Home
  • 技術產品
  • 解決方案
  • 支援與培訓
  • 公司資訊
  • ZH TW
    • SELECT YOUR COUNTRY OR REGION

    • US - English
    • China - 简体中文
    • Japan - 日本語
    • Korea - 한국어

DESIGN EXCELLENCE

  • 數位設計流程
  • 客製IC/類比/RF設計
  • Verification
  • IP
  • IC封裝設計與分析

SYSTEM INNOVATION

  • Multiphysics System Analysis
  • 嵌入式軟體
  • PCB設計與分析
  • Computational Fluid Dynamics

PERVASIVE INTELLIGENCE

  • AI / 機器學習
  • AI IP系列

CADENCE雲端方案

VIEW ALL PRODUCTS

數位設計流程

Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

PRODUCT CATEGORIES

  • Logic Equivalence Checking
  • SoC Implementation and Floorplanning
  • Functional ECO
  • Low-Power Validation
  • Synthesis
  • Power Analysis
  • Constraints and CDC Signoff
  • Silicon Signoff and Verification
  • Library Characterization
  • Test

FEATURED PRODUCTS

  • Cerebrus Intelligent Chip Explorer
  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff Solution
  • Pegasus Verification System
  • RESOURCES
  • Flows
  • Voltus IC Power Integrity Solution

客製IC/類比/RF設計

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

PRODUCT CATEGORIES

  • Circuit Design
  • Circuit Simulation
  • Layout Design
  • Layout Verification
  • Library Characterization
  • RF / Microwave Solutions

FEATURED PRODUCTS

  • Spectre X Simulator
  • Spectre FX Simulator
  • Virtuoso Layout Suite
  • Virtuoso ADE Product Suite
  • Virtuoso Advanced Node
  • Voltus-Fi Custom Power Integrity Solution
  • RESOURCES
  • Flows

系統設計與驗證

Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry

PRODUCT CATEGORIES

  • Debug Analysis
  • Virtual Prototyping
  • Emulation and Prototyping
  • Static and Formal Verification
  • Planning and Management
  • Simulation
  • Software-Driven Verification
  • Verification IP
  • System-Level Verification IP

FEATURED PRODUCTS

  • vManager Verification Management
  • Xcelium Logic Simulation
  • Palladium Enterprise Emulation
  • Protium Enterprise Prototyping
  • System VIP
  • RESOURCES
  • Flows
  • Jasper C Apps
  • Helium Virtual and Hybrid Studio

IP

An open IP platform for you to customize your app-driven SoC design.

PRODUCT CATEGORIES

  • Denali Memory Interface and Storage IP
  • 112G/56G SerDes
  • PCIe and CXL
  • Tensilica Processor IP
  • Chiplet and D2D
  • Interface IP

RESOURCES

  • Discover PCIe

IC封裝設計與分析

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

PRODUCT CATEGORIES

  • Cross-Platform Co-Design and Analysis
  • IC Package Design
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • Flows

系統分析

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

PRODUCT CATEGORIES

  • Computational Fluid Dynamics
  • Electromagnetic Solutions
  • RF / Microwave Design
  • Signal and Power Integrity
  • Thermal Solutions

FEATURED PRODUCTS

  • Clarity 3D Solver
  • Clarity 3D Solver Cloud
  • Clarity 3D Transient Solver
  • Celsius Thermal Solver
  • Fidelity CFD
  • Sigrity Advanced SI
  • Celsius Advanced PTI
  • RESOURCES
  • System Analysis Center
  • System Analysis Resources Hub
  • AWR Free Trial

嵌入式軟體

PCB設計與分析

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.

