Overview

Best-in-class USB4™ Verification IP for your IP, SoC. and system-level design testing.

Used by all top market leaders semiconductor companies.

The Cadence® Verification IP (VIP) for USB4™ provides a highly capable verification solution for the USB4 protocol incorporating bus functional model (BFM) and integrated protocol checkers and coverage. It is based on the next-generation USB protocol architecture of USB4 specification. The VIP for USB4 enables multiple simultaneous data and display protocols and supports them to share the bandwidth over the bus. It supports the two-lane operation and up to 40Gbps speed.

The VIP for USB4 is compatible with the industry-standard Universal Verification Methodology (UVM) and runs on all leading simulators.

Supported Specifications: USB4™ Specification Version 1.0, and USB4™ Re-Timer Specification Version 1.0.

USB4 diagram

Product Highlights

  • Support for Universal Verification Methodology (UVM) with SystemVerilog test bench language interface
  • Runs with Xcelium, VCS, and MTI simulators
  • Capability to insert User Defined Packets at all major layers
  • Capability to bypass specification features such as Bypass Sideband Channel, Bypass High Speed Link Training and Bypass Enumeration
  • Callback capabilities to change or corrupt the packet fields, discard a packet to create time-out scenarios, collect coverage, and create a scoreboard
  • Register interface flow to change timing parameters to reduce simulation time
  • SV coverage infrastructure for extendable coverage
  • Predefined protocol checkers to verify the DUT against the protocol requirements like HEC, IPG, etc.

Key Features

The following table describes key features from the specifications that are implemented in the VIP:

Feature

Description

Logical Layer
  • Sideband Channel
  • Logical Layer State Machine
  • Both GEN2 and GEN3 speeds
  • Reed-Solomon forward error-correction code (RS-FEC)
  • Dual-Lane Skew
  • Low Power states
  • Sleep and wake
  • Error Cases and Recovery
  • Interoperability with Thunderbolt 3 (TBT3) for Logical Layer

Transport Layer
  • Transport Layer Packets
  • Routing
  • Quality of Service (QOS): Flow control schemes, Bandwidth arbitration and priority
  • Path Setup and Path Tear-Down

Configuration Layer
  • Router States
  • Control Packet Protocol
  • Router Enumeration
  • Hot Plug and Hot Unplug Events

Time Synchronization
  • Intra-Domain and Inter-Domain time sync
  • Bi-Directional and Uni-Directional state machines
  • Serial Time Link Protocol

Configuration Spaces
  • Support to read and write the defined configuration space for Router, Adapter and Path
  • Support to backdoor access the configuration space

USB3 Tunneling
  • USB3 Adapter Layer Encapsulation
  • Path Setup and Tear-Down
  • Isochronous Timestamp Mechanism

DP Tunneling
  • LTTPR and Non-LTTPR mode
  • DP-IN and DP-OUT Adapters
  • DP Adapter States
  • System Flows
  • AUX Request and Response Handling
  • DP Link Clock Sync
  • SST Tunneling
  • MST Tunneling
  • DP FEC
  • HDCP

PCIe® Tunneling
  • PCIe Adapter Layer Encapsulation
  • Path Setup and Tear-Down
  • Precision Time Management (PTM) Mechanism

Re-Timer
  • Sideband Channel
  • Re-Timer Channel State Machine
  • Low Power
  • Clock Switching
  • Interoperability with Thunderbolt 3 (TBT3) compatibility

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