Full System Analysis
Analyze thermal, electromagnetic, and circuit behaviors
Save Design Time
Manage long SoC development schedules and minimize the risk of re-spins
Low Power
Extend the battery life with low-power design techniques
Accelerated Design Verification
Design and verify complex designs with high-speed interfaces and demanding security requirements
Overview
5G RF module designs for handsets can exploit the very large bandwidth offered by millimeter wave (mmWave), but also must meet significant challenges in linearity, power, and heat necessary to be successful in the handset market. You face intense pressure on form factor with tight integration of RFICs, baseband, power management, discretes, and multiple-input/multiple-output (MIMO) antenna arrays with advanced packaging. Explore how Cadence can help you more quickly design a smaller, lower power handset through co-design of RFIC, package, and modules; system-level thermal and electromagnetic (EM) analysis; IP, fast simulation and chip verification; and compact DSPs.
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5G combines existing spectrum and new millimeter wave (mmWave), and it’s this higher frequency mmWave that provides both benefits and design challenges for 5G. At these frequencies, patch antenna size is much reduced for radioheads -- to the size of a fingernail. Conversely, signal attenuation is high, so antennas are placed in 2D arrays. This enables beamforming to concentrate and direct the signal energy over greater distances. Cadence® design tools can help you meet high-frequency and beamforming requirements.
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In a centralized or cloud radio access network (C-RAN), baseband cabinets move from the bottom of mobile operator masts to edge-computing facilities in the fronthaul, where centralized baseband can be dynamically shared between radioheads. Massive co-located artificial intelligence (AI) is used to optimize the baseband performance over widely varying radiohead installations and traffic, and provide the AI heavy lifting for robots, drones, and other user equipment.
5G baseband and high-performance computing (HPC) meet in mobile edge-computing centers, and like HPC, the latest digital, network, and machine learning (ML) technologies are driving the market. Fundamental to this are digital design and signoff tools with class-leading power, performance, and area (PPA) outcomes on advanced nodes, where SoC designs incorporate increasing numbers of CPU and AI processor cores. To enable you to build these complex SoCs, Cadence offers electromagnetic and thermal system analysis, IP, 3D-IC solutions for chiplet interconnection, and tools for early software development and high-speed board design.
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Radiohead and baseband will no longer be found at the top and bottom of mobile operators’ masts for 5G, but relocated even deeper into the fabric of cities and buildings and into edge computing data centers, respectively. This significant increase in their physical separation, combined with the ultra-low latency targets for 5G, means the connection of the two (fronthaul) needs a fresh approach. To meet 5G fronthaul timing, frequency, and synchronization requirements, high-speed optical interconnect and optical transceivers for remote radioheads and baseband offer a solution. Cadence offers integrated silicon photonic and electronic co-design for optical transceivers and 100G Ethernet IP support for complicated 5G fronthaul connectivity to multiple radioheads.
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