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Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

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  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • 客製IC/類比/RF設計
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • 系統設計與驗證
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC封裝設計與分析
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • 嵌入式軟體
      • PCB設計與分析
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
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        • 低功耗方案
        • 混合訊號
        • Photonics
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      • Industries
        • 5G 系統
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        • 車用方案
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        • 先進製程
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Mixed-Signal Implementation

Concurrent analog-to-digital implementation methodology 

  • Mixed-Signal Solutions
  • Mixed-Signal Verification
  • Mixed-Signal Implementation
  • Signoff
  • Mixed-Signal Unified Methodology Guide

Key Benefits

  • Concurrent floorplanning with block abstracts shared directly via OpenAccess
  • Cross-platform constraint sharing
  • Full-chip timing/SI signoff including logic from AMS blocks
  • Easier analog and digital ECO process

Integrated Flows

Historically, two complementary design flows and methodologies have been used for mixed-signal design. For an analog-centric design that integrates small to medium amounts of digital logic, a schematic-driven flow with an Analog-on-Top (AoT) methodology is used. For a digital-centric design where the analog/mixed-signal (AMS) IP is imported, a netlist-driven flow with a Digital-on-Top (DoT) methodology is used. Cadence® Mixed-Signal Solutions improve and optimize these flows and methodologies in ways that improve communication, reduce iterations, and streamline the engineering change order (ECO) process. The introduction of OpenAccess as a single design database, and new capabilities such as mixed-signal routing, have led to greater productivity and faster turnaround time.

Mixed-Signal Solution

However, for designs that very tightly integrate analog and digital functionality, Cadence has introduced an advanced methodology: Mixed-Signal-on-Top (MSoT). This is a co-design methodology in which chip planning, design, implementation, physical verification, and signoff are shared responsibilities between the analog and digital teams. The MSoT methodology enables and promotes concurrent design, facilitates greater collaboration, and supports the mixing of analog and digital blocks at the top level of the design, which improves overall productivity and increases design throughput. 

Grahpic showing Open Access, Virtuoso, and EDI unified design

By interfacing the Virtuoso® and Innovus™ platforms through the industry-standard OpenAccess database, Cadence has enabled a new generation of interoperable mixed-signal flows and methodologies that help analog and digital design teams efficiently implement complex mixed-signal designs. This has resulted in less iterations and communication errors between design teams, especially during floorplanning, chip integration, and ECOs.

Mixed-Signal Digital Complexity Explosion
VIEW CHALK TALK

Silicon Labs - Power Mode Verification in Mixed-Signal Chips

  • Mixed Signal Implementation

    • Analog-Centric Mixed-Signal Design
    • Digital-Centric Mixed-Signal Design
    • Analog-Digital Concurrent Mixed-Signal Design
  • Related Products

    • Innovus Implementation System
    • Tempus Timing Signoff Solution
    • Voltus IC Power Integrity Solution
    • Virtuoso Layout Suite
    • Quantus Extraction Solution
    • Genus Synthesis Solution
    • Cadence Modus DFT Software Solution
    • Joules RTL Power Solution
    • Virtuoso Digital Implementation
News ReleasesVIEW ALL
  • Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon 09/08/2021

  • Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts 10/28/2020

  • GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design 09/24/2020

  • Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications 12/02/2019

  • Cadence and UMC Collaborate on Certification of Analog/Mixed-Signal Flow for 28HPC+ Process 08/06/2019

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Mixed-Signal Implementation
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