IoT and Automotive Applications
- Whiteboard Wednesdays - Limitations of Scan Compression QoR
- Whiteboard Wednesdays - Scan Compression Fundamentals
- Whiteboard Wednesdays - 3X Faster Design Closure with Quantus Integrated Virtual Metal Fill
- Whiteboard Wednesdays - Solving Scan Compression Congestion Issues with Modus 2D Elastic
- Whiteboard Wednesdays - Diagnostics – What Makes Modus Diagnostics an Industry Leading Tool
- Whiteboard Wednesdays - An Introduction to IC Test and Modus
- The Complexities and Future of Scan Compression
- Concurrent Clock Optimization Boosts Performance, Lowers Power
- GigaPlace Solver-Based Placement Technology In Innovus Implementation System
- Voltus-DP: Signing Off Power Integrity Faster Than Ever - Any Design in a Few Hours
- Designing an Automotive Graphics Display Controller with Stratus HLS
- From TensorFlow to RTL in three months
- Broadcom Uses Conformal ECO for High-Performance Designs
- Introducing Conformal Smart LEC
- A High Level Synthesis (HLS) Design Flow for Scaling to Multiple IP, SoC, and Process Targets
- Microsemi Benefits by Using Pegasus Verification System on Advanced-Node Designs
- Pegasus Verification System – Let Your DRC Fly!
- Let Your DRC Fly with the Pegasus Verification System
- Invecas Floorplan-to-Signoff Success Using Cadence Innovus and Tempus Solutions
- LG Soft India Uses Tempus PBA for Slack-Based Optimization Flow
- GLOBALFOUNDRIES ASIC Design Team Validates Hierarchical Test Architecture using Cadence Test Solution
- Rambus Automates ECOs and Saves Time with Cadence Conformal ECO Designer
- Addressing Body Biasing Challenges at GLOBALFOUNDRIES
- Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Intent
- Power Signoff for 28-nm FD-SOI at STMicroelectronics
- Probing Power Problems Early at Fairchild Semiconductor
- Building Cores with 10X Energy-Efficiency Improvement at REX Computing
- Lowering Power: Meet your power budgets
- Design Faster with Less Effort: Paul Cunningham, R&D VP, tells you how
- Technical Overview: Innovus implementation System for Digital Designs
- Reducing Design Flow Iterations with GigaPlace Engine
- Cadence Pattern Matching and DFM Signoff
- Cadence Implementation, Signoff and DFM Readiness for Samsung FinFET Nodes
- Accurate Low Power verification on a Complex Low Power Design using CLP
- Addressing Capacity, Runtime and Co-relation Challenges for 28nm SOC Implementation and Closure with Cadence Innovus
- Ambarella - Collaborating with Cadence and Samsung to achieve first-time silicon successful 32nm HD digital camera SoC
- Silicon Labs Leverages Cadence Mixed-Signal Solution for Mixed Signal Simulation, Implementation and Signoff
- SMIC DFM Solution
- How New DFT Solution Trims Test Time for Digital Logic
- How to Overcome Challenges of Rising Compression Ratios in Digital Designs
- How You Can Drive Down Digital Logic Test Time
- Managing Signoff Corners with MMMC Flows
- PMC-Sierra Touts Extension Language-Based Utility for Interconnect Debug
- Academic/Industry Collaboration Examples
- Maximizing PPA on ARM’s Next-Generation High-Performance Processor Using the Latest Cadence Implementation and Signoff Tools/Flow
- Genus Synthesis Solution: Massively Parallel RTL Synthesis
- Physical Design Analytics and DFM Enablement for sub-14nm Technology Nodes
- Physical Design Flow Challenges at 28nm on Multi-Million Gate Blocks
- Samsung Foundry 14LPP: The Continual Thrust in FinFET Leadership
- Offering Leading Edge Total Solutions - GLOBALFOUNDRIES Design Ready 14nm Eco System
- Cadence In-Design DFM-LDE Adoption in ST SmartPower PDK
- TowerJazz AMS Reference Flow
- Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES
- eInfochips Shortens Runtime on 300M Gate Count SoCs with Innovus Implementation System
- Addressing Today's Signoff Challenges with the Tempus Timing Signoff Solution
- Two-Minute Lesson on Achieving Faster Parasitic Extraction
- Massive Parallelism in Action: See how multiple levels of parallelism accelerate RTL synthesis.
- Better RTL Productivity: Learn how the Genus flow reduces unit-level iterations.
- In Sync with Innovus Technology: Learn how Genus and Innovus technologies are tightly correlated.
- Optimizing Datapath for Better PPA: Save area with smart micro-architecture selection
- RTL Design, Genus Style: The scoop on how you can get hours of your life back
- Tackling 16nm Challenges for Arm Cortex-A72 Processor
- New Power Signoff Tool: 10X Faster Performance and SPICE-Like Accuracy
- What's New in Encounter v11.1: Signoff Analysis
- Enhanced Black Box Design Flow Using Cadence PVS
- Silicon Signoff and Verification - 16nm FinFET Challenges and Features
- Three Key Points About Innovus Implementation System
- Tempus Timing Signoff Solution: Impressions, Real-World Results
- Saving Routing Resources, Speeding Up Timing Closure at Freescale Semiconductor
Demo Videos (26)
- Concurrent Clock Optimization Boosts Performance, Lowers Power
- GigaPlace Solver-Based Placement Technology In Innovus Implementation System
- Quantus FS—Massively Parallel and Cloud-Ready 3D Parasitic Extraction Field Solver
- Introducing Conformal Smart LEC
- Integrated Virtual Metal Fill - Don’t Emulate—Virtualize Metal Fill!
- Inductance Extraction - Hold Time Failure, Ringing Effects, Reliability Failures!
- Advanced Netlist Reduction - Up to 6X Reduction in Simulation Runtimes!
- Pegasus Verification System – Let Your DRC Fly!
- Cadence Tempus Timing Signoff Solution
- Lowering Power: Meet your power budgets
- Design Faster with Less Effort: Paul Cunningham, R&D VP, tells you how
- Technical Overview: Innovus implementation System for Digital Designs
- Reducing Design Flow Iterations with GigaPlace Engine
- How New DFT Solution Trims Test Time for Digital Logic
- How to Overcome Challenges of Rising Compression Ratios in Digital Designs
- How You Can Drive Down Digital Logic Test Time
- Addressing Today's Signoff Challenges with the Tempus Timing Signoff Solution
- Two-Minute Lesson on Achieving Faster Parasitic Extraction
- Massive Parallelism in Action: See how multiple levels of parallelism accelerate RTL synthesis.
- Better RTL Productivity: Learn how the Genus flow reduces unit-level iterations.
- In Sync with Innovus Technology: Learn how Genus and Innovus technologies are tightly correlated.
- Optimizing Datapath for Better PPA: Save area with smart micro-architecture selection
- RTL Design, Genus Style: The scoop on how you can get hours of your life back
- Tackling 16nm Challenges for Arm Cortex-A72 Processor
- New Power Signoff Tool: 10X Faster Performance and SPICE-Like Accuracy
- Three Key Points About Innovus Implementation System
Success Story Video (15)
- Microsemi Benefits by Using Pegasus Verification System on Advanced-Node Designs
- Invecas Floorplan-to-Signoff Success Using Cadence Innovus and Tempus Solutions
- LG Soft India Uses Tempus PBA for Slack-Based Optimization Flow
- GLOBALFOUNDRIES ASIC Design Team Validates Hierarchical Test Architecture using Cadence Test Solution
- Rambus Automates ECOs and Saves Time with Cadence Conformal ECO Designer
- Addressing Body Biasing Challenges at GLOBALFOUNDRIES
- Power Signoff for 28-nm FD-SOI at STMicroelectronics
- Probing Power Problems Early at Fairchild Semiconductor
- Building Cores with 10X Energy-Efficiency Improvement at REX Computing
- Silicon Labs Leverages Cadence Mixed-Signal Solution for Mixed Signal Simulation, Implementation and Signoff
- SMIC DFM Solution
- Managing Signoff Corners with MMMC Flows
- PMC-Sierra Touts Extension Language-Based Utility for Interconnect Debug
- Maximizing PPA on ARM’s Next-Generation High-Performance Processor Using the Latest Cadence Implementation and Signoff Tools/Flow
- Lowering Leakage Power in ARM Cortex-A17 Processor-based SoCs at GLOBALFOUNDRIES
Customers Success (10)
- Moving to UVM-MS to Meet Coverage Goals Case Study
- Cadence and STMicroelectronics Success Story
- Cadence and VIA Telecom Success Story
- Cadence and Faraday Technology Case Study
- Cadence and Uniquify Success Story
- Texas Instruments and Cadence Verification Success Story
- Cadence and Sharp Success Story
- Cadence and Faraday Success Story
- Cadence and Fujitsu Success Story
- Cadence and Newport Media Success Story
Press Releases (68)
- Cadence Custom/AMS Flow Certified for Samsung 5LPE Process Technology
- Cadence Automotive Reference Flow Certified by Samsung Foundry for Advanced-Node Design Creation
- Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology
- Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies
- NSITEXE Accelerates Delivery of Data Flow Processor IP for Automotive and Industrial Applications Using the Cadence Digital Design Full Flow
- Cadence Full-Flow Digital and Signoff Tools Optimized for New 7nm Arm Cortex-A77 CPU
- Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology
- Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design
- Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
- Cadence CMP Process Optimizer Enables Toshiba Memory Corporation to Accelerate Delivery of Advanced 3D Flash Memory Devices
- Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES
- Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers
- Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies
- Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation
- Cadence Introduces Voltus-XP Technology with Extensive Parallelism, Up to 5X Acceleration, and Increased Capacity for Power Signoff at Advanced Nodes
- Cadence Full-Flow Digital and Signoff Tools and Verification Suite Provide Optimal Results for 7nm Arm Cortex-A76 CPU Designs
- Cadence Full-Flow Digital and Signoff Tools Certified on Samsung’s 8LPP Process Technology
- Cadence Innovus Implementation System Speeds Development of New Realtek DTV SoC Solution
- Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
- Cadence Supports New TSMC WoW Advanced Packaging Technology
- Imec and Cadence Tape Out Industry's First 3nm Test Chip
- Cadence Achieves TÜV SÜD’s First Comprehensive “Fit for Purpose - TCL1” Certification in Support of Automotive ISO 26262 Standard
- Cadence Genus Synthesis Solution Enables Fuji Xerox to Improve Multi-Functional Printer SoCs Design Development
- Cadence Introduces the Conformal Smart Logic Equivalence Checker
- Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS® 3D Packaging Technologies
- Cadence Tools and Flows Achieve Production-Ready Certification for TSMC’s 12FFC Process
- Cadence Modus Test Solution Enables Support for Safety-Critical SoC Designs Using ARM MBIST Interface
- Cadence Delivers Industry’s First Comprehensive TCL1 Documentation to Support Automotive ISO 26262 Standard
- Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors
- Cadence Reference Flow with Digital and Signoff Tools Certified on Samsung’s 10nm Process Technology
- Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology
- Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New ARM Cortex-R52 CPU
- Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process
- Cadence and SMIC Collaborate on Delivery of Low-Power 28nm Digital Design Reference Flow
- Cadence Delivers Rapid Adoption Kits Based on a 10nm Reference Flow for New ARM Cortex-A73 CPU and ARM Mali-G71 GPU
- Cypress Adopts Cadence Digital Implementation and Circuit Simulation Tools for 40nm Automotive Designs
- Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution
- Toshiba Adopts Cadence Innovus Implementation System for Production Mobile Memory Controller Design
- UMC Qualifies Cadence Virtuoso LDE Analyzer for its 28HPC Process
- Cadence Digital and Signoff Tools Certified on Samsung Foundry's 14LPP Process
- Ethertronics Reduces Design Schedule by Half and Achieves More than 60 Percent Mask Cost Savings Using Cadence Conformal ECO Designer
- Cadence and TSMC Expand Collaboration Efforts on Integrated Design Flow for InFO Technology
- Cadence Design Tools Certified for TSMC 7nm Design Starts and 10nm Production
- Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow
- Cadence Innovus Implementation System Qualified on Samsung 10nm FinFET Process
- New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time
- Cadence Announces Complete Digital and Signoff Reference Flow for Imagination Technologies' PowerVR Series7 GPUs
- Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process
- HiSilicon Adopts Cadence Innovus Implementation System for Production DSP Designs
- Cadence Tempus Timing Signoff Solution Surpasses 200 Tapeout Milestone Within Two Years of Product Inception
- Cadence Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 22FDX Platform Reference Flow
- Phison Electronics Improves Time to Market by 40 Percent with Cadence Voltus-Fi Custom Power Integrity Solution
- Imec and Cadence Complete Tapeout of First 5nm Test Chip
- Cadence Digital, Custom/Analog and Signoff Tools Achieve TSMC Certification for 10nm FinFET Process
- New Cadence Joules RTL Power Solution Delivers 20X Faster Time-Based Power Analysis Within 15 Percent Accuracy to Signoff
- Cadence and Applied Materials Collaborate on Joint Development Program to Optimize Planarization Process Through Advanced CMP Modeling
