Design complexity and signal speeds have increased. As we continue the path of providing more technology in smaller footprints, electromagnetic (EM) interconnect modeling has become a cornerstone of system analysis.
Cadence offers several types of EM field solvers that help you analyze EM coupling effects, signal coupling, and simultaneous switching noise (SSN). Whether your design challenge is developing a chip, package, PCB, or the complete subsystem, Cadence offers the right technology to address your EM modeling challenge quickly and efficiently.
Cadence can help you develop resistance-inductance-capacitance (RLC), package IBIS models, or S-parameter models with gold-standard accuracy in a fraction of the time of legacy field solver technology. Cadence EM solver technology includes:
- Silicon extraction (redistribution layer and/or silicon interposer)
- Full package modeling
- Full PCB modeling
- High-fidelity and full-system interconnect modeling