PRODUCT CATEGORIES

  • Design Authoring
  • PCB Layout
  • Library and Design Data Management
  • Analog/Mixed-Signal Simulation
  • SI/PI Analysis
  • SI/PI Analysis Point Tools
  • RF / Microwave Design
  • Augmented Reality Lab Tools

FEATURED PRODUCTS

  • Allegro Package Designer Plus
  • Allegro PCB Designer
  • RESOURCES
  • What's New in Allegro
  • Advanced PCB Design & Analysis Resources Hub
  • Flows

Computational Fluid Dynamics

AI / 機器學習

AI IP系列

Industries

  • 5G 系統
  • 航太與國防
  • 車用方案
  • Hyperscale Computing

Technologies

  • 3D-IC 設計
  • 先進製程
  • AI / 機器學習
  • Arm-Based方案
  • Cloud Solutions
  • Computational Fluid Dynamics
  • Functional Safety
  • 低功耗方案
  • 混合訊號
  • Photonics
  • RF / Microwave
See how our customers create innovative products with Cadence

Support

  • Support Process
  • Online Support
  • Software Downloads
  • Computing Platform Support
  • Customer Support Contacts
  • Technical Forums

Training

  • Custom IC / Analog / RF Design
  • Languages and Methodologies
  • Digital Design and Signoff
  • IC Package
  • PCB Design
  • System Design and Verification
  • Tensilica Processor IP
Stay up to date with the latest software 24/7 - Cadence Online Support Visit Now

Corporate

  • About Us
  • Designed with Cadence
  • Investor Relations
  • Leadership Team
  • Computational Software
  • Alliances
  • Corporate Social Responsibility
  • Cadence Academic Network

