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DESIGN EXCELLENCE

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CADENCE雲端方案

數位設計流程

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

  • Logic Equivalence Checking
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  • Achieve best PPA with the next-generation Digital Full Flow solution Learn More
  • Address digital implementation challenges with machine learning Watch Now

客製IC/類比/RF設計

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

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  • Solve analog simulation challenges in complex designs Watch Now
  • See how the Virtuoso Design Platform addresses advanced custom IC and system design challenges Watch Now

系統設計與驗證

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

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  • Prototype your embedded software development Watch Now
  • Learn how early firmware development enabled first silicon success at Toshiba Memory Watch Now

IP

An open IP platform for you to customize your app-driven SoC design.

  • Interface IP
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  • Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
  • Meeting the needs of 5G communication with Tensilica® ConnX B20 DSP IP Download Now

IC封裝設計與分析

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

  • Cross-Platform Co-Design and Analysis
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  • Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
  • Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

系統分析

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

  • See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
  • Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
  • Electromagnetic Solutions
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  • System Analysis Resources Hub

嵌入式軟體

PCB設計與分析

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

  • Design Authoring
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  • Watch how to easily tackle complex and cutting edge designs. Learn More
  • Learn why signal integrity analysis needs to be power-aware Watch Now
  • Augmented Reality Lab Tools

AI / 機器學習

AI IP系列

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See how our customers create innovative products with Cadence Explore Now

SUPPORT

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TRAINING

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  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • Logic Equivalence Checking
        • Innovus Implementation and Floorplanning
        • Functional ECO
        • Low-Power Validation
        • Synthesis
        • Power Analysis
        • Constraints and CDC Signoff
        • Silicon Signoff and Verification
        • Library Characterization
        • Test
        • Flows
      • 客製IC/類比/RF設計
        • Circuit Design
        • Circuit Simulation
        • Layout Design
        • Layout Verification
        • Library Characterization
        • RF / Microwave Solutions
        • Flows
      • 系統設計與驗證
        • Debug Analysis
        • Emulation
        • Formal and Static Verification
        • FPGA-Based Prototyping
        • Planning and Management
        • Simulation
        • Software-Driven Verification
        • Verification IP
        • System-Level Verification IP
        • Flows
      • IP
        • Interface IP
        • Denali Memory IP
        • Tensilica Processor IP
        • Analog IP
        • System / Peripherals IP
        • Verification IP
      • IC封裝設計與分析
        • Cross-Platform Co-Design and Analysis
        • IC Package Design
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • Electromagnetic Solutions
        • RF / Microwave Design
        • Thermal Solutions
        • System Analysis Resources Hub
      • 嵌入式軟體
      • PCB設計與分析
        • Design Authoring
        • PCB Layout
        • Library and Design Data Management
        • Analog/Mixed-Signal Simulation
        • SI/PI Analysis
        • SI/PI Analysis Point Tools
        • What's New in Allegro
        • What's New in Sigrity
        • RF / Microwave Design
        • Flows
        • Advanced PCB Design & Analysis Blog
        • Augmented Reality Lab Tools
    • PERVASIVE INTELLIGENCE
      • AI / 機器學習
      • AI IP系列
    • CADENCE雲端方案
  • 解決方案
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
        • Cloud Solutions
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
        • Cloud Solutions
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
        • Cloud Solutions
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • INDUSTRIES
        • 5G 系統
        • 航太與國防
        • 車用方案
        • AI / 機器學習
      • TECHNOLOGIES
        • 3D-IC 設計
        • 先進製程
        • Arm-Based方案
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        • Photonics
        • RF / Microwave
  • 支援與培訓
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        • Online Support
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      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
        • Custom IC / Analog / RF Design
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        • System Design and Verification
        • Tensilica Processor IP
      • SUPPORT
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • TRAINING
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Infotainment

Improving the user experience with in-car infotainment

Automotive Electronics Overview
  • Automotive Solution
  • Advanced Driver Assistance System
  • Automotive Ethernet
  • Infotainment
  • Electronic Control Unit
  • Functional Safety
  • Automotive SoC Design

Today Infotainment systems are much more than a simple car radio and provide the central human-machine interface (HMI) to a variety of features like navigation, entertainment, communication, display, 3D instrument cluster, and ADAS functions. They also facilitate over-the-air software updates, which allow the customer to purchase new features as they become available during the lifecycle of the car. Hence the integrated digital cockpit greatly defines the overall user experience of the car.

ASK US A QUESTION

Audio Systems

Cadence® Tensilica® HiFi DSPs for audio, voice, and speech and their strong ecosystem partners, including Dolby and DTS, allow chip manufacturers to design feature-rich infotainment SoCs, with the latest audio, voice, speech recognition, and voice enhancement software.

Cadence has the largest partner ecosystem for audio, voice, sensor fusion, and IoT. Visit our partners page to learn more about

  • Digital car radio
  • Always-listening voice recognition
  • Immersive surround sound
  • Active noise Cancellation (ANC)
  • Audio/voice pre- and post-processing
  • Audio/voice codecs
  • Embedded audio software development

Graphical Audio Design and Tuning Tool

Audio Weaver™ from DSP Concepts is an innovative graphical design environment for developing and tuning optimized embedded audio software such as the Tensilica HiFi DSP. Development teams can create applications that realize their desired sound quality up to 10X faster than traditional development approaches by re-using pre-built, highly optimized audio processing modules. The real-time tuning capabilities of the Audio Weaver tool give automotive audio engineers complete control of their audio signal chain.
LEARN MORE

Navigation Systems with Integrated ADAS

The Tensilica Vision DSP family is optimized to run compute-intensive vision algorithms and neural networks for automotive applications such as object detection, traffic sign recognition, augmented reality navigation, driver monitoring, fog clearance, and night vision systems. Cadence has a rich set of software partners for vision applications.
LEARN MORE

  • ADAS, imaging, and computer vision
  • Image enhancement
  • In-car occupancy detection
  • Face authentication
  • Pedestrian detection
  • Convolutional neural network (CNN) deep learning

Wi-Fi and Bluetooth Communications, LTE and 5G Radios, Radar, and Lidar

The Tensilica ConnX family of enhanced DSPs establishes a new standard in high-performance, low-power digital signal processing specifically designed for the next-generation radar, lidar, and communication systems.

Whether it’s a product targeting a 5G communications microcell, LTE Advanced, Wi-Fi access point, Car2X, high-resolution imaging radar sensor, or a lower-cost solid-state lidar, they all benefit from the flexibility of a software-based solution as these markets develop and mature.
LEARN MORE

Interface and Memory IP

Cadence’s complete portfolio of interface and memory IP provides all the links from the user interface to the internal electronics of the infotainment system. Our interface IP solutions provide controllers/PHYs for cameras connecting via a MIPI interface, charging connectors through a USB interface, updating maps through an SD interface, [verb-ing] to high-definition displays, playing music through a SATA interface, or communicating via high-speed Automotive Ethernet with other systems. Internally, our widely used memory IP PHY and controllers keep data streaming throughout the system.
LEARN MORE

  • Related Products

    • Emulation
    • Palladium Hybrid
    • Cadence Verification Suite
    • Tensilica Hifi DSPs
    • Tensilica Vision DSPs
    • Tensilica ConnX DSPs
    • Ethernet and other Standards-Based IP
    • Denali Memory IP
    • Analog IP
    • Verification IP
  • Related Topics

    • Protium Desktop Prototyping Platform
  • Infotainment Brochure

    • Automotive Infotainment Solution
  • Automotive White Papers

    • Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools and Techniques White Paper
    • Improve Reliability and Redundancy of Automotive Ethernet Through Open Standards
  • Technical Brief

    • Taking the Fast Lane to Automotive Electronics Success

Renesas: Next-generation Integrated Cockpits Using Cadence Tensilica HiFi DSPs

This demo presents an implementation example of the Fiberdyne Systems DSP library running on the Renesas R-Car platform. The example demonstrates 12 channels of individual audio processing using the Cadence Tensilica HiFi 2 DSP core.

In this video Gerard Andrews demonstrates a digital home assistant using Cadence Tensilica HiFi 4 DSP, as well as technology from NXP Semiconductors and DSP Concepts.

Videos

Digital home assistant speech recognition powered by Tensilica HiFi DSP

Cadence Automotive IP solutions for infotainment applications

Kronoton Demo powered by Cadence Tensilica HiFi Audio core

Hardent: Solution for Next-Generation Automotive Video Systems Enabled with Cadence IP

Renesas R-Car Audio Channel Processing using Cadence Tensilica DSP

Renesas: Next-generation Integrated Cockpits Using Cadence Tensilica HiFi DSPs

News ReleasesVIEW ALL
  • Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications 02/28/2019

  • Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification 07/12/2018

  • Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution 05/08/2018

  • Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP 04/11/2018

  • Cadence Achieves TÜV SÜD’s First Comprehensive “Fit for Purpose - TCL1” Certification in Support of Automotive ISO 26262 Standard 10/11/2017

Blogs VIEW ALL
Resource Library

Video (3)

  • Digital home assistant speech recognition powered by Tensilica HiFi DSP
  • Hardent: Solution for Next-Generation Automotive Video Systems Enabled with Cadence IP
  • Renesas R-Car Audio Channel Processing using Cadence Tensilica DSP

White Paper (1)

  • SLAM and DSP Implementation

Technical Brief (2)

  • Staying Alert on the Road
  • Taking the Fast Lane to Automotive Electronics Success
VIEW ALL

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