Key Benefits
- Accurate distributed model to reflect the true circuit behavior, including TSV
- Efficient extraction of mutual inductance and coupling capacitance for both power grid structures and I/O signal interconnects
- Maximum accuracy with a compact chip model that is spatially distributed with high pin resolution
- Time-domain simulation environment for easy quality assessment of created interconnect models
To help you create accurate models for the silicon portion of a power delivery network (PDN) or a signal network, the interconnect model extraction technology is available through a unique extraction solution that creates compact models from silicon layout data. Whether the LEF/DEF (silicon data) file represents a redistribution layer (RDL) or a silicon interposer, creating an interconnect model from classic chip modeling tools is time consuming and too inefficient for use in a system-level time-domain simulator. However, the Sigrity XcitePI™ extraction technology, part of the Advanced IC Package Extraction Suite, provides a compact model with the accuracy needed to run a system simulation for interfaces such as DDR5.
The Advanced IC Package Extraction Suite also includes all the technology included in the Clarity IC Package Extraction Suite. This complete extraction solution complements the Advanced IBIS Modeling, Sigrity Advanced SI, and Sigrity SystemPI solutions.
Features
- Rapid what-if experiments for achieving targeted design performance improvement
- Compact circuit size, compressed from the model of the entire multi-layer power, ground, and/or signal connections
- Generates SPICE models of chip I/O signals coupled to power/ground to be used in chip/package/board analysis of high-speed channels and buses
- Includes MCP model header for easy connectivity to package and IBIS models
- Generated models include effects from TSVs
Resource Library
Press Releases (2627)
- Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets | Cadence
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- Cadence Achieves PCIe 5.0 Specification Compliance for PHY and Controller IP in TSMC Advanced Technologies | Cadence
- Cadence Announces $100 Million Accelerated Share Repurchase Agreement | Cadence
- Cadence 射频集成电路解决方案支持TSMC N6RF 设计参考流程 | Cadence
- Cadence Design IP portfolio in TSMC’s N5 Process Gains Broad Adoption Among Leading Semiconductor and System Companies | Cadence
- Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes | Cadence
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- Cadence’s John Wall and Richard Gu to Present at Berenberg Conference in London | Cadence
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- Cadence’s John Wall and Richard Gu to Present at Bank of America Conference | Cadence
- Cadence与F1方程赛迈凯伦车队合作掀开新篇章 | Cadence
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- Cadence Announces First Quarter 2022 Financial Results Webcast | Cadence
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- Cadence Selected by Microsoft for RAMP Phase II Program | Cadence
- Cadence 与 GlobalFoundries 携手合作，推进硅光电 IC 设计 | Cadence
- Cadence 凭借 3D-IC 设计获得TSMC OIP 生态系统论坛客户选择奖 | Cadence
- Cadence’s John Wall and Nimish Modi to Present at Berenberg Conference | Cadence
- Cadence Reports Fourth Quarter and Fiscal Year 2021 Financial Results | Cadence
- Cadence 和 Dassault Systèmes 携手合作，转变电子系统开发方式 | Cadence
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- Cadence Appoints Mary Louise Krakauer to Board of Directors | Cadence
