The Cadence® OrbitIO™ Interconnect Designer helps plan and manage system connectivity for complex multi-fabric designs, especially in the context of interposer/2.5D and 3D-IC packaging. It offers a single canvas solution to bring together multiple fabrics such as chips, packages, boards, and interposers to build the connectivity and stack of these designs. It also interfaces with state-of-the-art Cadence Allegro® Package Designer Plus, Innovus™, and Virtuoso® implementation platforms, continuing the design planning from the initial stage into system-optimized individual design tapeouts. With the OrbitIO Interconnect Designer, you can better qualify the design definition prior to implementation, leading to more predictable system cost, performance, and product delivery.