- Cadence Implementation and Signoff Tools Certified on Intel Custom Foundry 14nm Process
- Cadence Introduces Innovus Implementation System, Delivering Best-in-Class Results with Up to 10X Reduction in Turnaround Time
- Freescale Speeds SoC Implementation Time by 7X with Cadence Innovus Implementation System
- Juniper Networks Gains Dramatic Throughput and Performance Advantages with Cadence Innovus Implementation System
- MaxLinear Achieves Significant Area Savings and Turnaround Time Reduction Using Cadence Innovus Implementation System
- Renesas Uses Cadence Innovus Implementation System to Improve Performance While Reducing Turnaround Time on an Advanced-Node Design
- Spreadtrum Accelerates Design Productivity Using Cadence Innovus Implementation System
- Cadence Announces Stratus High-Level Synthesis Platform
- Renesas Achieves 3X Reduction in Chip-Finishing Turnaround Time Using Cadence QuickView Signoff Data Analysis Environment
- Fujitsu Standardizes on Cadence DFM Technologies for 28nm ASIC and Mixed-Signal Designs
- Altis Collaborates with Cadence Services to Deliver State-of-Art Design Kits
Datasheet (20)
- Conformal Smart LEC
- Quantus Extraction Solution
- Pegasus Verification System
- Joules RTL Power Solution
- Innovus Implementation System
- Cadence Modus DFT Software Solution
- Allegro PCB Designer Manufacturing Option Datasheet
- Genus Synthesis Solution Datasheet
- Stratus High-Level Synthesis Datasheet
- QuickView Signoff Data Analysis Environment
- Cadence Physical Verification System Datasheet
- Conformal ECO Designer Datasheet
- First Encounter Design Exploration and Prototyping Datasheet
- NanoRoute Advanced Digital Router Datasheet
- Encounter Conformal Equivalence Checker Datasheet
- Virtuoso Digital Implementation Datasheet
- Cadence MaskCompose Reticle and Wafer Synthesis Suite Datasheet
- Assura Physical Verification Datasheet
- Encounter Conformal Constraint Designer Datasheet
- Conformal Low Power Datasheet
White Paper (12)
- Compressing Datasets Created During Silicon Design White Paper
- Unified Compression and LBIST in a Physically Aware Environment
- High-Level Low-Power System Design Optimization
- How High-Level Synthesis Was Used to Develop an Image-Processing IP Design from C++ Source Code White Paper
- How to Achieve 10X Faster Power Integrity Analysis and Signoff White Paper
- Using High-Level Synthesis to Design and Verify 802.11ah Baseband IP White Paper
- Case Study: Blu Wireless Boosts SystemC Design and Verification Productivity Using High-Level Synthesis Technology White Paper
- Pushing the Performance Boundaries of ARM Cortex-M Processors for Future Embedded Design White Paper
- Techniques to Accelerate Power and Timing Signoff of Advanced-Node SoCs White Paper
- Hierarchical Timing Analysis: Pros, Cons, and a New Approach White Paper
- Building Energy-Efficient ICs from the Ground Up White Paper
- 3D ICs with TSVs - Design Challenges and Requirements White Paper
Technical Brief (6)
- Quantus Smart View—Next-Generation Extracted View
- Quantus FS—Industry’s First Cloud-Ready, Massively Parallel 3D Extraction Solution
- Interactive Short Locator: Establishing Efficiency and Predictability in the LVS Short Debug Process for Advanced SoC Designs Technical Paper
- Modus Test Solution Technical Brief
- Genus Synthesis Solution Technical Brief
- Expanding Manufacturing Verification to the Real World with LBIST White Paper
Customers
We're always up against tight deadlines to deliver innovative and reliable designs to our automotive customers. While looking at the digital offerings from Cadence, we've seen an opportunity to improve our quality of results while significantly reducing cycle time.
Dragomir Nikolic, worldwide CAD director at Cypress.
Minimizing the cost of test is crucial in high-volume, price-sensitive markets like embedded processing. The Modus Test Solution is showing a 1.7X reduction in digital test time on one of our largest and most complex embedded processor chips
Roger Peters, MCU Silicon Development, Texas Instruments
The size and complexity characteristics of our latest design required a timing solution that could handle more than 50M cells quickly and efficiently. We determined that the Tempus Timing Signoff Solution was the right timing platform to address our signoff analysis and closure needs
Toru Hiyama, General Manager for Platform Advanced Engineering Operation, Information and Telecommunication System Company, Hitachi, Ltd.
Digital Design and Signoff Products A-Z