RF Through mmWave System Design
Cadence® AWR Design Environment® Version 16 (V16) introduces groundbreaking cross-platform interoperability to support RF IP integration for heterogeneous technology development across Cadence Allegro® PCB Designer, Virtuoso® System Design, and Virtuoso RF Solution platforms, delivering up to a 50% reduction in turnaround time compared to competing workflows. The V16 release also provides seamless integration with Cadence’s Clarity™ 3D Solver and Celsius™ Thermal Solver, delivering unconstrained capacity for electrothermal performance analysis of large-scale and complex RF systems.
The V16 Advantage
Turn concepts into real RF/microwave components, optimized for performance and ready for easy integration into multi-fabric systems that are right the first time
Capture true RF system performance with tightly coupled electromagnetic (EM) and thermal analysis for solving large, complex structures and heat-generating RF power applications
Embeddable and re-usable Cadence Microwave Office® circuit design software IP ushers in a new era of unprecedented cross-platform workflows to the Allegro and Virtuoso platforms for chip, package, board, and module design
AWR Design Environment Platform V16 Workflows
RF to Virtuoso Platform
Import Designs into Virtuoso Platform for Multi-Technology Integration
IP generated from Microwave Office software and implemented as MMIC or package/laminate technologies can be used in Virtuoso Schematic Editor and/or Virtuoso Layout Suite to integrate these designs into multi-technology systems, eliminating the need for manual design re-entry, reducing time, costs, and the potential for errors.
RF to Allegro Platform
Integrating RF IP into PCB Manufacturing Layout
The Microwave Office software to Allegro PCB workflow provides a seamless schematic and layout data transfer from Microwave Office software to the Allegro PCB design platform, eliminating time-consuming and error-prone manual re-entry. By using parts with identical symbols, footprints, and properties between the Allegro platform and Microwave Office software, RF designs are instantly recognizable to the layout engineer, allowing RF and layout design teams to work collaboratively, yet independently.
RF to Multiphysics Analysis
Clarity 3D Solver Integration
Simulate EM structures from the Microwave Office software’s user interface using the Clarity 3D Solver, a 3D full-wave EM simulation software tool. The Clarity 3D Solver uses distributed multiprocessing technology to deliver virtually unlimited capacity and 10X speed over legacy EM simulators to address large RF designs such as entire modules and complete bulk acoustic wave (BAW)/surface acoustic wave (SAW) filters.
Celsius Thermal Solver Integration
Run thermal analysis from within the Microwave Office software’s user interface using the Celsius Thermal Solver. The Celsius Thermal Solver’s structures can be created either by drawing/importing the geometry in the EM editor or by using EM extraction with simulated temperature results automatically returned into Microwave Office software. 3D plots of the thermal temperature distribution can be viewed in the Celsius Thermal Solver’s native editor.
Additional V16 Release Features
Parallel Remote Simulation
The job scheduler now supports multiple simultaneous remote queues, enabling designers to run long circuit simulation or optimization jobs in parallel, either locally or remotely.
Dynamic Voiding and Automatic Net Connectivity Extraction
A new dynamic voiding layout mode in Microwave Office software automatically adds clearance between layout shapes and nets for various drawing layers and is defined by constraint rules specified in the layout process file (LPF).
Version control manages group design projects, allowing group design data management of complex, multi-function designs in many different technologies.
Layout Trace Interconnect Modeling
The new interconnect (INTERCONN) system block in Cadence Visual System Simulator™ (VSS) communications and radar systems design software models the effects of transmission line loss, impedance mismatch, and coupling.
RF Amplifier Power Saturation and Frequency Multiplier Modeling
Improvements to the VSS software’s modeling of RF amplifiers in saturation now yields a smoother power output versus power input curve. The VSS software’s behavioral frequency multiplier models have been improved for both saturated output power and spur level, yielding close agreement between time domain, RF budget analysis, and RFI simulations.
Enhanced single-thread and parallel simplex optimizers in Microwave Office software with variable step size provide more flexibility than previous simplex optimizers, making them more widely applicable and/or resistant to local minima.