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- Cadence Palladium Z2 仿真平台支持 Microchip 数据中心 SoC 提速开发 | Cadence
- Light 选用 Cadence Tensilica Vision Q7 DSP 增强新一代 ADAS 系统，提升深度感知能力 | Cadence
- Cadence Announces Fourth Quarter and Fiscal Year 2021 Financial Results Webcast | Cadence
- Butterfly Network 应用 Cadence Clarity 3D Solver 实现先进移动超声设计 | Cadence
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- Cadence 与TSMC和Microsoft扩大合作，以加速云端千兆级设计的时序签核 | Cadence
- Cadence’s Anirudh Devgan and John Wall to Present at the Wells Fargo TMT Summit | Cadence
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- Samsung Foundry 选择 Cadence Liberate Trio Characterization Suite 用于 3纳米工艺库 | Cadence
- Samsung Foundry 选择全新 Tempus SPICE 级精度老化分析用于高可靠性应用 | Cadence
- Cadence’s Anirudh Devgan and John Wall to Present at the Berenberg US CEO Conference | Cadence
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Presentation (403)
- Samsung Foundry AMS Design Reference Flow - Advanced Node
- High-Level Synthesis Will Supercharge Your IP Development
- HLS-Based Design Space Exploration for Low-Power Designs
- Streamlined Foundry-Compatible Custom Photonic IC Design with Ansys-Lumerical, Cadence Virtuoso Environment, and Tower Semiconductor’s Foundry PDK
- Silicon-Validated RFIC/Package Co-Design Using Virtuoso RF Solution in Tower Semiconductor’s CS18 RF SOI Technology
- 48V 250A FET PCB Thermal Profile - A Thermal Simulation Using Celsius Thermal Simulator's 2D and CFD Airflow Analysis
- Application of Virtuoso CurvyCore Technology in the Development of Photonic Elements for a Foundry Process Design Kit (PDK)
- Voltus-Fi Custom Power Integrity Solution’s Electromigration Analysis and Self Heating Flow for FinFET and Silicon Photonics PDKs
- Solving Analog Mysteries Inside A Digital Cockpit
- Spectre X: Speed with Accuracy to Meet Growing Circuit Simulation Demand
- Current Data-Driven Analog Routing Using Virtuoso SDR
- Reimagining 3D FEM Extraction with Clarity 3D Solver
- On the Silicon Photonics Physical Design’s Productivity and Reliability Enhancement
- 5G/6G時代のプリント基板設計に活かす Clarity 3D Transientの適用例
- 電波天文用受信機フロントエンドとマイクロ波帯超伝導増幅デバイスの研究開発
- Ka帯RFIC設計へのEMXの電磁界解析適用事例
- サインオフツール(Tempus/Pegasus)最新アップデート - Tempus Robustness ApproachとPegasus SmartVerifyについて-
- ケイデンスDynamic Duoと新製品Palladium Z2/ProtiumX2の実力 - なぜケイデンスは次世代システムを同時に発表したケイデンスDynamic Duoと新製品Palladium Z2/ProtiumX2の実力 - なぜケイデンスは次世代システムを同時に発表したのか！
- テンシリカIPを用いたプレ・シリコンデザインフローにおける電力・エナジー最適化のためのアーキテクチャ探索
- 大規模複雑化するSoC開発におけるソシオネクストの検証ソリューション ～ポリバレントな活躍をするPalladium Z1～
- FPGAプロトタイピング導入でシステム検証を高速化！ ~ルネサスのProtium活用事例の紹介～
- Indago Python APIを利用したPythonモデルとRTLの等価性検証事例
- 高品質なタイミング制約をスマートに作成！ ルネサスの高効率・網羅的タイミング制約検証とは
- プロセッサ開発でRTL設計者が使うデジタル設計フルフロー ～設計者も二刀流！？新時代のRTL設計スタイル～
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- 能動的推論による強化学習のエッジデバイス実装に向けて
- OMNIS－メッシュ生成から解析までを一つの環境に
- Arm CMN-600/Neoverse N1搭載デザインの大規模・高速設計事例紹介
- 導入に向けた障壁を排除し生産性を向上させるCadence Cloudのご紹介
- スーパーコンピュータ「富岳」によるボックスファン設計最適化の試験計算
- Architecture Trends for Sensing and Computing to Enable Autonomous Driving
- Useful Utilities and Helpful Hacks
- Design and Performance Consideration of Silicon Interposer, Wafer-Level Fan-Out and Flip Chip BGA Packages
- Accelerating EDA Productivity: The Why, What and How of the Journey to the Cloud
- Designing Planet-Scale Video Chips on Google Cloud
- Omnis, from Meshing to Solving to Optimization, in One Single Multiphysics Environment
- Cloud-Scale Productivity Without the Complexity—Have Your Cake and Eat It, Too!
- Using Sigrity Technology to Address USB 3.1 Signal Integrity Compliance
- A Reference Flow for Chip-Package Co-Design for 5G/mmWave Using Assembly Design Kit (ADK)
- Priority on Power: How & Why to Start with “Power First” for PCB Implementation
- A Dive into DDR5 – Whats New, What Changed, and How Do we Model it All
- Cadence and Deca Chip(let) Solutions with Adaptive Patterning
- A New Way to Tackle System-Level Power Integrity Analysis
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Datasheet (179)
- Ten Reasons to Optimize a Processor
- ConnX Family of Radar, Lidar, and Communications DSPs
- Dual-Role Device Controller IP for USB 3.1
- Denali High Speed GDDR6 PHY IP TSMC 6nm/7nm
- DDR5/4 PHY IP for TSMC 16nm
- Denali Controller IP for DDR
- Tempus Timing Signoff Solution
- Integrity 3D-IC Platform Datasheet
- Pegasus Design Review Environment
- Memory and I/O Adapter for Palladium Z1 Platform
- 112Gbps Long-Reach SerDes IP for TSMC 5nm
- 40Gbps D2D PHY IP for TSMC 5nm FinFET
- 112Gbps XSR SerDes IP for TSMC 7nm FinFET
- RX Controller IP for MIPI CSI-2 v2.1
- 56Gbps Long Reach SerDes IP for TSMC 7nm
- TX Controller IP for MIPI DSI
- Design IP for MIPI D-PHY for TSMC
- TX Controller IP for MIPI CSI-2 v2.1
- Denali High-Speed DDR PHY IP for UMC 28HPC+
- Assura Physical Verification
- 64GTps PHY IP for PCIe 6.0 for TSMC 5nm FinFET
- DDR4/3L PHY IP for TSMC 7nm
- 5G Systems with AWR Software 产品手册
- AWR AXIEM Planar 3D System Analysis 产品手册
- AWR Analyst Full 3D Finite Element Method EM Analysis Software 产品手册
- AWR Visual System Simulator产品手册
- Spectre FX Simulator产品手册
- Integrity 3D-IC 平台产品手册
- 112Gbps ELR SerDes IP for TSMC 7nm and 6nm
- 112Gbps ELR SerDes IP for TSMC 5nm
- UMS PDKs
- 10Gbps Multi-Link and Multi-Protocol PHY IP SMIC
- 5G Systems with AWR Software
- DDR4/3/3L, LPDDR4/3 PHY IP for TSMC 16nm/28nm
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White Paper (154)
- Thermally Optimizing a High-Power PCB
- How High-Level Synthesis Was Used to Develop an Image-Processing IP Design from C++ Source Code White Paper
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- How ML Enables Cadence Digital Tools to Deliver Better PPA
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- Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
- Sigrity X - Redefining Signal and Power Integrity
- Designing High-Performance Electronics for Today’s Hyperconnected Systems
- Addressing the Challenge of Verifying System-Level Performance
- 800G Ethernet MACsec Integration and Verification White Paper
- Fixed-Point and Floating-Point FMCW Radar Signal Processing with Tensilica DSPs
- Enhancing Desktop Virtualization Platforms with Configurable IP Cores
- How Design IP Can Accelerate and Simplify Development of Enterprise-Level Communications and Storage Systems
- High-Level Low-Power System Design Optimization
- Accelerate Adoption of High-Speed, Low-Latency, Cache-Coherent Standards Using Formal Verification
- Pushing the Envelope with PCIe 6.0: Bringing PAM4 to PCIe
- Emergence of Segment-Specific DDRn Memory Controller and PHY IP Solution
- How IP Drives More Integrated Features in Mobile Systems
- Supporting Advanced-Node FinFET SoCs with 16Gbps Multi-Protocol SerDes PHY IP
- Chiplets and Heterogeneous Packaging Are Changing System Design and Analysis
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- Optimize Designs and Mitigate Thermal Threats in High-Current Automotive Applications
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- Bringing Clarity 3D Solver EM Analysis of Complex Systems to the Cloud
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Customer Presentation (88)
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Video (2130)
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- Club Formal Europe 2021 - Deep Dive: Addressing Security Verification Requirements with JasperGold® SPV App
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- Improve CFD Efficiency with Solution-Based Mesh Adaptation
- Why Meshing Complex Geometries Has Never Been so Easy... and Fast and Cost-Effective!
