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数字设计与签核
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
定制 IC/模拟/ RF 设计
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
系统设计与验证
Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.
IP
An open IP platform for you to customize your app-driven SoC design.
IC 封装设计与分析
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
系统分析
Cadence® system analysis solutions provide highly accurate electromagnetic extraction and simulation analysis to ensure your system works under wide-ranging operating conditions.
嵌入式原型验证
PCB 设计与分析
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
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强大的物理封装设计工具
IC 封装设计
Cadence® Allegro® Package Designer Plus 和 OrbitIO™ Interconnect Designer 提供了世界一流的跨平台设计规划、优化以及单裸片和多裸片的先进封装与模块布局平台。对于当今大多数封装设计而言，由于在半导体封装的复杂程度和性能指标不断提高的同时设计资源却保持不变，这大大提高了效率和生产率的难度。Cadence 封装实现工具可实现自动化和精准度，在综合环境中加快设计过程，包括全面的电气和热分析以及 IC/封装协同设计。