System Innovation

Performance-optimized, secure electronics systems, from chip to package,
to board, software, and case

Key Benefits

Design of electronics systems includes PCBs, 3D-IC packaging, and signal integrity, electromagnetic, and electrothermal analysis. These multi-physics analyses are applied from chip and package to PCB, cabling, and connectivity. Develop software and co-optimize your hardware and software with security in mind.

Benefits to Your Enterprise

On-time creation of performance-optimized, secure electronics systems, from chip and package, to board, software, and case

Increase Efficiency

Reduce effort and time to perform system analysis, earlier development, and validation of secure software, efficiently designed in the smallest packaging with required thermal dissipation

Add Value

Develop embedded systems that differentiate your company with high performance, high quality, and secure functionality in end-use applications

Product Groups

System Analysis

Accurately and seamlessly address EM, thermal, and electromechanical challenges for IC, package, PCB, and SOIC

PCB Design

Complete, integrated, simulation-driven design solution for your entire electronic product design team

Embedded Software

Start SW development early with a shift left of HW/SW integration to be ready when silicon is back from production

Cadence Cloud

Boost engineering productivity with solutions that deliver intelligent scalability, security, and flexibility

What's New

Video

True 3D System Analysis with Faster Speeds and More Capacity

Clarity™ 3D Solver provides gold-standard accuracy with 10x faster analysis speeds and virtually unlimited capacity

Press Release

Cadence Acquires AWR Corporation to Accelerate System Innovation for 5G RF Communications

Ecosystem

Green Hills Partners with Cadence

Learn how you can accelerate development of embedded safety and security