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Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
An open IP platform for you to customize your app-driven SoC design.
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
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Save time with optimized, automated design platforms for complex ICs and RF/microwave solutions
Support for entire flow from chip design to advanced packaging creation to board layout
Full verification and circuit, block, and system-level simulation across the entire flow
Capabilities including emulation and prototyping
Design, implement, and analyze complex electronic system and IC designs with the Virtuoso® custom IC platform
Solve large-scale verification simulation challenges for complex systems with the Spectre® simulation platform engines
Accelerate performance and productivity to enable differentiated, fast, and accurate custom silicon
Delivering a faster signoff path with in-design signoff and back-end verification and validation
Liberate™ ultra-fast cell library characterization solution for standard cells and complex I/Os
Integrated high-frequency circuit, system, and EM simulation and design technologies for developing RF/microwave IP
Complete analog IC design reliability throughout the product lifecycle
Addressing the challenges of RF design across chip, package, and board
Proven IP and design tools to quickly create challenging 5G designs
Single platform for IC- and package/system-level design capture, analysis, and verification
Innovative capabilities for custom/analog designs at 20nm and below
Comprehensive, interoperable, and proven mixed-signal verification and implementation
Integrated electronics/photonic design automation environment provides a complete photonic IC solution in a single flow
Isolating and Characterizing Critical Traces Using EM Analysis
Multi-Chip Module Design, Verification, and Yield Optimization Using AWR Software
Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack
Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library
Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications
Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs