Increase Silicon Quality
Multi-CPU enabled, advanced, and integrated DPT-aware engines for digital and custom implementation, analysis, and verification
Prevent verification and DFM issues upfront with automated handling of large, low-power, mixed-signal designs
Speed Ramp to Volume
Reduce iterations within the flow and limit silicon re-spins
Optimize interconnect with variation-aware in-design signoff and integrated DFM flows
Leverage a complete, consistent, and converging flow across Innovus™ digital and Virtuoso® custom implementation technologies to address design-for-manufacturing (DFM) and variability effects earlier. By integrating color-aware DPT flows with model-based DFM, IR drop analysis, timing and power analysis, and verification in a comprehensive prevent-validate-finalize flow, the Cadence® solution can tackle huge designs and provides significant productivity gains over traditional design closure methodologies.
Advanced-node processes challenge custom/analog designers with the complex interdependency of manufacturing and variability, on top of increasing power and performance specifications. The Cadence® Virtuoso advanced-node platform has an innovative set of capabilities that enable designers to take full advantage of the silicon at these process nodes.
The Virtuoso advanced-node platform improves individual point tools to handle these challenges, as well as enables new design methodologies that allow for rapid layout prototyping, in-design signoff, and close collaboration between schematic and layout designers—essential to designing efficiently at advanced-process nodes.LEARN MORE
Advanced FinFET devices and planar devices with FD-SOI technology improve power, performance, and area (PPA), but create additional design challenges. Cadence developed its revolutionary full-flow digital toolset to address these design challenges at the design creation, implementation, and signoff stages.
The Cadence® Full-Flow Digital Implementation and Signoff tools can handle and support all the special requirements of today’s FinFET and advanced-node FD-SOI designs. These tools prevent and correct harmful lithography hotspots, random defects, on-chip variation, and variation due to chemical-mechanical polishing. Using rule- and model-based in-design analysis (pre-qualified and closely related with foundry process simulation), the Cadence Innovus™ Implementation System minimizes risk upfront and prevents unexpected design re-spins and late-stage iterations.LEARN MORE
If you want to achieve silicon success at advanced-node processes, let Cadence help you choose the right IP solution and capture its full value in your SoC design. Cadence® IP solutions offer the combined advantages of a high-quality portfolio, an open platform, and a strong ecosystem.
The Cadence IP Portfolio includes silicon-proven Tensilica® IP cores, analog PHY interfaces, standards-based IP cores, Verification IP (VIP), and other solutions as well as customization services for current and emerging industry standards.LEARN MORE
Moore’s Law Is Still Accelerating
Hyperscalers, mobile, and automotive companies are pushing the pace of advanced nodes
Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation
Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards, Featuring Key Advancements in 3DFabric Design and Cloud-Based Solutions
Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon