OrbitIO Interconnect Designer

The Cadence^® OrbitIO^™ Interconnect Designer helps plan and manage system connectivity for complex multi-fabric designs, especially in the context of interposer/2.5D and 3D-IC packaging. It offers a single canvas solution to bring together multiple fabrics such as chips, packages, boards, and interposers to build the connectivity and stack of these designs. It also interfaces with state-of-the-art Cadence Allegro^® Package Designer Plus, Innovus^™, and Virtuoso^® implementation platforms, continuing the design planning from the initial stage into system-optimized individual design tapeouts. With the OrbitIO Interconnect Designer, you can better qualify the design definition prior to implementation, leading to more predictable system cost, performance, and product delivery.

Features/Benefits

• Parametric definition and editing of bump and ball pad patterns
• Automatic ratio-driven signal, power, and ground pin allocation
• Pin-based floorplanning of critical nets and interfaces
• Automatic net mapping and propagation across fabrics, including differential pairs
• Route bundles and flow planning for detailed connection assignment
• Rapid route feasibility analysis to evaluate escape routes of bumps and balls
• Direct integration with Allegro Package Designer Plus and Allegro PCB Editor to exchange planning data and accelerate implementation
• Utilize key PCB components to influence package ball pad assignments
• Better predict cost and performance using well-qualified design definitions
• Quickly generate design abstractions in response to marketing feasibility studies
• Clearly communicate design intent and route plan to external design resources
• Design tool compatibility with outsourced assembly and test (OSAT) providers