为了帮助您打造高质量、差异化的电子产品，Cadence 提供了诸多工具，以解决与定制集成电路、数字化、集成电路封装以及 PCB 设计和系统级验证有关的一系列挑战。找到所需的工具和方法来达成您的功耗、性能和面积目标；克服混合信号设计的限制；实现更快的设计收敛等等。
Our next system-on-chip (SoC) projects will be on a 16nm process, and the Innovus Implementation System can enable much larger blocks than previously possible, decreasing area and top-level complexity.
Debashis Basu, SVP Engineering, Silicon and Systems Engineering, Juniper Networks
The Palladium Z1 platform uniquely met our requirements due to its reliability as a datacenter compute resource, offering advanced multi-user capabilities and scalability from small four-million-gate verification payloads to multi-billion gate designs.
Daniel Diao, Deputy General Manager of the Turing Processor Business Unit, Huawei
Electrically aware design can enable us to save several iterations on the design of each block sensitive to parasitic effects. Depending on block complexity, design time savings can range from half a day to several days per block.
Martin Kejhar, Senior Technical Staff Engineer and Scientist, ON Semiconductor