Using spreadsheets for pin and net assignments is a thing of the past as multi-substrate interconnect exploration, definition, and design can now be done in Cadence’s integrated solution: Cadence® OrbitIO™ Interconnect Designer and Allegro® Package Designer Plus SiP Layout Option.
Multi-fabric planning during the early stages of design can greatly improve predictability during implementation by finding and fixing cross-fabric issues before they become late-stage surprises. Cadence co-design solutions provide visibility into adjacent fabrics and improve cross-team communications by providing immediate system feedback to decisions made on an individual substrate basis. Cadence co-design solutions may be employed from the earliest stages of planning through detailed implementation as part of an integrated environment encompassing silicon, package, and PCB.