Media Center

  • Events
  • Newsroom
  • Blogs

Culture and Careers

  • Culture and Diversity
  • Careers
Learn how Intelligent System Design™ powers future technologies Browse Cadence’s latest on-demand sessions and upcoming events. Explore More
ZH - Taiwan
  • US - English
  • China - 简体中文
  • Japan - 日本語
  • Korea - 한국어
  • 技術產品
    • DESIGN EXCELLENCE
      • 數位設計流程
        • PRODUCT CATEGORIES
          • Logic Equivalence Checking
          • SoC Implementation and Floorplanning
          • Functional ECO
          • Low-Power Validation
          • Synthesis
          • Power Analysis
          • Constraints and CDC Signoff
          • Silicon Signoff and Verification
          • Library Characterization
          • Test
        • FEATURED PRODUCTS
          • Cerebrus Intelligent Chip Explorer
          • Genus Synthesis Solution
          • Innovus Implementation System
          • Tempus Timing Signoff Solution
          • Pegasus Verification System
          • RESOURCES
          • Flows
          • Voltus IC Power Integrity Solution
      • 客製IC/類比/RF設計
        • PRODUCT CATEGORIES
          • Circuit Design
          • Circuit Simulation
          • Layout Design
          • Layout Verification
          • Library Characterization
          • RF / Microwave Solutions
        • FEATURED PRODUCTS
          • Spectre X Simulator
          • Spectre FX Simulator
          • Virtuoso Layout Suite
          • Virtuoso ADE Product Suite
          • Virtuoso Advanced Node
          • Voltus-Fi Custom Power Integrity Solution
          • RESOURCES
          • Flows
      • 系統設計與驗證
        • PRODUCT CATEGORIES
          • Debug Analysis
          • Virtual Prototyping
          • Emulation and Prototyping
          • Static and Formal Verification
          • Planning and Management
          • Simulation
          • Software-Driven Verification
          • Verification IP
          • System-Level Verification IP
        • FEATURED PRODUCTS
          • vManager Verification Management
          • Xcelium Logic Simulation
          • Palladium Enterprise Emulation
          • Protium Enterprise Prototyping
          • System VIP
          • RESOURCES
          • Flows
          • Jasper C Apps
          • Helium Virtual and Hybrid Studio
      • IP
        • PRODUCT CATEGORIES
          • Denali Memory Interface and Storage IP
          • 112G/56G SerDes
          • PCIe and CXL
          • Tensilica Processor IP
          • Chiplet and D2D
          • Interface IP
        • RESOURCES
          • Discover PCIe
      • IC封裝設計與分析
        • PRODUCT CATEGORIES
          • Cross-Platform Co-Design and Analysis
          • IC Package Design
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • Flows
    • SYSTEM INNOVATION
      • 系統分析
        • PRODUCT CATEGORIES
          • Computational Fluid Dynamics
          • Electromagnetic Solutions
          • RF / Microwave Design
          • Signal and Power Integrity
          • Thermal Solutions
        • FEATURED PRODUCTS
          • Clarity 3D Solver
          • Clarity 3D Solver Cloud
          • Clarity 3D Transient Solver
          • Celsius Thermal Solver
          • Fidelity CFD
          • Sigrity Advanced SI
          • Celsius Advanced PTI
          • RESOURCES
          • System Analysis Center
          • System Analysis Resources Hub
          • AWR Free Trial
      • 嵌入式軟體
      • PCB設計與分析
        • PRODUCT CATEGORIES
          • Design Authoring
          • PCB Layout
          • Library and Design Data Management
          • Analog/Mixed-Signal Simulation
          • SI/PI Analysis
          • SI/PI Analysis Point Tools
          • RF / Microwave Design
          • Augmented Reality Lab Tools
        • FEATURED PRODUCTS
          • Allegro Package Designer Plus
          • Allegro PCB Designer
          • RESOURCES
          • What's New in Allegro
          • Advanced PCB Design & Analysis Resources Hub
          • Flows
      • Computational Fluid Dynamics
    • PERVASIVE INTELLIGENCE
      • AI / 機器學習
      • AI IP系列
    • CADENCE雲端方案
    • VIEW ALL PRODUCTS
  • 解決方案
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
      • Industries
        • 5G 系統
        • 航太與國防
        • 車用方案
        • Hyperscale Computing
      • Technologies
        • 3D-IC 設計
        • 先進製程
        • AI / 機器學習
        • Arm-Based方案
        • Cloud Solutions
        • Computational Fluid Dynamics
        • Functional Safety
        • 低功耗方案
        • 混合訊號
        • Photonics
        • RF / Microwave
  • 支援與培訓
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
      • Support
        • Support Process
        • Online Support
        • Software Downloads
        • Computing Platform Support
        • Customer Support Contacts
        • Technical Forums
      • Training
        • Custom IC / Analog / RF Design
        • Languages and Methodologies
        • Digital Design and Signoff
        • IC Package
        • PCB Design
        • System Design and Verification
        • Tensilica Processor IP
  • 公司資訊
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers
      • Corporate
        • About Us
        • Designed with Cadence
        • Investor Relations
        • Leadership Team
        • Computational Software
        • Alliances
        • Corporate Social Responsibility
        • Cadence Academic Network
      • Media Center
        • Events
        • Newsroom
        • Blogs
      • Culture and Careers
        • Culture and Diversity
        • Careers

  • Home
  •   :  
  • About Us
  •   :  
  • Newsroom
  •   :  
  • News Releases
  •   :  
  • 11 Aug 2004

Cadence Announces New OrCAD Technology to Help Shorten PCB Design Cycles

PSpice Enhancements Provide Highest Level of Integration Between Analog Simulator and MathWorks' MATLAB

San Jose, CA, 10 Aug 2004

Cadence Design Systems, Inc. (NYSE and NASDAQ: CDN) today announced new PSpice-based simulation technology for the OrCAD® product line, enabling shortened PCB design cycles for the power electronics, military/aerospace, and automotive industries. Seamlessly integrating proven Cadence® PSpice® technology with industry-leading MATLAB® and Simulink® products from The MathWorks, the new PSpice SLPS interface, co-developed by Cadence and Cybernet Systems in Japan, allows co-simulation of electrical and mechanical systems, making it easier to detect critical issues early in the design cycle. When combined with the stress analysis capabilities of the new PSpice Smoke option, the reliability of designs can be analyzed and improved earlier in the design cycle.

