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DESIGN EXCELLENCE

數位設計流程
客製IC/類比/RF設計
系統設計與驗證
IP
IC封裝設計與分析

SYSTEM INNOVATION

系統分析
嵌入式軟體
PCB設計與分析

PERVASIVE INTELLIGENCE

AI / 機器學習
AI IP系列

CADENCE雲端方案

數位設計流程

Cadence^® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.

Logic Equivalence Checking
Innovus Implementation and Floorplanning
Functional ECO
Low-Power Validation
Synthesis
Power Analysis
Constraints and CDC Signoff
Silicon Signoff and Verification
Library Characterization
Test
Flows
Achieve best PPA with the next-generation Digital Full Flow solution Learn More
Address digital implementation challenges with machine learning Watch Now

客製IC/類比/RF設計

Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.

Circuit Design
Circuit Simulation
Layout Design
Layout Verification
Library Characterization
RF / Microwave Solutions
Flows
Solve analog simulation challenges in complex designs Watch Now
See how the Virtuoso Design Platform addresses advanced custom IC and system design challenges Watch Now

系統設計與驗證

Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.

Debug Analysis
Emulation
Formal and Static Verification
FPGA-Based Prototyping
Planning and Management
Simulation
Software-Driven Verification
Verification IP
System-Level Verification IP
Flows
Prototype your embedded software development Watch Now
Learn how early firmware development enabled first silicon success at Toshiba Memory Watch Now

An open IP platform for you to customize your app-driven SoC design.

Interface IP
Denali Memory IP
Tensilica Processor IP
Analog IP
System / Peripherals IP
Verification IP
Solve the challenges of long-reach signaling with Cadence 112G SerDes IP Watch Now
Meeting the needs of 5G communication with Tensilica^® ConnX B20 DSP IP Download Now

IC封裝設計與分析

Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.

Cross-Platform Co-Design and Analysis
IC Package Design
SI/PI Analysis
SI/PI Analysis Point Tools
Flows
Cadence Design Solutions certified for TSMC SoIC advanced 3D chip stacking technology Learn More
Four reasons to avoid multi-layer flip-chip pin padstacks Learn More

系統分析

Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.

See how to improve electrical-thermal co-simulation with the Celsius™ Thermal Solver Watch Now
Get true 3D system analysis with faster speeds, more capacity, and integration Watch Now
Electromagnetic Solutions
RF / Microwave Design
Thermal Solutions
System Analysis Resources Hub

嵌入式軟體

PCB設計與分析

Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.