SELECT YOUR COUNTRY OR REGION
DESIGN EXCELLENCE
SYSTEM INNOVATION
PERVASIVE INTELLIGENCE
CADENCE雲端方案
VIEW ALL PRODUCTS
數位設計流程
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
PRODUCT CATEGORIES
FEATURED PRODUCTS
客製IC/類比/RF設計
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
系統設計與驗證
Offering a full verification flow to our customers and partners that delivers the highest verification throughput in the industry
IP
An open IP platform for you to customize your app-driven SoC design.
RESOURCES
IC封裝設計與分析
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
系統分析
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
嵌入式軟體
PCB設計與分析
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
Computational Fluid Dynamics
AI / 機器學習
AI IP系列
Industries
Technologies
Support
Training
Corporate
Media Center
Culture and Careers
Cardo produces cutting-edge audio connectivity for the road using Tensilica HiFi 4 DSP.
ShareLink Copied
Ampere engineers their cloud native architecture with Cadence and Arm technologies.
Mimi personalizes the hearing experience and makes it healthier using Tensilica HiFi DSPs.
Prophesee developed an intelligent pixel and intelligent sensor using the Jasper platform
Renault Reduces CO2 Emissions Using Cadence Omnis CFD Technology
Xvisio uses Tensilica DSPs to create an AR and VR set that anyone can build upon.
Lightelligence designs their optical computer system using Integrity 3D-IC and Innovus.
Shinshu University develops a voice recognition system with Cadence for hands-free use of technology.
Rodelta optimizes pumps using meshing and non-linear harmonic of Cadence’s Omnis CFD Platform
Raspberry Pi used Allegro X, Xcelium, and Digital Full Flow tools to design their popular computers.
EdgeQ delivers the world’s first 5G base station on a chip using Xcelium and Digital Full Flow
Learn how Sequans develops its next generation 5G IoT platform using Virtuoso RF Solution.
Learn how Nexite uses Cadence Liberate and Spectre technologies to design their NanoBT tag.
Imagination uses Cadence digital design and simulation solutions to deliver leading-edge GPU technology for automotive, mobile, and data center products.
Samsung uses Cerebrus ML to tune their digital implementation flow for the latest foundry nodes, automatically delivering 8% better PPA
Learn how Renesas has been using Cerebrus ML to optimize the digital implementation flow, delivering 15% lower power and 10% better performance.
Corning overcomes the speed, power, and material challenges using Sigrity technology.
Honda implements Cadence Computational Fluid Dynamics platform for solution automation.
Highly accurate and 3X faster simulation ensures IC designs function as intended and meet specifications.
Learn how Cadence technologies help create mmWave ICs for terrestrial and aerial radar.
DSP Concepts partnered with Cadence to create an AI-Optimized Audio framework for Cadence Tensilica HiFi processors.
Learn how Dynamic Duo 2.0 is becoming a game-changer technology for NVIDIA.
Palladium and Protium help AMD push emulation in capacity, next-gen testbench design, advanced clocking, and hybrid use.
ETNZ engineers explain why simulation is key to winning this edition and defending the trophy.
