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  • 产品

    • Products

      Cadence.AI

      • Millennium Platform

        AI-driven digital twin supercomputer

      • Cadence Cerebrus AI Studio

        Multi-block, multi-user SoC design platform

      • Optimality Intelligent System Explorer

        AI-driven Multiphysics analysis

      • Verisium Verification Platform

        AI-driven verification platform

      • Allegro X AI

        AI-driven PCB Design

      • Tensilica AI Platform

        On-device AI IP

    • Products

      IC 设计和验证

      • Virtuoso Studio

        Analog and custom IC design

      • Spectre 仿真

        Analog and mixed-signal SoC verification

      • Innovus+ Platform

        Synthesis and implementation for advanced nodes

      • Xcelium Logic Simulation

        IP and SoC design verification

      • Silicon Solutions

        Protocol IP and Compute IP, including Tensilica IP

      • Palladium 和 Protium

        Emulation and prototyping platforms

    • Products

      System Design & Analysis

      • Allegro X Design Platform

        System and PCB design platform

      • Allegro X Adv Package Designer Platform

        IC packaging design and analysis platform

      • Sigrity X Platform

        Signal and power integrity analysis platform

      • AWR Design Environment Platform

        RF and microwave development platform

      • Cadence Reality Digital Twin Platform

        Data center design and management platform

      • Fidelity CFD Platform

        Computational fluid dynamics platform

    • All Digital Design and Signoff Products
    • All PCB Design Products
    • All Verification Products
    • All Molecular Simulation Products
    • All Cadence Cloud Services and Solutions
    • All Products (A-Z)
    • All Analog IC Design Products
    • All 3D-IC Design Products
    • All 3D Electromagnetic Analysis Products
    • All Thermal Analysis Products
  • 解决方案

    产业方案

    • 5G系统与子系统

    • 航空航天与防御

    • 汽车电子解决方案

    • Data Center Solutions

    • 超大规模计算

    • 生命科学

    Services

    • Services Overview

    • Chiplet Design Services

    • Custom Silicon Services

    技术方案

    • Artificial Intelligence

    • 3D-IC设计

    • Advanced Node

    • Arm-Based Solutions

    • Chiplets

    • Cloud 解决方案

    • Computational Fluid Dynamics

    • Functional Safety

    • 低功耗设计

    • 混合信号设计

    • Molecular Simulation

    • Multiphysics System Analysis

    • Photonics

    • 射频/微波

    Designed with Cadence See how our customers create innovative products with Cadence
    Explore Cadence Cloud Now Explore Cadence Cloud Now
  • 支持与培训

    技术支持

    • 技术支持流程

    • 线上技术支持

    • 软件下载

    • 计算平台支持

    • 售后支持联络

    • 技术论坛

    • OnCloud Help Center

    • Doc Assistant

    培训

    • Computational Fluid Dynamics

    • 定制IC/模拟/设计

    • Digital Design and Signoff

    • IC封装

    • 设计语言及方法学

    • Mixed-Signal Design Modeling, Simulation, and Verification

    • Onboarding Curricula

    • PCB设计

    • Reality DC

    • 系统设计与验证

    • Tech Domain Certification Programs

    • Tensilica处理器IP

    Link for support software downloads Stay up to date with the latest software
    Cadence award-winning online support available 24/7
    Connect with expert users in our Community Forums
  • 公司

    公司介绍

    • 关于我们

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    • 投资者关系

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    • Computational Software

    • Alliances

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    • Technology Partners

    • 公司社会责任

    • Cadence大学计划

    • Intelligent System Design

    企业文化与职业

    • Cadence文化与多样性

    • 招贤纳士

    • One Team

    • Intern and Grads

    媒体中心

    • 会议活动

    • 新闻中心

    • 博客

    Cadence Giving Foundation
    Premier Cadence Events

Solutions

Comprehensive Solutions and Methodologies

Your design challenges involve much more than a point-tool solution. That's why Cadence works on solutions for your most challenging problems at a sub-system or system level. You can benefit from the work we've done by exploring the sections below.

3D-IC Design

Enabling maximum functionality in a small form factor

LEARN MORE

5G Systems and Subsystems

Proven IP and design tools to speed challenging 5G designs

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Advanced Node

Proven design flows at 10nm and below

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Aerospace and Defense

Helping you achieve first-pass success

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Arm-Based Solutions

Making whole systems possible

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Artificial Intelligence

Embrace the agentic AI transformation to redefine what's possible

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Automotive Solutions

Making cars safer and more reliable

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Cadence Cloud Portfolio

The future of electronic design

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Chiplet

Addressing ever-increasing compute demands in the physical AI era

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Computational Fluid Dynamics

Accelerated CFD multidisciplinary simulation platform

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Data Center Solutions

Design and operate sustainable data centers

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Functional Safety

Analog and digital full flows for FMEDA-driven functional safety design and verification

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Generative AI in Intelligent System Design

Making complex designs possible

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Hyperscale Computing

Enabling compute from sensors through edges to the data center

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Life Sciences

Improving lives through computational molecular design

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Low Power

Every step of the design flow optimized for power

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Mixed Signal

Comprehensive, interoperable, and proven verification and implementation

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Multiphysics Systems Analysis

Solving electromagnetic, electronics, thermal, computational fluid dynamics (CFD), and electromechanical simulation challenges to ensure your system works under wide-ranging operating conditions

Learn More

Photonics

Integrated design automation environment

LEARN MORE

RF/Microwave Solutions

Enabling the development of high-performance front-end components for wireless systems

Learn More
Customers

Due to the Palladium Z1 platform's capacity to handle our billion gate-class designs and its highly sophisticated debug and advanced multiuser capabilities, all in a small form factor, we will be able to design and deliver our next generation GPU and Tegra designs with high quality and on schedule.

Narenda Konda, Director of Engineering, NVIDIA

Read More or View All Customers

Processors for automotive and industrial markets are driving higher levels of integration and complexity. This requires larger design partitions to deliver the efficiencies and time to market demanded by our customers.

Anthony Hill, Director of Processor Technology, Texas Instruments

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Electrically aware design can enable us to save several iterations on the design of each block sensitive to parasitic effects. Depending on block complexity, design time savings can range from half a day to several days per block.

Martin Kejhar, Senior Technical Staff Engineer and Scientist, ON Semiconductor

Read More or View All Customers
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