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  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • 客製IC/類比/RF設計
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • 系統設計與驗證
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC封裝設計與分析
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
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          • Computational Fluid Dynamics
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          • System Analysis Resources Hub
          • AWR Free Trial
      • 嵌入式軟體
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        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
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          • RF / Microwave Design
          • Augmented Reality Lab Tools
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  • 10 June 2021

Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform

SAN JOSE, Calif., 10 Jun 2021

Highlights:

  • Virtuoso Layout Suite EXL, including the EMX 3D Planar Solver, delivered 2X performance improvement over legacy solution
  • Spectre X RF Simulator integrated into Virtuoso ADE Product Suite accelerated harmonic balance and significantly boosted simulation performance
  • AWR VSS software provided RF budget and noise analysis as well as integration of test and measurement for 5G NR and IoT communication standards

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Sequans Communications S.A., a leader in 4G and 5G IoT solutions, has successfully adopted the Cadence® Virtuoso® RF Solution, including the Cadence Spectre® X RF Simulator and Cadence EMX® Planar 3D Solver, for high-frequency RF harmonic balance and electromagnetic (EM) analysis and signoff, to develop its next-generation 5G IoT platform. Sequans also used the Cadence AWR® Visual System Simulator™ (VSS) software to predict and measure overall system performance and functionality in support of the 5G New Radio (NR) and internet of things (IoT) communication standards. The comprehensive, full-suite solution from Cadence enabled Sequans engineers to achieve a 2X performance improvement versus its legacy solution and reduce time to market while ensuring a high level of accuracy.

“Designing 5G IoT devices is simultaneously a complex engineering challenge where designers must address stringent 5G performance specs as well as a cost-conscious exercise to meet the price targets of the IoT marketplace,” said Bertrand Debray, Executive Vice President and GM, Broadband IoT at Sequans. “The Cadence Virtuoso Layout Suite EXL, powered by the Cadence EMX Planar 3D Solver, gives our engineers advanced capabilities within a single unified design environment that greatly improves design team efficiency for meeting aggressive schedule goals. We are very confident and excited about using Cadence RF technologies in this project.”

The Sequans RF engineering team leveraged the Virtuoso RF Solution, which has a highly optimized design environment with embedded EM and multi-technology capabilities, to drive robust RF simulation and analyses. Integrating the EMX Planar 3D Solver directly into the Virtuoso Layout Suite EXL environment empowered Sequans engineers to efficiently design and verify critical on-chip and off-chip passive devices and interconnect. The multi-technology capabilities of the Virtuoso RF Solution let integrated circuits (IC)s, packages and boards be combined and co-designed within a single, unified design platform, thereby significantly reducing EM setup time and effort and allowing designers to meet the growing EM requirements of 5G, IoT and other advanced communication standards. Additionally, the seamless interplay of advanced simulation, multiphysics and RF technologies within the Cadence solution delivers a one-of-a-kind, comprehensive and extensible platform for chip, package and board design through to the end-to-end complete system design, analysis and signoff.

“The Cadence Intelligent System Design strategy, which enables customers to design from chips to packages/boards and large electrical systems more efficiently, continues to gain momentum globally with Sequans being one of the latest companies to embrace the Cadence RF solution,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “Our electronic design software is recognized worldwide for its innovation and complete full-flow solutions that seamlessly leverage best-in-class EM signoff technology including the EMX and Clarity technologies.”

The EMX Planar 3D Solver is part of the broader set of multiphysics system-level solutions offered within the Virtuoso RF Solution. It supports the company’s Intelligent System Design™ strategy, delivering complete EM signoff for SoC design excellence. To learn more about the comprehensive Cadence RF solution, visit www.cadence.com/go/RFSolution.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

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