overview
A Depth of Knowledge and Experience to Meet the Challenges Automakers Face
The automotive industry is rapidly evolving, and autonomous and electric vehicles are some of the fastest-growing applications in the automotive industry. Today’s vehicles are now moving toward new vehicle architectures to address the compute and in-vehicle networking bandwidth requirements. This will drive complex and consolidated electronic control units (ECUs) running at giga-Hertz frequencies that need to be designed and optimized for scalability, performance, power efficiency, thermal, and EMI robustness.
Key Benefits
Advanced Tools and Flows Specifically for Automotive SoCs, Packages, Boards, and Systems
Highly Automated
Integrated functional safety flows, from FMEDA to safety-aware implementation
Chiplet Solution
Most comprehensive solution for heterogeneous chiplet-based SoC design
Scalable
High-performance multi-core DSP and AI platform for automotive
End-to-End Solutions
Seamless design flows from chip to package to board and systems
ISO 26262 TCL Compliant
Fit for use with ASIL A through ASIL D automotive design projects
Advanced Node
Innovative IC design tools and flows supporting the latest process technologies down to 3nm
Automotive Functional Safety Document Kits
Cadence is the first EDA supplier to earn the "Fit for Purpose - Tool Confidence Level" certification up to TCL3, for ISO standards, supporting automotive design from ASIL A through ASIL D.
Offerings
Helping the Automotive Industry Make Cars Safe, Secure, Reliable, and Efficient
Generative AI
In today’s world, technology is evolving at an unprecedented pace. Artificial intelligence (AI) has emerged as a major driving force behind this evolution. AI is transforming the way we interact with technology, from our smartphones to our vehicles.
Cadence.AI offers unique solutions for automotive chip and system design. Our solutions include AI-powered IC and SoC design, verification, PCB design, and multiphysics analysis. By harnessing the power of AI, we are ushering in a new era of AI IP and chip creation.
System Analysis
The demand for high-performance electronic systems is rising due to their increasing complexity and density. Designers must guarantee that the chip or ECU operates seamlessly within the complete system of the vehicle. To ensure this, an integrated analysis that covers multiple areas such as thermal, radio frequency, electromagnetic, signal integrity, power integrity, and fluid dynamics is essential. This thorough analysis ensures that the system is verified at all levels, ranging from the chip to the board to the ECU.
Computational Fluid Dynamics
The possibilities for optimizing vehicles are almost endless, from external aerodynamics and acoustics to engine efficiency, electrification, and comfort. Cadence CFD tools can be utilized for a variety of purposes to accommodate multiple simulation requirements, at the necessary speed and accuracy levels. They offer quick results, ensuring that project timelines are met while allowing for the exploration of design enhancements.
ECU Design
The automobile has always presented challenges for electronic design and signal accuracy. With the increasing complexity of electronic control systems, higher computing performance, faster data rates, and fewer ECUs per car, modern ECUs face significant design, integration, and verification challenges. Cadence is the only company that provides integrated design tools for IC package and PCB design and analysis, ensuring a cohesive and integrated ECU design and analysis.
SoC Design
The complexity of automotive SoCs and systems is continuously increasing due to AD and chip/system consolidation. It is expected that both monolithic and chiplet-based SoCs will need to utilize the most advanced process technologies that are qualified for automotive purposes. For this reason, Cadence IC, packaging and IP solutions offer complete, integrated, and silicon-proven design flows for custom/analog, digital, and mixed-signal SoCs. This is to ensure that automotive designers meet the demanding standards for quality, reliability, and safety.
Chiplets
The integration of multiple heterogeneous on-package chiplets makes it easier to combine 2D and 2.5D dies from different sources, fabs, designs, and packaging technologies. This on-package mix and match of components for SoC construction is made possible by the Cadence UCIe PHY, Controller, and VIP, while leading 3D-IC tools provide designers with the full capability to improve PPA, increase performance, and close timing for multi-chiplet designs using advanced or standard packages.
Automotive IP
Cadence provides a broad IP portfolio for ADAS, connected vehicles, digital cockpit, and in-vehicle networking, enabling IP-to-SoC development in a system context. With Cadence IP, you can concentrate your internal effort on innovation, focus on leveraging multi-function cores with confidence, and boost your designs with less risk and faster time to market.
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