概述
功能强大且易于使用的创新系统
Cadence 系统设计和分析平台产品确保芯片、封装、电路板和外壳的高性能、安全性和精简设计。平台集成设计同步多物理场系统分析工具，助您轻松应对极其复杂的 EMI/EMC、电源、信号和热完整性挑战，确保产品一次达到极佳性能。
借助 Cadence 系统设计和分析平台，您可以提高设计质量、降低返工成本，并超越客户期望。与我们携手，共同迈向电子产品设计的未来。
Platforms Collections
Cadence Software: Where Design Meets Intelligence
Key Benefits
High-Accuracy Results for Accelerated Time to Market
In-Design, High-Performance Platform
Reduce design effort and time with earlier simulation and analysis built into your system design platform. This allows you to create high-performance, secure electronics systems efficiently, from chip to case, all within a smaller package.
Unmatched Efficiency and Scalability
Experience massive performance gains (up to 10X faster) with the System Design and Analysis Platform, allowing you to tackle complex designs with virtually unlimited capacity.
Differentiation Through Innovation
Develop cutting-edge system designs that set you and your company apart, enabling you to create high-quality, secure systems with exceptional performance and a competitive advantage.
左移
利用 Cadence.AI 解决复杂的系统设计挑战
The electronics industry is in a high-stakes race. The demand for ever-better products, delivered at lightning speed, is pushing the boundaries of design. Here's where a revolutionary approach called shift left in-design and analysis steps up to the challenge.
Imagine a platform that combines the power of cutting-edge AI, intelligent system design, and high-performance analysis software – all rolled into one. This is the magic behind the shift left methodology. By incorporating analyses of critical factors like electromagnetics, thermal, and signal integrity early in the design process (traditionally left for later stages), you gain a superpower: the ability to identify and fix problems before they slow you down.
What's New
Platform Solutions
Supercharge Your Systems Design With AI-Powered Speed and Engineering Quality
PCB 设计与分析
曾经为复杂的 PCB 设计焦头烂额的日子已成为过去！ 想象这样一个世界：将复杂布局从模糊概念轻松转变为真实产品。这正是 AI 驱动的 PCB 设计和分析解决方案的强大魅力所在。
借助设计同步分析功能，您可以简化整个工作流程，从容应对复杂的挑战。 这不仅可以缩短产品上市时间，降低错误风险，更能让您高效且出色地完成 PCB 设计。
IC 封装设计与分析
借助具有突破性的设计和分析工具，完善先进封装，打破传统限制，实现跨领域无缝协作，提供出色的准确度。 将芯片与封装设计完美结合，实现性能最大化和成本最小化。
轻松集成异构多芯片与芯粒设计。 通过专为扇出型晶圆级封装 (FOWLP) 量身定制的精细分析和验证流程，实现卓越的可靠性。 借助与主要代工厂及外包半导体组装和测试 (OSAT) 供应商无缝集成的参考流程，快速启动设计。 这不仅仅涉及集成电路封装设计和分析，更是一场先进封装革命，助您引领电子产品的未来。
多物理场系统分析
通过多物理场分析，轻松应对最复杂的电子系统挑战。 模拟真实环境，电磁干扰 (EMI)、热、信号、电源完整性等全部集成于无缝设计流程中。
我们的高性能工具可轻松与现有平台集成，将分析速度提升 10 倍，提供卓越的准确度。告别复杂性困扰，轻松打造具有突破性的电子系统。
射频/微波分析
您可以在硅射频集成电路 (RFIC)、III-V 化合物半导体、PCB 和多工艺组件领域，解决从概念到签核的射频至毫米波 (mmWave) 前端元件和无线子系统设计。Cadence AWR Design Environment 平台电子设计自动化 (EDA) 软件套件为射频/微波工程师提供了创新的高频电路、系统和电磁 (EM) 分析技术。我们还拥有领先的 AI 驱动的计算软件，助您更快地将多结构系统推向市场。
计算流体力学 (CFD)
Cadence 计算流体力学有助提升流体力学分析能力，驱动创新。 优化航空航天、汽车等领域产品性能，无需依赖昂贵的物理测试。
以卓越的速度和准确度简化工作流程和尖端技术，助您攻克复杂的工程设计挑战，加速突破性产品的落地。
数据中心解决方案
借助下一代设计与管理平台，革新您的数据中心。 利用数字孪生技术创建数据中心虚拟副本，在开始构建之前优化性能和效率。
工程师可使用领先仿真技术开展设计，与此同时，IT 与设施团队无缝协作，确保可持续运营并满足服务水平协议 (SLA) 要求。 这就是面向未来的数据中心管理——以积极主动的态度和高效协作的方式，确保设计成功。
Support
Need Help?
Cadence Support puts the help you need within easy reach – around the clock, seven days a week. Locate the latest software updates, case and Cadence change request information, technical documentation, articles, and more.
We offer two tiers of support, Basic for those focused on self-service, and Premium for those who want access to Cadence expert-level assistance from our team of support Application Engineers.
| Features | Basic Support | Premium Support |
|---|---|---|
| Access to Application Support and Knowledge (ASK) Portal(opens in a new tab) | ||
| Online Training Content Access | ||
| Forum Access(opens in a new tab) | ||
| Bug Reporting | ||
| Incremental Updates (Bug Fixes) | ||
| AE assistance/Case Filing | ||
| Access to File a Case | ||
| Major Releases |