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Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
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With a helping hand from Cadence, National Tsing Hua University has created a human-like robot arm.
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Xvisio uses Tensilica DSPs to create an AR and VR set that anyone can build upon.
Lightelligence designs their optical computer system using Integrity 3D-IC and Innovus.
Shinshu University develops a voice recognition system with Cadence for hands-free use of technology.
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Raspberry Pi used Allegro X, Xcelium, and Digital Full Flow tools to design their popular computers.
EdgeQ delivers the world’s first 5G base station on a chip using Xcelium and Digital Full Flow
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Samsung uses Cadence Cerebrus ML to tune their digital implementation flow for the latest foundry nodes, automatically delivering 8% better PPA
Learn how Renesas has been using Cadence Cerebrus ML to optimize the digital implementation flow, delivering 15% lower power and 10% better performance.
Corning overcomes the speed, power, and material challenges using Sigrity technology.
Honda implements Cadence Computational Fluid Dynamics platform for solution automation.