"We welcome this integration between PSpice and our MATLAB and Simulink products," said Jim Tung, MathWorks Fellow at The MathWorks. "This is a significant step in the right direction to leverage advanced, cost-effective PCB design solutions with our Model-Based Design tools in the automotive, military/aerospace, and power electronics industries."

Currently, many companies design and test the electronics separately from the system level. With this approach, integration issues often aren't discovered until the prototype phase, causing critical time delays in getting a product to market. The new integration offered with the PSpice SLPS interface and the MATLAB and Simulink products helps designers avoid this problem. In many cases, this can achieve a successful system design with only one prototype.

The PSpice SLPS simulation environment supports the substitution of an actual electronic block, allowing co-simulation with MATLAB and Simulink and thereby enabling the designer to identify and correct integration issues of electronics within a system. This helps identify errors earlier in the design process, which can save time and money often spent in debugging trial boards within system designs. With the PSpice Smoke option, designers can perform a stress audit to verify that electrical components are operating within the manufacturers' safe operating limits or de-rated limits. The Smoke tool flags violations such as power dissipation, secondary breakdown limits, current/voltage and junction temperature limits. Because thermal violations are detected at the design level, design re-spins can be minimized.

"The latest additions to the OrCAD product line further demonstrate our on-going commitment to this market and, most importantly, the PCB designers we serve," said Steve Kamin, director of the OrCAD product line at Cadence. "Cadence is a pioneer in the field of PCB design and this new technology demonstrates our continuing efforts to develop innovative OrCAD solutions."

The PSpice SLPS interface and the PSpice Smoke option, available now, fit seamlessly into a front-to-back PCB design flow for power electronics; the PSpice product is already part of OrCAD Capture to OrCAD Layout and OrCAD Capture to Allegro PCB flows.

OrCAD products are distributed by a worldwide network of solution providers. For more information on OrCAD, please visit http://www.orcad.com.

About Cadence
Cadence is the world's largest supplier of electronic design technologies and engineering services. Cadence products and services are used to accelerate and manage the design of semiconductors, computer systems, networking equipment, telecommunications equipment, consumer electronics, and other electronics based products. With approximately 4,850 employees and 2003 revenues of approximately $1.1 billion, Cadence has sales offices, design centers, and research facilities around the world. The company is headquartered in San Jose, Calif., and trades on both the New York Stock Exchange and Nasdaq under the symbol CDN. More information is available at www.cadence.com.

For more information, please contact:
Molly Taylor
direct:408.975.3067
mtaylor@hoffman.com
The Hoffman Agency
for Cadence Design Systems


Cadence, the Cadence logo, OrCAD, PSpice and Allegro are registered trademarks of Cadence Design Systems. MATLAB and Simulink are registered trademarks of The MathWorks, Inc. All other trademarks are the property of their respective owners.

Media Contacts

For more information, please contact:

Cadence Newsroom

408.944.7039

newsroom@cadence.com

A Great Place to Do Great Work!

Eighth year on the FORTUNE 100 list

Our Culture Join The Team
  • Products
  • Custom IC and RF
  • Digital Design and Signoff
  • IC Package
  • IP
  • PCB Design
  • System Analysis
  • Verification
  • All Products
  • Company
  • About Us
  • Leadership Team
  • Investor Relations
  • Alliances
  • Careers
  • Cadence Academic Network
  • Supplier
  • Media Center
  • Events
  • Newsroom
  • Press Releases
  • Designed with Cadence
  • Blogs
  • Forums
  • Contact Us
  • General Inquiry
  • Customer Support
  • Media Relations
  • Global Office Locator

Stay Connected

Please confirm to enroll for subscription!

Stay Connected

Thank you for subscribing. You will get an email to confirm your subscription.

© 2022 Cadence Design Systems, Inc. All Rights Reserved.

Terms of Use Privacy US Trademarks