Overview

De-Risk Your Custom Silicon Design by Partnering with Silicon Engineering Experts at Cadence

With the increasing complexity of today’s designs and the demands from investors and stakeholders, it is increasingly evident that our customers are under more pressure to meet their PPA goals within a limited time to market.

Custom Silicon Services diagram

Technologies

Our World-Class Custom SoC Services

Our unique, broad-based solution offers expertise starting from architecture, custom silicon design, verification, design for test (DFT), place and route (P&R), tapeout, post-silicon assembly, test, and foundry-related services. Additionally, we help with package design, probe card, ATE load board, burn-in board test programs, and test hardware development.

  • Augmented SoC architecture to include more features
  • Skip the prototype phase to get to market faster
  • Custom Silicon Services helps optimize your costs
  • Increase performance with access to top engineering talent (PPA)
  • Services Flow and Ecosystem Partnership helps you focus on core strengths
  • Streamline customer supply chain and contracting complexity
  • Embedded software, firmware, and OS porting under one roof
  • Our unique capability is spec-to-parts services
World Class Custom Silicon Services: Unique and Flexible diagram

Flexible Engagement

The Key to Your Success

At Cadence, we understand that each customer has different needs. You may want to start with a specification and get a GDSII out, or you may have your netlist, and you want to get back your tested parts. Whatever your needs may be, we can engage as per your requirements.

Cadence Competitive FLEXIBILITY Advantages:

  • ‘Start’ from either Spec, RTL, Netlist. ‘End’ with GDS, Package design, SOC Wafer, or Tested Parts
  • Leverage technical domain expertise
  • Vertical market expertise
  • Existing foundry, packaging, and Tester relationships
  • Track record of successful engagements
Cadence Competitive Flexibility diagram

Service Offerings

Offer the Most Comprehensive Suite of Services

The services we offer can be categorized into three specific areas:

Suite of Services

Core Serivces, Software Services, and Post GDSII Services diagram
  • Core Services: Front-End, Physical Design, Systems, SoC, Enablement, and Methodology IP
  • Post-GDSII Services: Tapeout to Production Operations
  • Software Services: Embedded Software, Firmware, OS Porting

Core Services

Front End Design Services

  • SoC Architecture Exploration
  • SoC Spec-RTL Development
  • Functional Safety Enablement
  • System Integration and Verfication

Physical Design Services

  • Design For Test (DFT)
  • Physical Design and Signoff

Systems SoC, and Enablement Services

  • Design IP
  • Emulation and Prototyping
  • Design Enablement
  • 3D-IC Packaging, and Board Design
  • Virtual Prototyping

Post-GDSII Services

Tapeout to Production Operations

  • Seasoned Operations Team 
  • Advanced Package Design 
  • Foundry Relationships 
  • OSAT Relationships 
  • Device Characterization

Software Services

Embedded Software, Firmware, OS Porting

  • Embedded Software
  • Firmware Development
  • AI/ML Platform Development
  • Audio/Video/Radar Platforms
  • OS Porting(Tensilica, 3rd-Party, etc)

Next Steps

Ready to Get Started?

Ecosystem Partnerships

Tapeout to Production Ecosystem Partnerships

The Cadence Ecosystem partnership provides a credible and reliable partner for your silicon engineering requirements.

We have successfully delivered millions of parts to our customers with the help of our complete ecosystem.