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數位設計流程

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Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

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  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • 客製IC/類比/RF設計
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • 系統設計與驗證
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC封裝設計與分析
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • 嵌入式軟體
      • PCB設計與分析
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
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        • Photonics
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      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
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What's New in Virtuoso

Learn more about new features, products, and solutions

Virtuoso RF Solution

The new Virtuoso® RF Solution provides a seamless RF design flow that integrates key design tools and technologies to implement, analyze, and simulate your RFIC and RF module all within the Virtuoso design environment. The solution automates hours of manual effort to run electromagnetic (EM) simulations, allowing you to run in-design experiments. It also simplifies the effort of running layout versus schematic (LVS) checks and design rule checks (DRCs) for complete physical design checks.

  • Create RF module layouts by generating from the "golden" schematic and using built-in features inside Virtuoso environment for LVS and DRC clean layout
  • Co-design their ICs and modules and avoid design failures that often arise from manual translation of data between numerous disjointed tools
  • Run in-design experiments for critical passives and interconnects by utilizing the advanced interface to Sigrity™ PowerSI® 3D EM and AXIEM® electromagnetic solvers inside the Virtuoso environment

For more information, see Virtuoso RF Solution.

Expanded Virtuoso Platform Tackles System Design Challenges

Cadence elevated its Virtuoso custom IC design platform with major enhancements that improve electronic system and IC design productivity. The enhancements affect almost every Virtuoso product, providing a robust environment and ecosystem to design, implement, and analyze complex systems.

Virtuoso System Design Platform

Built upon our award-winning Virtuoso System Design Platform to provide a comprehensive solution across chip, package, module, and board design, the new Virtuoso platform integrates a wide range of tools, products, and solutions.

A novel system design environment with multi-technology support lets you seamlessly edit and analyze the most complex heterogeneous systems, including analog, mixed-signal, RF, and photonic products through a single platform, utilizing the full capabilities of trusted Virtuoso set of design applications.

  • With new simultaneous editing across multiple processes design kits and technologies, the Virtuoso System Design Platform provides seamless interoperability with Cadence’s Allegro® PCB technology, Allegro Package Designer, and Sigrity analysis technology portfolio for a comprehensive chip-to-board toolset.

For more information, see Virtuoso System Design Platform.

Virtuoso Advanced-Node Design and Layout Support

The new Virtuoso Platform incorporates innovative advanced-node process methodologies from 22nm down to 5nm. Through collaboration with leading-edge foundries, ecosystem partners, and customers, the new Virtuoso platform can automatically manage process complexities that enable engineers to focus on their design intent.

  • In circuit design and analysis, advanced statistical algorithms specifically target FinFET designs and uncover circuit variances early, reducing the iterations required to fix loops by approximately 50%.
  • In layout design, a unique multi-grid system abstracts complex design rules of the latest 7nm and 5nm processes, while allowing engineers to increase their use of placement and routing technologies to significantly increase layout design productivity. Using these techniques with the enhancements made to the advanced methodology reduces layout effort by >2.5X in 7nm production designs.

For more information, see Custom/Analog Advanced-Node Solution.

Virtuoso Advanced Design Methodologies and Automation

The new Virtuoso platform includes several enhancements to improve analog design and analysis. Cadence estimates that the new innovative layout environment with electrically driven routing and wire editing, real-time design editing, and revolutionary design planning techniques improves productivity by 50%.

Virtuoso Analog Design Environment (ADE)
  • Enhanced integration with Spectre® Circuit Simulator provides 3X improvement in simulation performance, increasing simulation throughput and using advanced analysis to reduce design iterations.
  • New, unique capabilities added to Virtuoso ADE Verifier that centralize cross-domain electrical specifications provide a streamlined path to standards compliance (i.e., ISO 26262) by approximately 30%.

For more information, see Virtuoso ADE Product Suite.

Virtuoso Layout Suite
  • Evolving from an electrically aware layout to the industry’s first electrically and simulation-driven layout using unique sets of in-design technologies ensures circuit integrity and performance. This new simulation-driven layout addresses many of the electromigration (EM) and parasitic challenges of critical circuits and advanced-node designs.
  • Breakthrough techniques for hierarchical floorplanning and signal-path routing automation increase layout design productivity and throughput, and shorten layout turnaround-time.
  • Innovative concurrent team design editing allowing teams to distribute layout tasks and perform what-if exploration, which is useful for design-rule check (DRC) fixing, chip finishing, and routing.

For more information, see Virtuoso Layout Suite.

Contact Us

Hear about the new Virtuoso platform that combines an enhanced Virtuoso System Design Platform with our packaging, board, and system analysis expertise to meet complex design needs.

  • Related Pages

    • Virtuoso System Design Platform
    • Custom/Analog Advanced Node
    • Circuit Design
    • Layout Design
    • Virtuoso ADE Product Suite
    • Virtuoso Layout Suite
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  • Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library 11/16/2021

  • Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications 11/16/2021

  • Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs 10/26/2021

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