- Release of Pointwise Reduces Meshing Turnaround Time by Up to 2x
- Unstructured Viscous Boundary Layer Meshing: T-Rex
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- Hyperscale Computing and Cadence
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- Application of Virtuoso CurvyCore Technology in the Development of Photonic Elements for a Foundry Process Design Kit (PDK)
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- NVIDIA 采用突破性创新技术，Dynamic Duo 2.0
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- Cadence Cerebrus Automated ML Chip Design Technology Overview
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- AERONAUTICS DESIGN SOLUTIONS - PART 3: FULL AIRCRAFT MESHING AND SIMULATION WITHIN OMNIS™
- RANK-N NONLINEAR HARMONIC METHOD
- Cadence PCIe 4.0 Receiver JTOL Test
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Webinar (265)
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- What’s New in Clarity 2022.1
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- Accelerating Complex SoCs Prototyping with Protium X2
- Webinar: From Design to Real RF Device – Connecting EDA Simulation and Hardware Test
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- End-to-End Aerodynamics CFD Simulation of a Car
- DEMOCRATIZATION OF THE NONLINEAR HARMONIC METHOD FOR TURBOMACHINERY
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- Rank-N Nonlinear Harmonic Method
- Designing Rotating Machinery 20X Faster
- Working with Dirty CAD While Meshing a Naval Ship Hull
- CFD Wind Study for Ship Superstructures
- Catenary Approach for Cable Modeling in Hydrodynamic Applications
- Mesh Strategies for the FDA Benchmark Centrifugal Blood Pump
- Structured Grid for an Aneurysm
- Turbulence Model Influence on Flow in the FDA Benchmark Model
- CadenceTECHTALK: Tips and Tricks for Resolving Common SI/PI Problems
- Optimizing Thermal Management Design of Electric Vehicles Using CFD Simulation
- Localized Remeshing Strategies for Parametric Models in Pointwise
- The Stanford Solar Car Project's Race for Aerodynamic Efficiency
- Using T-Rex to Generate Unstructured Hexahedra for an Automotive Intake - Part 2
- Mesh and Run a High-Fidelity Aircraft Simulation in Minutes
- Aeronautics Design Solutions - Part 3: Full Aircraft Meshing and Simulation Within OMNIS™
- Rapid Viscous CFD Mesh Generation for Propellers
- How T-Rex Unstructured Meshing Aids Transonic Aircraft Drag Reduction
- Automated Meshing and Adaptive Re-Meshing at Bombardier
- CadenceTECHTALK: Simulation of Hydraulic Turbines with Omnis CFD Platform
- Club Formal Europe 2021 - Deep Dive: Addressing Security Verification Requirements with JasperGold® SPV App
- Club Formal Europe 2021 - Deep Dive: Advanced Proof Management with Proof Structure App
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- Improve CFD Efficiency with Solution-Based Mesh Adaptation
- Why Meshing Complex Geometries Has Never Been so Easy... and Fast and Cost-Effective!
- Unstructured Viscous Boundary Layer Meshing: T-Rex
- Automating Viscous Meshing for a Transonic Aircraft Model Using Glyph Scripting
- CadenceTECHTALK: How to Sign Off a 10 Billion+ Transistor Design in the Cloud
- Power and Energy Optimization Using Tensilica IP
- CadenceTECHTALK: Boost LPDDR5 Verification from IP to System Level
- CadenceTECHTALK: Xcelium ML for 5X Faster Regression Throughput
- CadenceTECHTALK: Taming the Challenges of Advanced Node Digital Designs
- Intelligent Cross-Platform Workflows for RF PCB Integration
- High-Order Mesh Generation Using Pointwise
- AERONAUTICS DESIGN SOLUTIONS - PART 3: FULL AIRCRAFT MESHING AND SIMULATION WITHIN OMNIS™
- RANK-N NONLINEAR HARMONIC METHOD
- CadenceTECHTALK: Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation
- CadenceTECHTALK: Thermal Analysis for MMIC and RF PCB Power Applications
- Integrated SI Analysis, Optimization, and Signoff of a 3D-IC System with Cadence Multi-Physics System Solvers
- CadenceTECHTALK: Integrated PI Analysis and Signoff of a 3D-IC System with Cadence Multi-Physics Solvers
- Why a Row-Based Methodology is Required for Sub-10nm Custom Layout
- CadenceTECHTALK: Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
Conference Paper (161)
Financial Report (115)
- 2018 Annual Report
- CDNS Q1 2022 Earnings Conference Call Prepared Remarks
- Cadence First Quarter 2022 Earnings Tables
- Cadence First Quarter 2022 8-K Schedules
- CFO Commentary Q1 2022
- CDNS Q4 2021 Earnings Conference Call Prepared Remarks
- Cadence Fourth Quarter 2021 Earnings Tables
- Cadence Fourth Quarter 2021 8-K Schedules
- CFO Commentary Q4 2021
- CDNS Q4 2019 Earnings Conference Call Prepared Remarks
- CDNS Q3 2021 Earnings Conference Call Prepared Remarks
- CFO Commentary Q3 2021
- Cadence Third Quarter 2021 Earnings Tables
- Q3 2021 8-K Schedules
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